Nexperia USA Inc. 74LVC2G38DC,125

Overview

74LVC2G38DC,125 from Nexperia is a dual 2-input NAND gate with open-drain outputs, designed for level translation between 3.3 V and 5 V logic domains in mixed-voltage systems. It features Schmitt-trigger inputs for noise immunity, IOFF partial power-down protection, and operates across 1.65 V to 5.5 V supply range with -40 °C to +125 °C temperature rating. Used in I²C bus pull-up interfaces and voltage-level shifting circuits.

For engineers reviewing the 74LVC2G38DC,125 datasheet, 74LVC2G38DC,125 pinout, 74LVC2G38DC,125 application, or 74LVC2G38DC,125 equivalent, key selection criteria include open-drain drive capability (±24 mA at 3.0 V), 5 V-tolerant inputs/outputs, IOFF-enabled power sequencing, and VSSOP8 package compatibility with high-density PCB layouts.

Technical Context

This device implements two independent NAND gates, each with open-drain output requiring external pull-up resistors. The Schmitt-trigger input thresholds provide hysteresis (typ. 0.3 V at 3.3 V), enabling robust operation with slow-rising signals from microcontrollers or sensors.

IOFF circuitry actively disables both outputs when VCC = 0 V, blocking backflow current during hot-insertion or partial system power-down-critical for PCIe slot interfaces and modular industrial controllers where rail sequencing matters.

Key Specifications

Pinout & Package

VSSOP8 package (SOT765-1): plastic very thin shrink small outline, 8 leads, body width 2.3 mm, lead pitch 0.5 mm, pin 1 indicator at lower-left corner below marking "Y38".

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual NAND gate applications.

Compared with SN74LVC2G38DCKR, the 74LVC2G38DC,125 saves 23% PCB area and improves thermal performance in compact industrial controllers; versus 74LVC2G00DC,125, it adds critical open-drain flexibility and IOFF safety for modular systems.

Availability

74LVC2G38DC,125 is available at Aetrix Electronics and suitable for industrial sensor interfaces, I²C bus expansion, hot-swappable module control, and programmable logic glue requiring stable component supply across extended temperature ranges.

Supply support for 74LVC2G38DC,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance logic, discrete, and MOSFET solutions optimized for efficiency, reliability, and miniaturization in industrial and automotive applications.

The 74LVC series targets low-voltage, high-speed CMOS logic design with emphasis on mixed-voltage interoperability, power-aware operation, and robustness in harsh environments.

FAQ

Can 74LVC2G38DC,125 be used as a level shifter between 1.8 V and 5 V logic?

Yes. Its inputs tolerate up to 5.5 V regardless of VCC, and its open-drain outputs can be pulled up to any voltage ≤5.5 V. When powered from 1.8 V, it accepts 5 V inputs and drives a 5 V pull-up - satisfying bidirectional level translation per JEDEC JESD8-7 and JESD36 standards.

Does the IOFF feature require external control signals?

No. IOFF is fully automatic and requires no external enable/disable pin. It activates whenever VCC drops to 0 V, disabling both outputs and limiting leakage to ±2 μA - ensuring safe hot-plug operation without firmware or hardware intervention.

What is the maximum capacitive load the 74LVC2G38DC,125 can drive at 400 kHz I²C speeds?

At VCC = 3.0 V, the device sinks 24 mA with VOL ≤ 0.55 V. Using the I²C specification's 3 mA sink limit and 0.4 V VOL threshold, it supports up to 400 pF total bus capacitance - sufficient for 10–15 standard I²C slaves on a 10 cm trace.

Is the VSSOP8 package (SOT765-1) compatible with reflow soldering per IPC-J-STD-020?

Yes. The SOT765-1 package is rated for standard lead-free reflow profiles (peak 260 °C, 20–40 sec). Its 0.5 mm pitch and 2.3 mm body width meet IPC Class 2 and Class 3 assembly requirements, with documented thermal resistance (RθJA = 220 K/W) validated per JEDEC JESD51-2.