Nexperia USA Inc. 74LVC2G38GM,125

Overview

74LVC2G38GM,125 from Nexperia is a dual 2-input NAND gate with open-drain outputs, designed for level translation between 3.3 V and 5 V logic domains. It features Schmitt-trigger inputs for noise immunity, IOFF partial power-down protection, and operates across 1.65 V to 5.5 V supply. Used in I²C bus pull-up interfaces, GPIO expansion logic, and mixed-voltage sensor interface circuits.

For engineers reviewing the 74LVC2G38GM,125 datasheet, 74LVC2G38GM,125 pinout, 74LVC2G38GM,125 application, or 74LVC2G38GM,125 equivalent, key selection criteria include open-drain drive strength (±24 mA at 3.0 V), IOFF-enabled backflow prevention during power sequencing, Schmitt-trigger input hysteresis, and guaranteed operation from –40 °C to +125 °C.

Technical Context

This device implements two independent NAND gates, each with open-drain output requiring external pull-up. Inputs tolerate up to 5.5 V regardless of VCC, enabling bidirectional voltage translation without direction control logic. The IOFF circuit disables both outputs when VCC = 0 V, blocking current flow through powered-down sections of a system.

Schmitt-trigger inputs provide 0.3–0.4 V hysteresis (depending on VCC), allowing reliable operation with slow-rising signals such as those from mechanical switches or long PCB traces. Propagation delays range from 0.5 ns (VCC = 5.5 V) to 10.8 ns (VCC = 1.65 V, –40 °C to +85 °C), supporting timing-critical low-voltage control paths.

Key Specifications

Pinout & Package

XQFN8 package (SOT902-2): plastic ultra-thin quad flat no-lead; 8 terminals; body size 1.4 × 1.2 × 0.45 mm; exposed thermal pad; lead pitch 0.5 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual open-drain NAND gate applications.

Compared with SN74LVC2G38DCUR and 74LVC2G38GT,125, the 74LVC2G38GM,125 delivers superior thermal management via its exposed pad and supports higher sustained output current in compact industrial layouts.

Availability

74LVC2G38GM,125 is available at Aetrix Electronics and suitable for industrial automation controllers, automotive body electronics, and IoT edge sensor nodes requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74LVC2G38GM,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, discrete, and MOSFET solutions for automotive, industrial, and consumer markets.

The 74LVC2G38 belongs to Nexperia's LVC (Low-Voltage CMOS) logic family, engineered for robust mixed-voltage interoperability, low dynamic power, and high noise immunity in space- and power-constrained embedded systems.

FAQ

What is the maximum sink current capability of 74LVC2G38GM,125 at 3.3 V supply?

The device supports ±24 mA output drive at VCC = 3.0 V, verified across –40 °C to +125 °C. At 3.3 V, typical sink current remains ≥22 mA under the same conditions, with VOL ≤ 0.55 V at 24 mA load per output. This rating applies to steady-state DC operation with adequate PCB copper pour for thermal dissipation.

Can 74LVC2G38GM,125 be used as a level shifter between 1.8 V and 5 V logic?

Yes - inputs tolerate up to 5.5 V regardless of VCC, so a 5 V signal can drive either input while VCC = 1.8 V. Outputs are open-drain and require a pull-up to the target domain (e.g., 5 V), enabling bidirectional translation. Schmitt-trigger inputs ensure clean switching despite voltage mismatch.

Does 74LVC2G38GM,125 support hot-swap or partial power-down operation?

Yes - its IOFF circuit actively disables outputs when VCC = 0 V, limiting power-off leakage to ±2 μA. This prevents back-current flow from live rails into unpowered sections, making it suitable for modular systems with staggered power sequencing or hot-plug card slots.

Is the exposed thermal pad (EPAD) of 74LVC2G38GM,125 electrically connected internally?

Yes - the EPAD is internally tied to GND. It must be soldered to a PCB thermal pad connected to a solid ground plane to achieve specified thermal performance (θJA = 175 K/W) and ensure reliable operation at full output current across temperature extremes.