Diodes Incorporated 74LVC2G38RA3-7

Overview

74LVC2G38RA3-7 from Diodes Incorporated is a dual 2-input NAND gate with open-drain outputs in an X2-DFN1210-8 package, operating from 1.65V to 5.5V supply, sinking up to 24mA at 3.3V, featuring IOFF for partial power-down isolation and Schmitt-trigger inputs with ~100mV hysteresis-used in voltage-level shifting between mixed-supply logic domains in portable computing peripherals.

For engineers reviewing the 74LVC2G38RA3-7 datasheet, 74LVC2G38RA3-7 pinout, 74LVC2G38RA3-7 application, or 74LVC2G38RA3-7 equivalent, this device is selected for low-voltage logic interfacing where bidirectional level translation, power-down signal blocking, and noise-immune input timing are required in space-constrained embedded designs.

Technical Context

This device implements two independent NAND gates, each with open-drain output architecture enabling wired-AND configurations and external pull-up flexibility across 1.65–5.5V rails. Its IOFF circuit actively disables outputs during VCC = 0V, preventing back-current flow into powered subsystems-a critical requirement in hot-swap and multi-rail power sequencing.

All inputs integrate Schmitt-trigger action (typ. 100mV hysteresis at 3.0V), tolerating slow edge rates without oscillation, while input voltage tolerance up to 5.5V allows safe interfacing with higher-voltage controllers even when VCC is as low as 1.65V.

Key Specifications

Pinout & Package

X2-DFN1210-8: 1.2mm × 1.0mm × 0.35mm body, 0.3mm lead pitch, bottom thermal pad, exposed die attach pad (no internal connection).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual open-drain NAND gate applications.

Compared with SN74LVC2G38DBVR and 74AUP2G38GM,115, the 74LVC2G38RA3-7 uniquely balances ultra-small size, Schmitt-trigger noise rejection, and robust IOFF protection-making it optimal for space-constrained, mixed-voltage portable systems requiring reliable signal integrity during power transitions.

Availability

74LVC2G38RA3-7 is available at Aetrix Electronics and suitable for USB peripheral control, I²C level translation, display power sequencing, and sensor interrupt arbitration requiring stable component supply in high-volume portable electronics manufacturing.

Supply support for 74LVC2G38RA3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for consumer, computing, and industrial markets.

The 74LVC logic family delivers advanced low-voltage CMOS performance with robust mixed-signal interoperability-designed specifically for portable and battery-powered systems demanding wide supply range, low quiescent current, and seamless voltage domain bridging.

FAQ

Can 74LVC2G38RA3-7 drive a 5V pull-up resistor while operating at 1.8V VCC?

Yes. Its inputs tolerate up to 5.5V regardless of VCC, and its open-drain outputs can sink current from a 5V pull-up when VCC = 1.8V. The output LOW voltage remains ≤0.45V at 4mA load, ensuring valid logic LOW to downstream 5V receivers. This enables true bidirectional level translation without direction control pins.

What is the minimum recommended pull-up resistor value for 1Y/2Y at 3.3V operation?

For 24mA sink capability at VCC = 3.3V, the minimum pull-up is calculated as (3.3V − VOL)/24mA. With VOL ≤ 0.55V (max at 24mA), R_PULLUP ≥ (3.3 − 0.55)/0.024 ≈ 115Ω. A 1kΩ resistor is typical for I²C; use ≤470Ω only if fast rise-time (<100ns) is required and bus capacitance is low.

Does the IOFF feature activate automatically when VCC drops below a threshold?

Yes. IOFF engages when VCC falls below approximately 0.8V, disabling both outputs regardless of input states. This occurs passively-no enable pin or external control is needed. Output leakage remains ≤±10μA across –40°C to +125°C, protecting powered subsystems from reverse current during brown-out or hot-plug events.

Is the X2-DFN1210-8 package compatible with standard reflow profiles for lead-free assembly?

Yes. The package is rated for JEDEC J-STD-020D MSL1 handling and withstands peak reflow temperatures up to 260°C. Its 0.35mm profile and thermal pad design support uniform heating; recommended soak time is 60–90 seconds at 150–200°C before ramping to peak, with cooling rate ≤6°C/s to prevent solder voiding or pad lifting.