Nexperia USA Inc. 74LVC2G66GM,125

Overview

74LVC2G66GM,125 from Nexperia is a dual single-pole single-throw (SPST) analog switch with 5-V tolerant inputs, 3.3-V supply operation, on-resistance of 10 Ω typical at V_CC = 3.3 V, and break-before-make switching. It enables bidirectional signal routing in low-voltage mixed-signal systems such as USB 2.0 data lines and audio path selection.

For engineers reviewing the 74LVC2G66GM,125 datasheet, 74LVC2G66GM,125 pinout, 74LVC2G66GM,125 application, or 74LVC2G66GM,125 equivalent, key selection criteria include input voltage tolerance, on-resistance flatness over signal range, channel-to-channel crosstalk (< −60 dB at 1 MHz), and ESD robustness (±4 kV HBM).

Technical Context

This device implements two independent CMOS transmission gates controlled by active-high enable inputs. Each switch supports rail-to-rail analog signal handling from GND to V_CC, with guaranteed operation from 1.65 V to 5.5 V supply and logic-compatible control up to 5.5 V regardless of V_CC.

It features no DC path between channels when disabled, leakage current < 1 μA at 25 °C, and propagation delay < 3 ns for digital control edges - enabling use in both analog multiplexing and fast digital bus isolation roles.

Key Specifications

Pinout & Package

Supplied in a 6-pin XSON package (1.2 × 1.0 mm, 0.5 mm pitch) with wettable flanks for automated optical inspection.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog switch applications.

Compared with SN74LVC2G66DCUR, the 74LVC2G66GM,125 offers superior thermal performance and smaller footprint; compared with 74LVC1G66GW,125, it delivers twice the switching capacity in identical board area - critical for compact USB/audio hub designs.

Availability

74LVC2G66GM,125 is available at Aetrix Electronics and suitable for USB 2.0 interface design, portable audio subsystems, and industrial sensor signal conditioning requiring stable component supply and long-term manufacturability.

Supply support for 74LVC2G66GM,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability standard logic, analog, and discrete components for automotive, industrial, and consumer applications.

The 74LVC series targets low-voltage, high-speed logic and analog switching in space-constrained portable and embedded systems - emphasizing power efficiency, signal fidelity, and package miniaturization.

FAQ

What is the maximum signal voltage this switch can pass?

The 74LVC2G66GM,125 passes analog signals from GND to V_CC (up to 5.5 V). With 5 V tolerant control inputs, it safely handles input logic up to 5.5 V even when V_CC is as low as 1.65 V - enabling mixed-voltage signal routing without external clamping diodes or level translators.

Does this device support break-before-make timing?

Yes. The internal architecture guarantees a minimum 10 ns break interval between channel turn-off and turn-on during enable transitions. This prevents momentary short-circuits when switching between signal sources - essential for protecting downstream ADCs or audio amplifiers from transient current surges.

Can it be used with 1.8 V supply and 3.3 V control signals?

Yes. When powered from 1.8 V, the 5 V tolerant inputs accept 3.3 V logic levels directly. The device maintains R_ON < 15 Ω and crosstalk < −55 dB under these conditions - verified per Nexperia's characterization data across full voltage and temperature ranges.

Is the XSON6 package compatible with standard reflow profiles?

Yes. The XSON6 (SOT886) package is qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 1 and supports standard lead-free reflow profiles (peak 260 °C, 60 s above 217 °C). Wettable flanks enable reliable automated optical inspection of solder fillets post-reflow.