Diodes Incorporated 74LVC2G86HD4-7

Overview

74LVC2G86HD4-7 from Diodes Incorporated is a dual 2-input XOR gate in X2-DFN2010-8 package, operating from 1.65V to 5.5V supply, delivering ±24mA output drive at 3.3V, with IOFF-enabled partial power-down protection and Schmitt-trigger inputs (100mV hysteresis at 3.0V). It serves as level-shifting logic in portable computing and signal isolation circuits.

For engineers reviewing the 74LVC2G86HD4-7 datasheet, 74LVC2G86HD4-7 pinout, 74LVC2G86HD4-7 application, or 74LVC2G86HD4-7 equivalent, key selection criteria include wide VCC range compatibility, IOFF leakage control (<±10μA), input tolerance up to 5.5V, and sub-6ns propagation delay at 3.3V.

Technical Context

This device implements two independent positive-logic XOR functions (Y = A ⊕ B) using CMOS technology, with push-pull outputs and rail-to-rail input voltage acceptance. Each gate supports bidirectional voltage translation between 1.65V and 5.5V domains without external biasing.

The IOFF circuit actively disables outputs during power-down, limiting backflow current to <±10μA when VCC = 0V and inputs/outputs are at 5.5V. Schmitt-trigger inputs provide noise immunity with 100mV typical hysteresis at VCC = 3.0V, enabling robust operation with slow-rising signals.

Key Specifications

Pinout & Package

X2-DFN2010-8 package: 1.95mm × 1.0mm × 0.4mm body, 0.5mm lead pitch, exposed thermal pad, moisture sensitivity level 1 (MSL1).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 2-input XOR gate applications.

Compared with SN74LVC2G86DBVR and 74AUP2G86GS,115, the 74LVC2G86HD4-7 uniquely combines 5.5V input tolerance, Schmitt-trigger noise immunity, and DFN2010's thermal performance-making it optimal for space-constrained, mixed-voltage, noise-prone embedded systems.

Availability

74LVC2G86HD4-7 is available at Aetrix Electronics and suitable for USB peripheral isolation, smartphone power sequencing, and industrial sensor interface applications requiring stable component supply and long-term lifecycle support.

Supply support for 74LVC2G86HD4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power, and small-signal solutions for consumer, industrial, and communications markets.

The 74LVC logic family targets mixed-voltage digital interfacing, emphasizing wide supply range, IOFF protection, and compact packaging for portable and space-constrained electronics.

FAQ

Can 74LVC2G86HD4-7 operate with VCC = 1.65V while inputs are at 3.3V?

Yes. Inputs tolerate up to 5.5V regardless of VCC setting, enabling safe level shifting from higher-voltage sources into 1.65V logic domains. The internal input protection clamps prevent damage, and Schmitt-trigger action remains functional at minimum VCC.

What is the maximum capacitive load this device can drive at 3.3V?

At VCC = 3.3V and TA = 25°C, the device maintains ≤6ns tPD driving 50pF loads per output. With ±24mA drive strength, it reliably drives ≥3 LVC inputs (CI ≈ 2.5pF each) plus 20pF of trace capacitance without signal degradation.

Does IOFF activate automatically when VCC drops below a threshold?

No. IOFF is an inherent structural feature-not a control signal. When VCC = 0V, the output transistors are cut off by design, limiting leakage to ±10μA max. No external enable/disable pin or voltage threshold triggers it; it operates passively during power removal.

Is the X2-DFN2010-8 package compatible with standard reflow profiles?

Yes. As MSL1 rated, it supports JEDEC J-STD-020-compliant reflow with peak temperature ≤260°C. Its 0.5mm pitch and exposed thermal pad require controlled solder paste volume (0.12mm stencil) and symmetric heating to ensure void-free attachment and thermal reliability.