Diodes Incorporated 74LVC2G86HK3-7

Overview

74LVC2G86HK3-7 from Diodes Incorporated is a dual 2-input XOR gate in X2-DFN1410-8 package, operating from 1.65V to 5.5V supply, delivering ±24mA output drive at 3.3V, with Schmitt-trigger inputs (100mV hysteresis), IOFF-enabled partial power-down protection, and RoHS/Halogen-free compliance. It serves as a level-shifting logic gate in portable computing and signal isolation circuits.

For engineers reviewing the 74LVC2G86HK3-7 datasheet, 74LVC2G86HK3-7 pinout, 74LVC2G86HK3-7 application, or 74LVC2G86HK3-7 equivalent, key selection criteria include supply voltage flexibility (1.65–5.5V), IOFF leakage (<±10μA at 5.5V), propagation delay (0.8–6.0ns over voltage/temperature), Schmitt-trigger noise immunity, and DFN1410 footprint compatibility.

Technical Context

This device implements two independent positive-logic XOR functions (Y = A ⊕ B) using CMOS technology. Each gate features push-pull outputs and Schmitt-trigger inputs-enabling robust operation with slow-rising/falling signals and noise margin up to 100mV at VCC = 3.0V.

The IOFF circuit actively disables outputs during power-down, limiting backflow current when VCC = 0V while inputs remain biased up to 5.5V. Input tolerance to 5.5V allows seamless interfacing across mixed-voltage domains without external level shifters.

Key Specifications

Pinout & Package

X2-DFN1410-8 (1.35mm × 1.0mm × 0.35mm, 0.4mm pitch) thermally enhanced leadless package with exposed thermal pad (non-electrical). Designed for high-density PCB layouts and automated reflow assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 2-input XOR gate applications.

Compared with SN74LVC2G86DBVR and 74AUP2G86GS,115, the 74LVC2G86HK3-7 uniquely balances ultra-small DFN1410 size, 5.5V input tolerance, Schmitt-trigger noise immunity, and IOFF protection - making it optimal for space-constrained, mixed-voltage, and hot-swap-capable designs.

Availability

74LVC2G86HK3-7 is available at Aetrix Electronics and suitable for USB-C interface design, IoT sensor node logic, industrial HMI keypads, and automotive infotainment reset coordination requiring stable component supply and long-term lifecycle assurance.

Supply support for 74LVC2G86HK3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for industrial, computing, and consumer markets.

The 74LVC logic family delivers advanced low-voltage CMOS performance with robust mixed-signal interoperability, designed specifically for compact, power-sensitive applications demanding voltage translation and noise-immune digital interfacing.

FAQ

What is the maximum input voltage the 74LVC2G86HK3-7 can tolerate?

The device accepts input voltages up to 5.5V regardless of VCC level, enabling safe interfacing with higher-voltage signals (e.g., 5V GPIO) even when powered from 1.65V or 1.8V. This eliminates external clamping diodes in mixed-voltage systems and simplifies level-shifting architecture.

Does the 74LVC2G86HK3-7 support hot-swap or partial power-down operation?

Yes - its IOFF circuitry disables outputs when VCC = 0V, limiting back-current to ±10μA maximum even with inputs held at 5.5V. This protects downstream circuitry during live insertion/removal and enables safe power sequencing in modular systems with independently controlled voltage domains.

How does the Schmitt-trigger input improve noise immunity?

Each input exhibits ~100mV hysteresis at VCC = 3.0V, meaning the rising threshold (VIH) and falling threshold (VIL) differ by that amount. This prevents multiple toggles on slow or noisy edges - critical for reliable operation with mechanical switches, reset buttons, or long PCB traces susceptible to EMI.

What is the thermal performance of the X2-DFN1410-8 package?

The package has a junction-to-ambient thermal resistance (θJA) of 321°C/W under standard JEDEC test conditions (2oz copper, minimum pad layout). With its 0.35mm profile and exposed thermal pad, it supports continuous operation at full drive strength in ambient temperatures up to +125°C when properly mounted on thermally optimized PCBs.