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Diodes Incorporated 74LVC2G86RA3-7

Part No.:
74LVC2G86RA3-7
Manufacturer:
Diodes Incorporated
Category:
Gates and Inverters
Package:
8-XFDFN
Datasheet:
Aetrix74LVC2G86RA3-7.pdf
Description:
IC GATE XOR 2CH 2-INP DFN1210-8
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,509

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Product details

Overview

74LVC2G86RA3-7 from Diodes Incorporated is a dual 2-input XOR gate in X2-DFN1210-8 package, operating from 1.65V to 5.5V with ±24mA output drive at 3.3V, IOFF-enabled partial power-down protection, and Schmitt-trigger inputs (100mV hysteresis at 3.0V). It performs voltage-level shifting and signal isolation in compact portable electronics.

For engineers reviewing the 74LVC2G86RA3-7 datasheet, 74LVC2G86RA3-7 pinout, 74LVC2G86RA3-7 application, or 74LVC2G86RA3-7 equivalent, key selection criteria include supply voltage range, IOFF leakage (<±10μA), propagation delay (0.8–6.0ns across VCC), and DFN1210 thermal resistance (θJA = 395°C/W).

Technical Context

This device implements two independent positive-logic XOR functions (Y = A ⊕ B) using CMOS technology with push-pull outputs. Each gate accepts input voltages up to 5.5V regardless of VCC, enabling robust level translation between mixed-voltage domains.

The integrated IOFF circuit disables outputs during power-down, blocking back-current flow into powered sections. Schmitt-trigger inputs provide noise immunity for slow-rising/falling signals, with hysteresis confirmed at 100mV typical at VCC = 3.0V.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage Range 1.65V to 5.5V - supports interoperability across 1.8V, 2.5V, 3.3V, and 5V logic domains
Output Drive Strength ±24mA at VCC = 3.3V - sufficient to drive moderate capacitive loads without external buffering
Propagation Delay 0.8ns (min) to 6.0ns (max) at VCC = 3.3V - enables timing-critical XOR operations in high-speed digital interfaces
IOFF Leakage Current ±10μA max at TA = +125°C - ensures safe bus isolation during partial power-down sequences
Input Hysteresis 100mV typical at VCC = 3.0V - rejects noise on slow-switching control or sensor-derived inputs
ESD Robustness 2000V HBM, >1000V CDM - meets industrial-grade reliability requirements without external protection
Thermal Resistance θJA 395°C/W - reflects thermal performance in X2-DFN1210-8 package on standard FR-4 PCB

Pinout & Package

X2-DFN1210-8 package: 1.2mm × 1.0mm × 0.35mm body, 0.3mm lead pitch, exposed thermal pad (no internal connection), 8-terminal surface-mount layout.

Pin/Terminal Circuit Role Design Meaning
1A Data Input (Gate 1) First XOR operand for Gate 1; accepts 0–5.5V regardless of VCC
1B Data Input (Gate 1) Second XOR operand for Gate 1; Schmitt-triggered for noise margin
2Y Data Output (Gate 2) Push-pull result of Gate 2 (2A ⊕ 2B); active-drive capability ±24mA
GND Ground Reference Return path for all logic and output currents; connects to PCB ground plane
2A Data Input (Gate 2) First XOR operand for Gate 2; electrically identical to 1A/1B
2B Data Input (Gate 2) Second XOR operand for Gate 2; supports same voltage and timing specs as 1A/1B
1Y Data Output (Gate 1) Push-pull result of Gate 1 (1A ⊕ 1B); fully compatible with 2Y
VCC Supply Voltage Primary power rail; IOFF activation occurs when VCC = 0V while inputs/outputs remain biased

Key Features

Feature Design Value
Dual independent XOR gates Two fully isolated logic functions in one die-reduces board space vs. discrete solutions
IOFF partial power-down support Prevents destructive back-current flow when VCC is off but I/O lines remain active
Schmitt-trigger inputs 100mV hysteresis at 3.0V enables reliable operation with slow or noisy control signals
Wide voltage compatibility Inputs tolerate up to 5.5V while VCC operates as low as 1.65V-ideal for level-shifting
Low dynamic power Typical Cpd = 20pF at 3.3V/10MHz-minimizes switching power in battery-powered devices

Applications

USB OTG Signal Routing Smartphone Power Sequencing

Use Scenario: Managing bidirectional ID pin detection and role negotiation in USB On-The-Go circuits.

IC Role / Device Role / Timing Role: XOR gate determines host/peripheral mode by comparing ID pin state against system reference.

Use Value: Enables single-pin mode detection with deterministic logic output and no external pull resistors required.

Use Scenario: Generating synchronized enable/disable signals for multi-rail PMICs during boot and sleep transitions.

IC Role / Device Role / Timing Role: Combines reset and wake-up signals to produce controlled power sequencing edges.

Use Value: Eliminates timing skew between rails using sub-6ns propagation delay and IOFF isolation during power collapse.

IoT Sensor Interface Logic Wearable Display Backlight Control

Use Scenario: Debouncing and polarity inversion of mechanical switch or reed sensor outputs before MCU input.

IC Role / Device Role / Timing Role: XOR acts as configurable inverter/XNOR via fixed-bias input, leveraging Schmitt-trigger noise rejection.

Use Value: Reduces firmware overhead by hardwiring signal conditioning-100mV hysteresis suppresses contact bounce.

Use Scenario: Synchronizing PWM dimming signals across multiple LED strings in ultra-thin wearables.

IC Role / Device Role / Timing Role: XOR combines phase-shifted PWM sources to generate interleaved drive patterns.

Use Value: Low 0.35mm profile and 1.2×1.0mm footprint fit constrained display module layouts without sacrificing timing precision.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 2-input XOR gate applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC2G86DCKR X2-SON8 (2.0×1.25mm), θJA = 336°C/W, 0.5mm pitch, no exposed pad Larger footprint; less thermally efficient but easier hand-soldering and probe access Select when thermal budget allows and assembly process favors larger pitch
74LVC2G86HK3-7 X2-DFN1410-8 (1.35×1.0mm), θJA = 321°C/W, 0.4mm pitch, same pinout 0.15mm larger area than RA3 but 74°C/W lower thermal resistance; identical function Select when improved thermal performance justifies minimal size increase in space-constrained designs

Compared with SN74LVC2G86DCKR and 74LVC2G86HK3-7, the 74LVC2G86RA3-7 offers the smallest footprint (1.2×1.0mm) and highest integration density, though with elevated thermal resistance-optimal for ultra-compact battery-powered devices where board area dominates thermal design.

Availability

74LVC2G86RA3-7 is available at Aetrix Electronics and suitable for USB OTG implementations, smartphone power sequencing, IoT sensor interface logic, and wearable display backlight control requiring stable component supply and long-term lifecycle support.

Supply support for 74LVC2G86RA3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power, and space-constrained solutions for consumer, computing, and industrial markets.

The 74LVC logic family delivers advanced CMOS performance with wide supply range and IOFF protection, designed specifically for voltage translation and partial-power-down systems in portable electronics.

FAQ

What is the maximum input voltage tolerance for 74LVC2G86RA3-7?

The inputs accept up to 5.5V regardless of VCC level, enabling use as a level translator from higher-voltage domains (e.g., 5V microcontrollers) to lower-voltage logic (e.g., 1.8V FPGAs). This is specified in the Absolute Maximum Ratings table and confirmed in Recommended Operating Conditions.

Does 74LVC2G86RA3-7 support true bidirectional signal isolation during power-down?

Yes-the IOFF circuit actively disables both outputs when VCC = 0V, limiting leakage current to ±10μA max at +125°C. This prevents back-current flow from live I/O lines into unpowered sections, satisfying partial power-down requirements per JESD78 Class I latch-up immunity.

How does the Schmitt-trigger input improve noise immunity?

Each input exhibits ~100mV hysteresis at VCC = 3.0V, meaning the rising threshold is ~100mV higher than the falling threshold. This prevents oscillation on slow or noisy signals-such as mechanical switch closures or long PCB traces-and eliminates need for external RC filtering.

Can 74LVC2G86RA3-7 be used in place of 74LVC2G86HK3-7 without layout changes?

No-though both share identical pinout numbering and logic function, the X2-DFN1210-8 (RA3) and X2-DFN1410-8 (HK3) packages have different dimensions (1.2×1.0mm vs. 1.35×1.0mm) and pad layouts. The RA3 requires smaller solder pads and 0.3mm pitch, making it non-interchangeable without PCB revision.

74LVC2G86RA3-7 Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
74LVC
Package/Case:
8-XFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
XOR (Exclusive OR)
Number of Circuits:
2
Number of Inputs:
2
Features:
-
Voltage - Supply:
1.65V ~ 5.5V
Current - Quiescent (Max):
40 µA
Current - Output High, Low:
32mA, 32mA
Input Logic Level - Low:
0.58V ~ 1.65V
Input Logic Level - High:
1.07V ~ 3.85V
Max Propagation Delay @ V, Max CL:
5.6ns @ 5V, 50pF
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
X2-DFN1210-8

74LVC2G86RA3-7 FAQ

1.How can I place an order for 74LVC2G86RA3-7 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVC2G86RA3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74LVC2G86RA3-7 reliable?

The price and inventory of 74LVC2G86RA3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC2G86RA3-7 is usually 5 days.

3.What payment methods are accepted for 74LVC2G86RA3-7?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC2G86RA3-7 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74LVC2G86RA3-7?

74LVC2G86RA3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74LVC2G86RA3-7 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVC2G86RA3-7?

For technical support, including 74LVC2G86RA3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC2G86RA3-7 requirements.

6.How does Aetrix verify that 74LVC2G86RA3-7 is sourced from the original manufacturer or authorized distributors?

All 74LVC2G86RA3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC2G86RA3-7 meets industry standards.

7.What is the process for return or replacement of 74LVC2G86RA3-7?

All 74LVC2G86RA3-7 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC2G86RA3-7, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVC2G86RA3-7 part is unused and in its original packaging.

Return procedure for 74LVC2G86RA3-7:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

74LVC2G86RA3-7 Tags

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