Nexperia USA Inc. 74LVC374ABQ,115

Overview

74LVC374ABQ,115 from Nexperia is an octal positive-edge-triggered D-type flip-flop with 3-state outputs, designed for data latching and bus isolation in mixed-voltage digital systems. It operates from 1.2 V to 3.6 V, accepts 5.5 V-tolerant inputs, features IOFF partial power-down protection, and delivers ≤9.0 ns propagation delay at 3.3 V - enabling reliable use in industrial control backplanes and FPGA I/O expansion interfaces.

For engineers reviewing the 74LVC374ABQ,115 datasheet, 74LVC374ABQ,115 pinout, 74LVC374ABQ,115 application, or 74LVC374ABQ,115 equivalent, this device serves as a voltage-translating 8-bit register with precise set-up/hold timing (tsu = 2.0 ns, th = 1.5 ns at VCC = 3.3 V), Schmitt-trigger inputs for noise immunity, and guaranteed 3-state disable timing (tdis ≤ 7.5 ns) critical for hot-swap and dynamic bus arbitration designs.

Technical Context

This device implements eight independent edge-triggered D flip-flops sharing a common clock (CP) and output enable (OE) input. Each flip-flop captures Dn on the LOW-to-HIGH CP transition and holds state until the next valid clock edge, while OE independently controls high-impedance output states without affecting internal register contents.

The IOFF circuit activates when VCC = 0 V, blocking backflow current from powered I/O lines into the unpowered device - essential for partial power-down compliance. Schmitt-trigger inputs ensure robust operation with slow-rising signals (Δt/ΔV up to 20 ns/V at 1.65 V), and JEDEC-standard voltage compatibility enables direct interfacing with both 3.3 V CMOS and 5 V TTL logic families.

Key Specifications

Pinout & Package

DHVQFN20 package (SOT764-1): 2.5 mm × 4.5 mm × 0.85 mm body, 20-terminal no-lead quad flat design with exposed thermal pad; optimized for high-density PCB layouts and improved thermal dissipation over SO20/TSSOP alternatives.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal D-type flip-flop applications.

Compared with SN74LVC374APWR and 74LVC374AD,118, the 74LVC374ABQ,115 offers superior thermal efficiency (12.9 mW/K derating), smallest PCB area (2.5 × 4.5 mm), and highest guaranteed fmax (120 MHz at +125 °C), making it optimal for space-constrained, high-reliability embedded systems.

Availability

74LVC374ABQ,115 is available at Aetrix Electronics and suitable for industrial PLC backplanes, FPGA I/O expansion bridges, automotive body control modules, and test equipment digital pattern generators requiring stable component supply across extended temperature and mixed-voltage operating conditions.

Supply support for 74LVC374ABQ,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-performance, energy-efficient logic, analog, and MOSFET solutions for automotive, industrial, and consumer markets.

The 74LVC374A series belongs to Nexperia's advanced LVC logic family, engineered for low-voltage operation with 5 V tolerance and robust power-down behavior - targeting mixed-signal system integration where voltage translation, timing precision, and reliability are critical.

FAQ

What is the maximum clock frequency supported by the 74LVC374ABQ,115 at 125 °C?

The device guarantees a maximum clock frequency (fmax) of 120 MHz at VCC = 3.0 V to 3.6 V and Tamb = -40 °C to +125 °C, as specified in Table 7 of the datasheet. This is validated under worst-case voltage and temperature conditions with 50 pF load and 500 Ω termination, ensuring timing margin for real-world PCB layouts.

Can the 74LVC374ABQ,115 safely interface with 5 V microcontrollers while powered from 3.3 V?

Yes - its inputs tolerate up to 5.5 V regardless of VCC, allowing direct connection to 5 V MCU GPIOs. Outputs swing rail-to-rail (0 V to VCC), so when powered from 3.3 V, they deliver 3.3 V logic levels compatible with 3.3 V receivers. No external level shifters are needed for this configuration.

How does the IOFF feature protect the device during partial power-down?

When VCC = 0 V, the IOFF circuit disables all output buffers and blocks current flow between powered I/O lines and the unpowered VCC/GND rails. Measured IOFF leakage is ≤±10 μA at VI/VO = 5.5 V, preventing latch-up or thermal damage during hot-swap or staggered power sequencing events.

Is the exposed thermal pad on the DHVQFN20 package required to be soldered to ground?

No - the datasheet explicitly states the thermal pad (terminal 1) has no electrical or mechanical requirement to be soldered. If connected, it must remain electrically floating or tied to GND; soldering without grounding may cause unintended current paths or thermal coupling issues in sensitive analog sections.