Diodes Incorporated 74LVC374AQ20-13

Overview

74LVC374AQ20-13 from Diodes Incorporated is an octal D-type flip-flop with 3-state outputs in a 20-pin V-QFN4525 package, operating from 1.65V to 3.6V supply, delivering ±24mA output drive at 3.0V, and supporting edge-triggered data latching on CLK rising edge for bus interface and I/O port buffering applications.

For engineers reviewing the 74LVC374AQ20-13 datasheet, 74LVC374AQ20-13 pinout, 74LVC374AQ20-13 application, or 74LVC374AQ20-13 equivalent, this device serves as a high-drive, low-voltage, 3-state register for bidirectional bus driving, power-down signal isolation, and mixed-voltage I/O interfacing in embedded computing and peripheral subsystems.

Technical Context

The 74LVC374AQ20-13 implements eight independent D-type latches synchronized to the rising edge of CLK, each with individually controllable 3-state output enabled by OE. Its IOFF circuitry ensures negligible leakage during partial power-down, enabling safe hot-insertion and bus sharing across powered/unpowered domains.

All inputs feature Schmitt-trigger action for noise immunity, and outputs support 5.5V-tolerant inputs while operating from 1.65–3.6V VCC - enabling direct interfacing with both 3.3V and 5V logic without level shifters. Propagation delay is 3.8ns typical (3.3V), with setup/hold times of 2.0ns/1.5ns respectively.

Key Specifications

Pinout & Package

V-QFN4525-20 package: 2.5mm × 4.5mm × 0.95mm body, 0.50mm lead pitch, exposed thermal pad (pin 20), JEDEC-compliant footprint per AP02001.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal D-type flip-flop with 3-state output applications.

Compared with SN74LVC374APWR and 74ALVC374MTCX, the 74LVC374AQ20-13 delivers identical logic function with superior thermal performance (θJA = 67°C/W), smaller footprint (2.5×4.5mm), and consistent ±24mA drive from 2.7V onward - making it optimal for space-constrained, thermally demanding embedded interfaces.

Availability

74LVC374AQ20-13 is available at Aetrix Electronics and suitable for USB peripheral interfaces, embedded display data buses, hot-swappable storage backplanes, and industrial PLC I/O expansion modules requiring stable component supply and long-term lifecycle assurance.

Supply support for 74LVC374AQ20-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-reliability, energy-efficient solutions for industrial, computing, and consumer markets.

The 74LVC374AQ20-13 belongs to Diodes' LVC logic family, engineered for low-voltage, high-speed, mixed-signal interfacing in space-constrained and thermally sensitive applications such as portable electronics and modular industrial systems.

FAQ

What is the maximum clock frequency supported by the 74LVC374AQ20-13?

The 74LVC374AQ20-13 supports up to 125MHz maximum clock frequency at VCC = 3.3V and TA = +25°C, with guaranteed minimum of 100MHz across –40°C to +85°C. At 2.7V, the minimum guaranteed frequency is 80MHz, and at 1.8V it drops to 35MHz - all specified per DS35895 Rev. 1–2 switching characteristics table.

Can the 74LVC374AQ20-13 safely interface with 5V logic inputs?

Yes - all inputs (D1–D8, CLK, OE) are rated for 0V to 5.5V regardless of VCC, allowing direct connection to 5V microcontrollers or peripherals without level-shifting circuitry. This tolerance is explicitly verified in the Recommended Operating Conditions and Electrical Characteristics tables of the datasheet.

Does the 74LVC374AQ20-13 support partial power-down operation?

Yes - its IOFF feature actively disables current flow between I/O pins and VCC/GND when the device is unpowered, preventing back-driving and bus contention. Measured IOFF leakage is ≤±10μA at 3.6V, meeting JESD78 Class I latch-up immunity (>250mA) requirements.

What thermal considerations apply to the V-QFN4525-20 package?

The V-QFN4525-20 package has θJA = 67°C/W (4-layer board, 2oz copper), requiring connection of the exposed thermal pad (pin 20) to a dedicated ground plane for optimal heat dissipation. Diodes recommends following AP02001 pad layout guidelines to maintain junction temperature below 150°C under full-load conditions.