NXP Semiconductors 74LVC38APW,112

Overview

74LVC38APW,112 from NXP Semiconductors is a quad 2-input NAND gate with open-drain outputs, designed for level translation between 3.3 V and 5 V logic domains. It operates across 1.2 V to 5.5 V supply, supports −40 °C to +125 °C ambient range, and delivers propagation delays as low as 0.5 ns at 3.0 V. It enables wired-OR/AND bus interfaces in I²C, SMBus, and system control signaling.

For engineers reviewing the 74LVC38APW,112 datasheet, 74LVC38APW,112 pinout, 74LVC38APW,112 application, or 74LVC38APW,112 equivalent, key selection criteria include open-drain output drive capability (up to 32 mA at 4.5 V), 5 V-tolerant inputs, JEDEC-compliant voltage ranges (JESD8-7A/5A/C), ESD robustness (HBM >2000 V), and TSSOP14 package compatibility with high-density PCB layouts.

Technical Context

The 74LVC38APW,112 implements four independent NAND gates whose outputs remain in high-impedance state unless both inputs are HIGH, enabling active-LOW wired-OR and active-HIGH wired-AND configurations. Its input structure accepts 0–5.5 V signals regardless of VCC, allowing direct interfacing with TTL, LVTTL, and mixed-voltage microcontrollers.

Each gate features CMOS input stages with sub-5 µA leakage (±20 µA max at −40 °C to +125 °C) and output stages rated for 50 mA sink current. Dynamic performance is characterized by tPZL/tPLZ down to 0.5 ns at 3.0 V and output skew ≤1.5 ns, supporting reliable timing in multi-gate bus arbitration circuits.

Key Specifications

Pinout & Package

TSSOP14 package (SOT402-1): plastic thin shrink small outline, 14 leads, body width 4.4 mm, 0.65 mm pitch, exposed pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND gate applications.

Compared with SN74LVC38AQPWRQ1 and 74LVC00APW,118, the 74LVC38APW,112 uniquely combines open-drain outputs, 5 V input tolerance, and industrial temperature range in TSSOP14 - making it optimal for cost-sensitive, space-constrained mixed-voltage bus interface designs.

Availability

74LVC38APW,112 is available at Aetrix Electronics and suitable for I²C bus translation, SMBus alert aggregation, microcontroller GPIO expansion, and industrial control logic requiring stable component supply across automotive, industrial, and computing segments.

Supply support for 74LVC38APW,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The 74LVC38APW,112 belongs to NXP's LVC logic family, engineered for low-voltage, high-speed, mixed-signal interfacing in space-constrained embedded systems where voltage translation and bus arbitration are critical.

FAQ

What is the maximum sink current capability of each output in 74LVC38APW,112?

Each open-drain output of the 74LVC38APW,112 is rated for 32 mA sink current at VCC = 4.5 V and 24 mA at VCC = 3.0 V, as specified in Table 6 of the datasheet. This enables direct driving of standard I²C bus loads with 2.2 kΩ pull-ups while maintaining VOL ≤ 0.55 V. Exceeding these values risks exceeding absolute maximum ratings and degrading long-term reliability.

Can 74LVC38APW,112 be used to translate 5 V signals to a 1.8 V microcontroller?

Yes - the 74LVC38APW,112 has 5 V tolerant inputs and operates down to VCC = 1.2 V, so it can safely accept 5 V logic levels while powered from 1.8 V. Its VIH threshold at 1.8 V VCC is 1.08 V (0.6 × VCC), ensuring reliable HIGH detection. The output will swing from GND to the 1.8 V rail via external pull-up, completing bidirectional level translation.

Is the exposed pad on the TSSOP14 package of 74LVC38APW,112 electrically connected?

No - the exposed pad on the 74LVC38APW,112's SOT402-1 (TSSOP14) package is not electrically connected to any internal node. As stated in Figure 4 note (1), it is attached to the substrate via conductive die attach material but has no electrical or mechanical requirement to be soldered. If soldered, the land must remain floating or be connected to GND to avoid unintended coupling.

Does 74LVC38APW,112 support I²C Fast Mode (400 kbit/s) timing requirements?

Yes - with typical propagation delays of 0.5–4.0 ns and output skew ≤1.5 ns, the 74LVC38APW,112 easily meets I²C Fast Mode timing constraints (tBUF ≥ 1.3 µs, tHD:STA ≥ 0.6 µs). When used as a level translator with 2.2 kΩ pull-ups and ≤400 pF bus capacitance, it preserves signal integrity and setup/hold margins across 3.3 V/5 V domain boundaries.

What JEDEC standards does 74LVC38APW,112 comply with?

The 74LVC38APW,112 complies with JEDEC standards JESD8-7A (1.65–1.95 V), JESD8-5A (2.3–2.7 V), and JESD8-C/JESD36 (2.7–3.6 V) for interface voltage levels. These ensure interoperability with other JEDEC-compliant devices across its full operating voltage range, validated per NXP's Rev. 4 product data sheet dated 4 November 2011.