Nexperia USA Inc. 74LVC3G06GT,115

Overview

74LVC3G06GT,115 from Nexperia is a triple inverter IC with open-drain outputs, designed for level translation between 3.3 V and 5 V logic domains. It features Schmitt-trigger inputs for noise immunity, IOFF partial power-down protection, and operates across 1.65 V to 5.5 V supply. Its XSON8 (SOT833-1) package supports high-density PCB layouts in industrial control and sensor interface applications.

For engineers reviewing the 74LVC3G06GT,115 datasheet, 74LVC3G06GT,115 pinout, 74LVC3G06GT,115 application, or 74LVC3G06GT,115 equivalent, key selection criteria include open-drain drive capability (−24 mA at VCC = 3.0 V), input overvoltage tolerance to 5.5 V, −40 °C to +125 °C operating range, and IOFF-enabled bus isolation during power sequencing.

Technical Context

This device integrates three independent inverting buffers, each with an open-drain output stage enabling wired-AND configurations and bidirectional level shifting. Schmitt-trigger inputs provide hysteresis (typ. 0.3 V at VCC = 3.3 V), improving noise margin against slow-rising signals in noisy industrial environments.

The IOFF circuit actively disables all outputs when VCC = 0 V, blocking backflow current up to ±2 μA - critical for hot-swap and multi-rail systems. Input voltage tolerance to 5.5 V allows direct interfacing with legacy 5 V TTL without external resistors or clamps.

Key Specifications

Pinout & Package

XSON8 plastic extremely thin small outline package (SOT833-1); no leads; 8 terminals; body dimensions 1.0 mm × 1.95 mm × 0.5 mm; thermal pad optional; moisture sensitivity level MSL3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar triple inverter with open-drain output applications.

Compared with SN74LVC3G06DCUR and 74LVC3G06DP,118, the 74LVC3G06GT,115 delivers the smallest PCB footprint (1.95 mm²) and lowest profile (0.5 mm height), making it optimal for ultra-thin portable equipment and space-constrained IoT nodes - though thermal management requires careful copper pour design.

Availability

74LVC3G06GT,115 is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and IoT edge sensor nodes requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74LVC3G06GT,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and discrete components - delivering energy-efficient, scalable solutions for automotive, industrial, and consumer markets.

The 74LVC3G06 belongs to Nexperia's LVC logic family, engineered for low-voltage operation (1.65–5.5 V), mixed-signal interoperability, and robustness in harsh environments - specifically targeting level translation and interface conditioning in compact embedded systems.

FAQ

Can 74LVC3G06GT,115 drive a 5 V pull-up directly from a 3.3 V supply?

Yes - its inputs tolerate up to 5.5 V regardless of VCC, and its open-drain outputs can sink current into a 5 V pull-up. With VCC = 3.3 V, VOL remains ≤ 0.55 V at 24 mA, ensuring valid LOW logic level for 5 V CMOS inputs. No level-shifting resistors are needed.

Does the IOFF feature work when only one supply rail is powered down?

Yes - IOFF activates whenever VCC = 0 V, forcing all outputs into high-impedance state even if inputs remain at 5 V. This prevents back-current flow through input protection diodes, satisfying JEDEC JESD78 latch-up immunity requirements during partial power-down sequences.

What is the maximum capacitive load this device can drive reliably?

At VCC = 3.3 V and Tamb = 25 °C, the device maintains < 3.4 ns propagation delay up to 50 pF load capacitance (per Table 10). For heavier loads (e.g., >100 pF), rise/fall times increase linearly with CL; use external series termination or buffer stages beyond that point.

Is the XSON8 package (SOT833-1) compatible with standard reflow profiles?

Yes - SOT833-1 is qualified for IPC/JEDEC J-STD-020D MSL3 handling and supports peak reflow temperatures up to 260 °C. Its 0.5 mm height and exposed thermal pad (optional) require controlled stencil aperture and paste volume to ensure void-free solder joints and mechanical reliability.