NXP Semiconductors 74LVC3G07GF,115

Overview

74LVC3G07GF,115 from Nexperia is a triple non-inverting buffer IC with open-drain outputs, designed for level-shifting and wired-logic interfacing in mixed-voltage systems. It operates from 1.65 V to 5.5 V, accepts 5 V-tolerant inputs, features Schmitt-trigger inputs for noise immunity, and supports IOFF partial power-down protection. It is used in I²C bus buffering, GPIO expansion, and voltage-level translation between 3.3 V and 5 V domains.

For engineers reviewing the 74LVC3G07GF,115 datasheet, 74LVC3G07GF,115 pinout, 74LVC3G07GF,115 application, or 74LVC3G07GF,115 equivalent, key selection considerations include open-drain drive capability (–24 mA at VCC = 3.0 V), –40 °C to +125 °C operation, XSON8 package footprint (1.35 × 1.0 × 0.5 mm), and compatibility with JEDEC JESD8-7/5/B standards for low-voltage logic interfacing.

Technical Context

This device implements three independent non-inverting buffer stages, each with an open-drain output enabling wired-OR/AND logic functions. All inputs incorporate Schmitt-trigger action, ensuring robust operation with slow-rising or noisy signals across its full 1.65 V–5.5 V supply range.

The IOFF circuit actively disables outputs during power-down, blocking backflow current when VCC = 0 V - critical for hot-swap and partial-power-down system architectures. Input tolerance up to 5.5 V allows direct interface with legacy 5 V TTL and CMOS logic without external level shifters.

Key Specifications

Pinout & Package

XSON8 package (SOT1089): extremely thin, leadless, 8-terminal surface-mount package measuring 1.35 mm × 1.0 mm × 0.5 mm; thermal pad optional; no exposed leads; requires controlled reflow profile per JEDEC J-STD-020.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar triple open-drain buffer applications.

Compared with SN74LVC3G07DCUR, the 74LVC3G07GF,115 saves 0.45 mm² board area and improves thermal resistance by 12 K/W but requires precision reflow due to leadless construction; versus 74AUP3G07GF,115, it trades 3× higher drive strength and full 5 V tolerance for ~2× higher static current - making it the default choice for industrial I/O expansion.

Availability

74LVC3G07GF,115 is available at Aetrix Electronics and suitable for industrial automation controllers, IoT edge node interfaces, and automotive body electronics requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74LVC3G07GF,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert headquartered in Nijmegen, Netherlands, specializing in high-volume logic, analog, and discrete components with emphasis on reliability, efficiency, and manufacturability.

This device belongs to the 74LVC logic family - engineered for low-voltage, high-noise-immunity digital interfacing in space-constrained, thermally demanding applications such as portable instrumentation and modular PLC I/O modules.

FAQ

Can 74LVC3G07GF,115 drive an LED directly?

Yes - each open-drain output can sink up to 24 mA at VCC = 3.0 V, sufficient for standard 2 mA–10 mA indicator LEDs. Connect the LED anode to a pull-up voltage (e.g., 3.3 V or 5 V) and cathode to the output pin. Ensure the series resistor limits current to ≤24 mA and accounts for forward voltage drop (e.g., 220 Ω for 5 V pull-up and 2 V LED drop). Do not exceed absolute maximum output current of 50 mA per pin.

Is a pull-up resistor required on each open-drain output?

Yes - every 1Y, 2Y, and 3Y output must have an external pull-up resistor to a valid logic-high voltage (e.g., VCC or another supply rail). Typical values range from 1 kΩ (for speed-critical I²C) to 10 kΩ (for low-power GPIO). No internal pull-up exists; leaving outputs unconnected results in undefined logic states and potential ESD vulnerability.

Does 74LVC3G07GF,115 support hot insertion?

It supports partial hot insertion via IOFF functionality: when VCC = 0 V, outputs go high-impedance and input leakage remains <±2 μA, preventing backdrive into powered subsystems. However, the device itself must not be inserted while VCC or inputs are live - always power-cycle the host board before connector mating to avoid latch-up or ESD damage to unprotected pins.

What is the minimum recommended trace width for the thermal pad on SOT1089?

The SOT1089 package does not include an exposed thermal pad - it is a leadless XSON8 variant with bottom-side terminals only. Thermal transfer occurs through copper pours under the 8 solder terminals. For optimal thermal performance, use ≥0.25 mm wide traces connecting each terminal to inner-layer ground planes, and apply ≥20% solder mask opening on the bottom side to maximize solder wetting area per terminal.