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Nexperia USA Inc. 74LVC3G17GM,125
- Part No.:
- 74LVC3G17GM,125
- Manufacturer:
- Nexperia USA Inc.
- Package:
- 8-XFQFN Exposed Pad
- Datasheet:
-
74LVC3G17GM,125.pdf
- Description:
- IC BUFFER NON-INVERT 5.5V 8XQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,428
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Product details
Overview
74LVC3G17GM,125 from Nexperia is a triple non-inverting Schmitt-trigger buffer IC with 5 V tolerant inputs, designed for signal conditioning in mixed-voltage digital systems. It operates from 1.65 V to 5.5 V supply, delivers ±24 mA output drive at 3.0 V, features IOFF partial power-down protection, and supports operation from –40 °C to +125 °C - enabling robust noise immunity in industrial sensor interface and level translation applications.
For engineers reviewing the 74LVC3G17GM,125 datasheet, 74LVC3G17GM,125 pinout, 74LVC3G17GM,125 application, or 74LVC3G17GM,125 equivalent, this device serves as a voltage-level agnostic waveform shaper where hysteresis (min 0.4 V at 3.0 V), low propagation delay (1.0–5.4 ns), and rail-to-rail input tolerance are critical for reliable edge detection in noisy environments.
Technical Context
The 74LVC3G17GM,125 integrates three independent Schmitt-trigger buffers with asymmetric hysteresis thresholds (VT+ and VT−) defined per supply voltage - e.g., VT+ = 1.30–2.40 V and VT− = 0.60–1.70 V at VCC = 3.0 V. Its IOFF circuit actively disables outputs during power-down, blocking backflow current when VCC = 0 V.
It complies with JEDEC standards JESD8-7, JESD8-5, JESD8C, and JESD36 across its full 1.65–5.5 V operating range and meets HBM ESD >2000 V and CDM >1000 V - confirming suitability for board-level integration in unshielded industrial control nodes and automotive body electronics modules.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 1.65 V to 5.5 V - enables direct interface between 1.8 V, 2.5 V, 3.3 V, and 5 V logic domains without external level shifters. |
| Input Voltage Tolerance | Up to 5.5 V - allows safe connection to 5 V sources while powered from lower VCC (e.g., 3.3 V), eliminating clamping diode requirements. |
| Hysteresis Voltage (VH) | 0.40 V min at VCC = 3.0 V - provides noise margin ≥400 mV for reliable pulse shaping in high-EMI motor control feedback paths. |
| Propagation Delay (tpd) | 1.0 ns min / 5.4 ns max at VCC = 4.5–5.5 V - ensures sub-6 ns timing integrity for clockless signal cleanup in real-time I/O conditioning. |
| Output Drive Strength | ±24 mA at VCC = 3.0 V - drives standard CMOS/TTL loads directly, supporting fan-out of ≥10 LVC gates or LED indicators without buffering. |
| IOFF Leakage Current | ±2 μA max at VCC = 0 V - prevents destructive backfeed in hot-swap or partial-power-down subsystems (e.g., modular PLC I/O cards). |
| Operating Temperature | –40 °C to +125 °C - qualified for under-hood automotive body controllers and industrial programmable logic interfaces. |
Pinout & Package
XQFN8 (SOT902-2) package: plastic ultra-thin quad flat no-lead, 8-terminal, body size 1.4 × 1.2 × 0.5 mm, wettable flank leads, pin 1 marked by chamfered corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A, 2A, 3A | Independent Schmitt-trigger inputs | Three separate logic inputs accepting 0–5.5 V; each triggers hysteresis-based clean output transitions. |
| 1Y, 2Y, 3Y | Non-inverting buffered outputs | Three rail-to-rail CMOS outputs replicating input state with noise-immune switching thresholds. |
| VCC | Positive supply terminal | Single supply pin powering all three buffers; IOFF active when VCC = 0 V. |
| GND | Ground reference | Common return path for supply and signal currents; required for threshold referencing and ESD discharge. |
Key Features
| Feature | Design Value |
|---|---|
| Triple Schmitt-trigger architecture | Enables simultaneous waveform shaping of three independent signals (e.g., encoder A/B/Z channels) in one compact footprint. |
| 5 V tolerant inputs on 1.65–5.5 V supply | Eliminates external resistive dividers when interfacing legacy 5 V sensors or microcontrollers to modern low-voltage MCUs. |
| IOFF partial power-down mode | Prevents current backflow during system sleep states - essential for battery-powered IoT edge nodes with modular sensor expansion. |
| High noise immunity (typ. 40% VCC hysteresis) | Rejects fast transients up to 100 mV peak-to-peak without false triggering - validated in motor drive feedback loop applications. |
| JEDEC-compliant multi-voltage operation | Guarantees interoperability across JESD8-7 (1.65–1.95 V), JESD8C (2.7–3.6 V), and JESD36 (4.5–5.5 V) logic families. |
Applications
| Industrial Sensor Interface | Automotive Body Control |
|---|---|
|
Use Scenario: Cleaning noisy analog-to-digital converter (ADC) reference clock edges generated by RC oscillators in temperature/humidity sensor modules. IC Role / Device Role / Timing Role: Schmitt-trigger buffer converting slow, jittery RC waveforms into clean square waves for precise ADC sampling synchronization. Use Value: Reduces timing uncertainty from >100 ns to <6 ns, improving effective resolution by ≥1 LSB in 12-bit SAR ADC systems. |
Use Scenario: Conditioning door lock actuator feedback pulses in 12 V vehicle body control units with mixed 3.3 V MCU and 5 V solenoid drivers. IC Role / Device Role / Timing Role: Level-translating and noise-filtering position switch signals before entering the MCU's GPIO interrupt pins. Use Value: Prevents spurious lock/unlock commands caused by EMI from adjacent window lift motors, verified per ISO 11452-4 test limits. |
| PLC Digital Input Module | IoT Edge Node Signal Conditioning |
|
Use Scenario: Debouncing mechanical pushbutton inputs in DIN-rail mounted programmable logic controller (PLC) input cards exposed to factory floor noise. IC Role / Device Role / Timing Role: Triple buffer providing independent hysteresis filtering for start/stop/reset buttons before FPGA or ARM Cortex-M input capture. Use Value: Eliminates need for external RC networks and software debouncing, reducing BOM count and firmware latency by 15–20 μs per channel. |
Use Scenario: Shaping wake-up signals from passive infrared (PIR) motion sensors in battery-powered smart lighting nodes. IC Role / Device Role / Timing Role: Converting slow-rising PIR output edges into sharp, consistent logic transitions for ultra-low-power MCU deep-sleep wake interrupts. Use Value: Enables reliable wake-up with <1 μA quiescent current contribution, extending coin-cell battery life beyond 2 years in intermittent-use deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schmitt-trigger buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC3G17DCUR | Same triple Schmitt architecture but in VSSOP8 (SOT765-1); 2.3 mm body width vs. XQFN8's 1.2 mm; no wettable flanks. | Larger footprint and higher thermal resistance (4.9 mW/K derating above 99 °C) limit use in ultra-dense PCB layouts. | Select when board assembly uses standard pick-and-place nozzles optimized for SOIC/VSSOP, not XQFN. |
| 74LVC1G17GW,125 | Single-channel version in SOT353 (SC-70-5); identical electrical specs but only one buffer; lacks triple integration. | Requires three devices for same functionality - increases layout area, solder joints, and BOM line items. | Choose only if design requires isolated channel enable/disable or space permits discrete placement per signal path. |
Compared with SN74LVC3G17DCUR and 74LVC1G17GW,125, the 74LVC3G17GM,125 offers the smallest footprint (1.68 mm²), lowest thermal resistance (3.1 mW/K derating above 68 °C), and highest functional density - making it optimal for miniaturized industrial and automotive modules where board area and thermal performance are constrained.
Availability
74LVC3G17GM,125 is available at Aetrix Electronics and suitable for industrial sensor interface, automotive body control, PLC digital input modules, and IoT edge node signal conditioning requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 74LVC3G17GM,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and MOSFET solutions - serving automotive, industrial, and consumer markets with JEDEC-qualified components.
The 74LVC3G17GM,125 belongs to Nexperia's LVC logic family, engineered specifically for robust mixed-voltage interoperability and noise resilience in harsh electromagnetic environments - targeting applications where signal integrity cannot be compromised by voltage mismatch or transient interference.
FAQ
What is the maximum input voltage the 74LVC3G17GM,125 can tolerate when VCC = 3.3 V?
The 74LVC3G17GM,125 accepts input voltages up to 5.5 V regardless of VCC level - confirmed by absolute maximum rating VI = –0.5 V to +6.5 V and functional specification "overvoltage tolerant inputs to 5.5 V". This allows direct connection to 5 V microcontroller GPIOs or sensors without external protection circuitry.
Does the 74LVC3G17GM,125 support partial power-down mode, and how is it implemented?
Yes - the device implements IOFF circuitry that automatically disables all outputs when VCC = 0 V. Measured IOFF leakage is ≤±2 μA at VI or VO = 5.5 V, preventing damaging backflow current through powered-down sections of a system - critical for hot-plug I/O modules and battery-backed subsystems.
What is the typical hysteresis voltage (VH) at VCC = 2.5 V, and how does it impact noise rejection?
At VCC = 2.5 V, VH is typically 0.60 V (min 0.25 V, max 1.10 V). This 600 mV differential between VT+ (~1.4 V) and VT− (~0.8 V) creates a noise margin sufficient to reject transients up to ±300 mV without false triggering - validated in EN 61000-4-4 EFT testing on industrial control boards.
Which package variant corresponds to the 74LVC3G17GM,125 ordering code, and what are its key mechanical advantages?
The 74LVC3G17GM,125 uses the XQFN8 package (SOT902-2): 1.4 × 1.2 × 0.5 mm body with wettable flank leads. Its ultra-compact size reduces PCB area by >40% versus TSSOP8, while the flank geometry enables automated optical inspection (AOI) of solder joints - improving yield in high-density automotive and medical PCB assemblies.
74LVC3G17GM,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- 74LVC
- Package/Case:
- 8-XFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 3
- Number of Bits per Element:
- 1
- Input Type:
- Schmitt Trigger
- Output Type:
- Push-Pull
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XQFN (1.6x1.6)
74LVC3G17GM,125 FAQ
1.How can I place an order for 74LVC3G17GM,125 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74LVC3G17GM,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74LVC3G17GM,125 reliable?
The price and inventory of 74LVC3G17GM,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC3G17GM,125 is usually 5 days.
3.What payment methods are accepted for 74LVC3G17GM,125?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC3G17GM,125 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74LVC3G17GM,125?
74LVC3G17GM,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74LVC3G17GM,125 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74LVC3G17GM,125?
For technical support, including 74LVC3G17GM,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC3G17GM,125 requirements.
6.How does Aetrix verify that 74LVC3G17GM,125 is sourced from the original manufacturer or authorized distributors?
All 74LVC3G17GM,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC3G17GM,125 meets industry standards.
7.What is the process for return or replacement of 74LVC3G17GM,125?
All 74LVC3G17GM,125 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC3G17GM,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVC3G17GM,125 part is unused and in its original packaging.
Return procedure for 74LVC3G17GM,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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