Diodes Incorporated 74LVC574AT20-13

Overview

74LVC574AT20-13 from Diodes Incorporated is an octal D-type flip-flop with 3-state outputs in TSSOP-20 package, designed for bus interface and data latching in mixed-voltage systems. It operates from 1.65V to 3.6V, delivers ±24mA output drive at V_CC = 3.0V, features IOFF partial power-down protection, and supports 5.5V-tolerant inputs - enabling direct interfacing with 3.3V and 5V logic in PC I/O ports and peripheral controllers.

For engineers reviewing the 74LVC574AT20-13 datasheet, 74LVC574AT20-13 pinout, 74LVC574AT20-13 application, or 74LVC574AT20-13 equivalent, key selection criteria include 3-state bus driving capability, low-voltage operation down to 1.65V, input voltage tolerance up to 5.5V, propagation delay ≤8.1ns at 3.3V, and thermal resistance (θ_JA) of 74°C/W in TSSOP-20.

Technical Context

This device implements eight independent edge-triggered D-type latches synchronized on the rising edge of CLK, with a separate active-low OE control enabling high-impedance output states without affecting internal latch retention. Its Schmitt-trigger inputs improve noise immunity, while IOFF circuitry ensures minimal leakage (<±10μA) during partial power-down.

Designed for capacitive bus loading, it sinks or sources 24mA per output at 3.0V, maintains VOL ≤0.55V and VOH ≥2.3V under full load, and achieves f_MAX = 100MHz at 3.3V with t_PD as low as 3.8ns (typ). All I/O pins accept 5.5V inputs regardless of V_CC, supporting seamless level translation.

Key Specifications

Pinout & Package

TSSOP-20 package (6.4mm × 6.5mm × 1.2mm, 0.65mm pitch), lead-free and RoHS-compliant, optimized for high-density PCB layout with inputs and outputs on opposite sides.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal D-type flip-flop with 3-state output applications.

Compared with SN74LVC574APWR and 74ALVC574PW,118, the 74LVC574AT20-13 offers optimal balance of low ICC (10μA), robust IOFF, and 5.5V input tolerance - making it preferred for mixed-voltage industrial and portable designs requiring guaranteed isolation during power transitions.

Availability

74LVC574AT20-13 is available at Aetrix Electronics and suitable for PC motherboard I/O buffering, embedded peripheral interface design, and power-managed sensor hub applications requiring stable component supply across multi-year production cycles.

Supply support for 74LVC574AT20-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for industrial, computing, and consumer markets.

The 74LVC574A belongs to Diodes' LVC logic family, engineered for low-voltage operation (1.65–3.6V), mixed-signal interoperability, and robust bus-driving performance in space-constrained digital systems.

FAQ

Does the 74LVC574AT20-13 support hot-swap insertion while V_CC is powered?

Yes - its IOFF circuitry actively disables I/O leakage paths when V_CC = 0V, limiting input/output current to ±10μA maximum. This prevents back-driving of live buses and protects upstream drivers during live board replacement, meeting JEDEC JESD78 Class I latch-up immunity (>250mA).

Can OE be toggled asynchronously while CLK is active without corrupting latch states?

Yes - OE controls only output drivers and has no effect on internal latch storage. Data held at Q outputs remains unchanged during OE transitions, allowing real-time bus arbitration while preserving register contents. The function table confirms Q retains Q0 when OE = H, regardless of CLK activity.

What is the maximum capacitive load this device can drive reliably at 100MHz?

At 3.3V supply and 100MHz f_MAX, the device drives up to 50pF with guaranteed timing (t_PD ≤8.1ns, t_W ≥3.0ns). Driving >50pF increases propagation delay and may violate setup/hold margins; for heavier loads, use series termination or reduce clock frequency per Figure 1 load conditions.

Is the TSSOP-20 package compatible with standard reflow profiles for lead-free assembly?

Yes - the 74LVC574AT20-13 is fully RoHS-compliant and rated for peak reflow temperatures up to 260°C (JEDEC J-STD-020). Its thermal resistance (θ_JA = 74°C/W) and package mass are validated for standard Pb-free solder profiles with 60–90s above 217°C and peak ≤260°C.