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NXP Semiconductors 74LVC823ABQ,118

Part No.:
74LVC823ABQ,118
Manufacturer:
NXP Semiconductors
Category:
Flip Flops
Package:
24-VFQFN Exposed Pad
Datasheet:
Aetrix74LVC823ABQ,118.pdf
Description:
IC FF D-TYPE SNGL 9BIT 24DHVQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,897

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Product details

Overview

74LVC823ABQ,118 from Nexperia is a 9-bit positive-edge-triggered D-type flip-flop with independent clock enable (CE), master reset (MR), and 3-state outputs (Q0–Q8), operating from 1.2 V to 3.6 V supply. It features 5 V tolerant inputs/outputs, supports mixed-voltage bus interfacing (3.3 V core ↔ 5 V peripherals), and delivers ≤10 ns propagation delay at 3.3 V for high-speed register applications in industrial control backplanes.

For engineers reviewing the 74LVC823ABQ,118 datasheet, 74LVC823ABQ,118 pinout, 74LVC823ABQ,118 application, or 74LVC823ABQ,118 equivalent, this device serves as a bus-oriented 9-bit latch with precise timing control (tsu = 1.3 ns, th = 1.3 ns @ VCC = 3.3 V), thermal-enhanced DHVQFN24 packaging, and JEDEC-compliant operation across –40 °C to +125 °C.

Technical Context

The 74LVC823ABQ implements nine synchronous D-flip-flops sharing a common clock (CP) input and individually gated by CE and MR. Its 3-state output buffer (controlled by OE) operates independently of register state, enabling non-intrusive bus driving and hold functionality without affecting stored data.

Logic-level translation is enabled by 5 V tolerant I/Os - inputs accept 0–5.5 V regardless of VCC (1.2–3.6 V), and outputs tolerate up to 5.5 V when disabled - allowing safe interfacing between 3.3 V logic domains and legacy 5 V systems without external level shifters.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage 1.2 V to 3.6 V - enables low-power operation in battery-powered or energy-sensitive embedded systems while maintaining compatibility with standard 3.3 V rails.
Input Voltage Range 0 V to 5.5 V - permits direct connection to 5 V logic without clamping diodes or external protection, simplifying mixed-voltage board design.
Propagation Delay (tpd) 1.5 ns (min) to 10.0 ns (max) @ VCC = 3.3 V - ensures deterministic timing for high-speed synchronous data capture in real-time control loops.
Set-up / Hold Time tsu = 1.3 ns, th = 1.3 ns @ VCC = 3.3 V - tight timing margins support reliable sampling at >120 MHz clock rates in noise-controlled environments.
Operating Temperature –40 °C to +125 °C - qualified for under-hood automotive modules, industrial PLC I/O cards, and outdoor telecom infrastructure.
Output Drive Strength ±24 mA @ VCC = 3.0 V - sufficient to drive 50 Ω transmission lines or multiple CMOS/TTL loads without fanout buffers.
Power Dissipation Cap 500 mW (derated above 117 °C) - thermal performance validated for DHVQFN24 package with exposed thermal pad (SOT815-1).

Pinout & Package

DHVQFN24 (SOT815-1) package: 3.5 mm × 5.5 mm × 0.85 mm body, no leads, 24-terminal quad flat layout with exposed thermal pad (non-soldered or floating per datasheet guidance). Pin 1 index area located at top-left corner of top view.

Pin/Terminal Circuit Role Design Meaning
1 CE Active-low clock enable - halts register updates without disturbing stored state; critical for gated clock domains and power-gated subsystems.
2–10 D0–D8 Asynchronous data inputs - each feeds one D-flip-flop; accepts 5 V logic even at 1.2 V VCC, enabling seamless voltage translation.
11 MR Active-low master reset - forces all Qn outputs LOW synchronously; used for system initialization and fault recovery.
12 GND Reference ground plane - pin 12 is electrically isolated thermal pad; must remain floating or tied to GND per layout guidelines.
13 CP Positive-edge clock - triggers simultaneous latching of all Dn inputs meeting tsu/th requirements; edge sensitivity enables precise timing alignment.
14 OE Active-low output enable - controls 3-state buffer independently of register contents; allows shared bus arbitration without data corruption.
15–23 Q0–Q8 3-state registered outputs - present stored data when OE = LOW; enter high-Z when OE = HIGH to prevent bus contention.
24 VCC Core supply rail - powers internal logic and output drivers; decoupling capacitor placement near pin 24 is mandatory for signal integrity.

Key Features

Feature Design Value
5 V tolerant I/Os Enables direct interface between 3.3 V microcontrollers and 5 V sensors/peripherals without level-shifting circuitry, reducing BOM count and PCB area.
Independent OE control Allows output bus drivers to be enabled/disabled without altering internal register state - essential for hot-plug-capable backplane designs.
Flow-through pinout Input (D0–D8) and output (Q0–Q8) pins are arranged on opposite sides of the package, minimizing trace crossovers and improving signal routing efficiency.
JEDEC compliance Meets JESD8-7A (1.65–1.95 V), JESD8-5A (2.3–2.7 V), and JESD8-C/JESD36 (2.7–3.6 V) standards - guarantees interoperability across multi-vendor 3.3 V logic families.
ESD robustness HBM >2000 V, CDM >1000 V - withstands handling and assembly stresses in automated manufacturing without additional protection components.

Applications

Industrial PLC Backplane Automotive Body Control Module

Use Scenario: Latching sensor status (door open/closed, seatbelt fastened) across CAN-connected nodes before aggregation into main ECU.

IC Role / Device Role / Timing Role: 9-bit parallel register capturing asynchronous switch inputs synchronized to a 10 MHz system clock with sub-ns timing margin.

Use Value: Eliminates metastability risk via guaranteed tsu/th compliance at 125 °C ambient, while 5 V tolerance accommodates legacy 5 V switch matrices.

Use Scenario: Isolating and buffering LIN bus transceiver outputs during firmware update to prevent spurious frame transmission.

IC Role / Device Role / Timing Role: 3-state output register holding diagnostic data until OE activation, decoupling transceiver timing from MCU interrupt latency.

Use Value: Prevents bus contention during reprogramming; thermal-enhanced DHVQFN24 ensures stable operation at under-dash temperatures up to 125 °C.

Test Equipment Digital I/O Card Medical Imaging Data Acquisition

Use Scenario: Capturing parallel ADC output words (8-bit + valid flag) from high-speed analog front-ends for FPGA-based waveform analysis.

IC Role / Device Role / Timing Role: Synchronous 9-bit latch aligning sampled data to FPGA clock domain with <10 ns tpd variation across channels.

Use Value: Output skew ≤1.5 ns (Qn-to-Qn) preserves inter-channel timing integrity required for coherent signal reconstruction.

Use Scenario: Buffering X-ray detector pixel data streams prior to compression and storage in portable ultrasound units.

IC Role / Device Role / Timing Role: Low-power 9-bit register holding burst-mode detector outputs while main processor handles DMA transfers.

Use Value: ICC ≤40 μA at 3.6 V minimizes standby current draw, extending battery life in handheld diagnostic devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 9-bit D-type flip-flop applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC823APWR TSSOP24 package (SOT355-1); same electrical specs but 4.4 mm body width and higher thermal resistance (12.4 mW/K derating above 110 °C). Better suited for manual prototyping or lower-density boards where thermal mass is less constrained than in compact medical modules. Select when board space allows larger footprint and thermal management relies more on airflow than conduction.
74LVC823AD,118 SO24 package (SOT137-1); 7.5 mm body width, 16.2 mW/K derating above 119 °C, and higher parasitic capacitance (~18 pF vs 16.4 pF CPD). Preferred for legacy industrial designs requiring through-hole-compatible footprints or compatibility with existing SOIC reflow profiles. Choose for cost-sensitive volume production where thermal performance is secondary to assembly line compatibility.

Compared with SN74LVC823APWR and 74LVC823AD,118, the 74LVC823ABQ,118 offers superior thermal dissipation (15.0 mW/K derating above 117 °C) and smallest footprint (3.5 × 5.5 mm), making it optimal for space-constrained, high-reliability applications like portable medical electronics and automotive ADAS sensor hubs.

Availability

74LVC823ABQ,118 is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive body control modules, test equipment digital I/O cards, and portable medical imaging systems requiring stable component supply across extended temperature ranges.

Supply support for 74LVC823ABQ,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance logic, discrete, and MOSFET solutions optimized for efficiency, reliability, and miniaturization in automotive, industrial, and consumer electronics.

The 74LVC823A series belongs to Nexperia's advanced LVC logic family, engineered specifically for low-voltage, mixed-signal interfacing in thermally demanding environments where 5 V tolerance and precise timing synchronization are critical.

FAQ

Can 74LVC823ABQ,118 operate with VCC = 1.2 V while accepting 5 V inputs?

Yes. The device is fully specified for 5 V tolerant inputs at VCC = 1.2 V to 3.6 V. Input clamp diodes and internal protection circuitry allow VI up to 5.5 V regardless of supply voltage, enabling robust level translation without external components. This behavior is verified per JESD8-7A and confirmed in Table 5 of the datasheet.

What is the maximum clock frequency supported at VCC = 2.5 V?

At VCC = 2.5 V (within the 2.3 V–2.7 V range), the maximum clock frequency is 125 MHz (min) and 100 MHz (max over –40 °C to +125 °C). This is derived from Table 7, where fmax = 125 MHz (min) at VCC = 2.3 V–2.7 V and Tamb = –40 °C to +85 °C, derated to 100 MHz (max) at full temperature range.

Is the exposed thermal pad on pin 12 required to be soldered?

No. Per Figure 6 and footnote (1) in the datasheet, the exposed pad (pin 12) has no electrical or mechanical requirement to be soldered. If soldered, it must remain electrically floating or be connected to GND - never left as a floating conductor. Thermal performance validation assumes proper pad treatment per IPC-7351B guidelines.

How does OE assertion affect internal register state during continuous clocking?

Asserting OE (LOW) enables outputs but does not alter internal flip-flop states; deasserting OE (HIGH) places outputs in high-impedance without resetting or modifying stored data. This independence is explicitly stated in Section 1 ("Operation of the OE input does not affect the state of the flip-flops") and verified in Table 3's function table.

74LVC823ABQ,118 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
74LVC
Package/Case:
24-VFQFN Exposed Pad
Packaging:
Bulk
Product Status:
Active
Function:
Master Reset
Type:
D-Type
Output Type:
Tri-State, Non-Inverted
Number of Elements:
1
Number of Bits per Element:
9
Clock Frequency:
200 MHz
Max Propagation Delay @ V, Max CL:
10ns @ 3.3V, 50pF
Trigger Type:
Positive Edge
Current - Output High, Low:
24mA, 24mA
Voltage - Supply:
1.65V ~ 3.6V
Current - Quiescent (Iq):
10 µA
Input Capacitance:
5 pF
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-DHVQFN (5.5x3.5)

74LVC823ABQ,118 FAQ

1.How can I place an order for 74LVC823ABQ,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVC823ABQ,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74LVC823ABQ,118 reliable?

The price and inventory of 74LVC823ABQ,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVC823ABQ,118 is usually 5 days.

3.What payment methods are accepted for 74LVC823ABQ,118?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVC823ABQ,118 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74LVC823ABQ,118?

74LVC823ABQ,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74LVC823ABQ,118 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVC823ABQ,118?

For technical support, including 74LVC823ABQ,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVC823ABQ,118 requirements.

6.How does Aetrix verify that 74LVC823ABQ,118 is sourced from the original manufacturer or authorized distributors?

All 74LVC823ABQ,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVC823ABQ,118 meets industry standards.

7.What is the process for return or replacement of 74LVC823ABQ,118?

All 74LVC823ABQ,118 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVC823ABQ,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVC823ABQ,118 part is unused and in its original packaging.

Return procedure for 74LVC823ABQ,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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