Diodes Incorporated 74LVCE1G00FZ4-7

Overview

74LVCE1G00FZ4-7 from Diodes Incorporated is a single 2-input positive NAND gate in DFN1410 package, operating from 1.4V to 5.5V supply, with 5.5V-tolerant inputs, ±24mA output drive at 3.3V, and IOFF-enabled partial power-down protection-used for voltage level shifting and mixed-voltage logic interfacing in portable consumer electronics.

For engineers reviewing the 74LVCE1G00FZ4-7 datasheet, 74LVCE1G00FZ4-7 pinout, 74LVCE1G00FZ4-7 application, or 74LVCE1G00FZ4-7 equivalent, key selection criteria include supply voltage flexibility (1.4–5.5V), 5.5V input tolerance, IOFF leakage performance (<10μA), propagation delay (0.6–3.1ns at 3.3V/15pF), and DFN1410 thermal resistance (θJA = 430°C/W).

Technical Context

This CMOS NAND gate implements standard Boolean Y = A·B with totem-pole output, supporting rail-to-rail logic levels across its full 1.4–5.5V VCC range. Its IOFF circuit actively disables outputs during power-down, preventing back-current flow between powered and unpowered domains.

Input thresholds are dynamically scaled (e.g., VIH = 0.65×VCC at 1.4–1.95V), enabling reliable operation across voltage domains. Propagation delay is characterized down to 1.5V (tpd ≤7.2ns @15pF), and output drive strength scales with VCC-delivering –24mA/+24mA at 3.3V per JEDEC-compliant test conditions.

Key Specifications

Pinout & Package

DFN1410 (1.4mm × 1.0mm, 0.5mm pitch) thermally enhanced leadless package with exposed thermal pad. Pin 2 and Pin 5 are internally connected (GND).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND gate logic applications.

Compared with SN74LVC1G00DBVR and 74AUP1G00GW,125, the 74LVCE1G00FZ4-7 uniquely combines 1.4V operation, 5.5V input tolerance, and IOFF-making it the only option for robust, future-proof level-shifting in portable electronics with evolving voltage architectures.

Availability

74LVCE1G00FZ4-7 is available at Aetrix Electronics and suitable for mobile device power sequencing, USB interface level translation, industrial sensor node wake-up logic, and embedded display backlight control requiring stable component supply across extended temperature and voltage ranges.

Supply support for 74LVCE1G00FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for consumer, industrial, and computing markets.

The 74LVCE logic family targets low-voltage, mixed-supply digital interfacing-designed specifically for voltage translation, power sequencing, and glue logic in space- and power-constrained portable electronics.

FAQ

Can the 74LVCE1G00FZ4-7 operate reliably at 1.4V supply?

Yes. The device is fully specified from 1.4V to 5.5V, with switching characteristics validated at 1.5V (tpd ≤7.2ns @15pF). At 1.4V, propagation delay increases slightly but remains within functional limits for non-critical timing paths. Input thresholds scale proportionally (VIH = 0.65×VCC), ensuring noise margins are preserved.

What is the purpose of the NC pin (Pin 6) in the DFN1410 package?

Pin 6 is a no-connect terminal with no internal bond wire or silicon connection. It must remain unconnected on the PCB-neither tied to GND nor VCC. Diodes Incorporated's recommended land pattern isolates this pad to prevent solder bridging or unintended coupling, and thermal modeling confirms no impact on θJA when left floating.

How does IOFF protect the device during partial power-down?

When VCC = 0V, the IOFF circuit disables both output FETs, increasing output impedance to >10MΩ and limiting leakage to <10μA-even with 5.5V applied to inputs or outputs. This prevents reverse current flow into unpowered sections of the system, satisfying IEC 61000-4-2 and JEDEC JESD78 latch-up immunity requirements.

Is the DFN1410 package suitable for reflow soldering in high-volume manufacturing?

Yes. The DFN1410 package is qualified for standard Pb-free reflow profiles (J-STD-20E, peak 260°C). Its 0.5mm pitch, exposed thermal pad, and halogen-free molding compound meet IPC-A-610 Class 2/3 process requirements. Diodes' AP02001 land pattern ensures coplanarity and void-free solder joints under automated placement and reflow.