Diodes Incorporated 74LVCE1G06FZ4-7

Overview

74LVCE1G06FZ4-7 from Diodes Incorporated is a single CMOS inverter buffer/driver with open-drain output, designed for voltage-level shifting and signal isolation in mixed-voltage systems. It operates from 1.4V to 5.5V, tolerates 5.5V inputs, supports partial power-down via IOFF (≤10 µA leakage), delivers 32 mA sink current at 4.5V, and is packaged in RoHS-compliant DFN1410.

For engineers reviewing the 74LVCE1G06FZ4-7 datasheet, 74LVCE1G06FZ4-7 pinout, 74LVCE1G06FZ4-7 application, or 74LVCE1G06FZ4-7 equivalent, key selection criteria include open-drain logic compatibility, IOFF-enabled system power sequencing, 5.5V-tolerant input handling, and DFN1410 thermal performance (θJA = 430°C/W).

Technical Context

This device implements a single inverting logic function with an open-drain output stage, enabling wired-OR/AND configurations and bidirectional level translation. Its IOFF circuit actively disables output during power-down, preventing back-current flow between powered and unpowered domains.

The input structure accepts up to 5.5V regardless of VCC (1.4–5.5V), allowing direct interfacing with legacy 5V logic while operating from low-voltage rails. Propagation delay is specified down to 0.8 ns at 3.3V (CL = 15 pF), supporting high-speed digital control paths.

Key Specifications

Pinout & Package

74LVCE1G06FZ4-7 is housed in a 6-pin DFN1410 (1.4 mm × 1.0 mm, 0.5 mm pitch) package with wettable flanks. Pins 2 and 5 are internally connected (NC); pin 1 is marked by a corner chamfer.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar open-drain inverter applications.

Compared with SN74LVC1G06DBVR and 74LVC1G06GW,125, the 74LVCE1G06FZ4-7 uniquely combines DFN1410 miniaturization, full IOFF compliance, and 32 mA drive at 4.5V-making it optimal for space-constrained, multi-rail embedded systems requiring robust power-state isolation.

Availability

74LVCE1G06FZ4-7 is available at Aetrix Electronics and suitable for industrial sensor interfaces, I²C bus extension, USB enumeration control, and power sequencing enable signals requiring stable component supply and long-term lifecycle support.

Supply support for 74LVCE1G06FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for industrial, computing, and consumer markets.

The 74LVCE1G06 belongs to Diodes' LVCE logic family-designed specifically for low-voltage, mixed-supply applications demanding 5.5V-tolerant inputs, IOFF protection, and open-drain flexibility in miniature packages.

FAQ

Can 74LVCE1G06FZ4-7 be used as a level shifter between 1.8V and 5V logic?

Yes. Its 5.5V-tolerant inputs accept 5V signals while operating from 1.8V VCC, and its open-drain output can be pulled up to any voltage ≤5.5V. This enables bidirectional level translation without external MOSFETs or resistive dividers-provided the pull-up voltage matches the target domain.

What is the purpose of the NC pins (2 and 5) in the DFN1410 package?

Pins 2 and 5 are internally unconnected and serve no electrical function. They must be left floating or tied to GND per Diodes' recommended land pattern (AP02001) to ensure mechanical stability and solder joint integrity-never connected to VCC or signal nets.

Does the IOFF feature require external circuitry to activate?

No. IOFF activates automatically when VCC = 0 V. The internal circuitry detects undervoltage and disables the output FET, limiting leakage to ±10 µA regardless of input voltage (up to 5.5V). No enable pin or external bias is needed.

How does thermal performance compare between DFN1410 and SOT25 packages?

DFN1410 has θJA = 430°C/W versus SOT25's 204°C/W under identical test conditions (FR-4, 2 oz copper), due to smaller pad area. However, its lower θJC (190°C/W vs. 52°C/W) indicates superior junction-to-case conduction-making it preferable when heat is routed through the PCB ground plane rather than ambient air.