Diodes Incorporated 74LVCE1G32FZ4-7

Overview

74LVCE1G32FZ4-7 from Diodes Incorporated is a single 2-input positive OR gate in DFN1410 package, operating from 1.4V to 5.5V supply, with ±24mA output drive at 3.3V, 5.5V-tolerant inputs, and IOFF-enabled partial power-down protection. It performs Boolean Y = A + B logic in voltage-level shifting and bus repeater applications.

For engineers reviewing the 74LVCE1G32FZ4-7 datasheet, 74LVCE1G32FZ4-7 pinout, 74LVCE1G32FZ4-7 application, or 74LVCE1G32FZ4-7 equivalent, this device supports mixed-voltage interfacing, low-power logic translation, and signal isolation during system sleep states-key considerations for portable and multi-rail embedded designs.

Technical Context

This OR gate implements standard totem-pole CMOS output architecture with rail-to-rail switching and guaranteed logic functionality across 1.4V–5.5V V_CC. Its IOFF circuit actively disables outputs during power-down, preventing back-current flow when V_CC = 0V while inputs remain at up to 5.5V.

Input thresholds are dynamically scaled (e.g., V_IH = 0.65×V_CC at 1.4–1.95V), enabling reliable operation across sub-1.8V, 3.3V, and 5V domains. Propagation delay is characterized down to 1.5V (t_PD ≤ 7.2ns @ CL = 15pF), supporting high-speed logic in battery-powered systems.

Key Specifications

Pinout & Package

DFN1410 (1.4mm × 1.0mm, 0.5mm pitch) thermally enhanced leadless package with exposed thermal pad. Pin 2 and Pin 5 are internally connected (GND).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2-input OR gate applications.

Compared with SN74LVC1G32DBVR and 74AUP1G32GW,125, the 74LVCE1G32FZ4-7 uniquely balances wide-voltage operation, robust IOFF, and industrial-grade drive strength-making it optimal for mixed-supply systems requiring both energy efficiency and fault-safe power sequencing.

Availability

74LVCE1G32FZ4-7 is available at Aetrix Electronics and suitable for USB OTG detection, smartphone power sequencing, and industrial sensor hub interfaces requiring stable component supply across automotive, industrial, and consumer electronics programs.

Supply support for 74LVCE1G32FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, specializing in high-performance, high-reliability components for power management, signal integrity, and protection applications.

The 74LVCE logic family targets low-voltage, mixed-supply digital systems-designed specifically for voltage translation, bus buffering, and power-aware logic in portable and industrial electronics.

FAQ

Can 74LVCE1G32FZ4-7 operate reliably at 1.4V supply?

Yes. The device is fully characterized from 1.4V to 5.5V per DS32214 Rev. 2–2. At 1.4V, it delivers t_PD ≤ 7.2ns (CL = 15pF) and VIH/VIL thresholds scaled to 0.65×V_CC/0.35×V_CC, ensuring noise margins >200mV in low-power modes.

What is the function of the NC pad on the DFN1410 package?

The NC pad (Pin 3) is an unconnected metallization area with no internal bond. Diodes Incorporated's AP02001 recommends leaving it floating or connecting it to GND via thermal via-never tying it to V_CC or signal nets-to avoid parasitic coupling or thermal mismatch.

Does IOFF activate automatically when V_CC drops below threshold?

Yes. IOFF engages when V_CC falls below ~0.8V, disabling output drivers regardless of input state. This is intrinsic to the design-not software-configurable-and guarantees <10μA leakage even with 5.5V applied to A/B pins during full power-down.

How does the DFN1410 package affect thermal performance compared to SOT25?

DFN1410 has θ_JA = 430°C/W (vs. 204°C/W for SOT25), but its exposed thermal pad enables effective heat transfer to PCB copper. With two 0.3mm thermal vias under the pad, junction-to-board thermal resistance drops to <45°C/W-making it viable for continuous 24mA operation in compact layouts.