Nexperia USA Inc. 74LVCH2T45GF,115

Overview

74LVCH2T45GF,115 from Nexperia is a dual-bit, dual-supply translating transceiver with 3-state outputs enabling bidirectional level translation between 1.2 V and 5.5 V domains. It features independent VCC(A) and VCC(B) supplies, DIR-controlled data direction (A↔B), IOFF partial power-down protection, and active bus hold on all I/O pins. Used in mixed-voltage FPGA-to-ASIC interconnects where 1.8 V logic interfaces with 3.3 V peripherals.

For engineers reviewing the 74LVCH2T45GF,115 datasheet, 74LVCH2T45GF,115 pinout, 74LVCH2T45GF,115 application, or 74LVCH2T45GF,115 equivalent, key selection criteria include dual-rail voltage flexibility (1.2–5.5 V per rail), suspend-mode high-impedance behavior during power loss, bus hold functionality for floating inputs, and guaranteed timing across –40 °C to +125 °C.

Technical Context

The device implements two independent bidirectional data paths (1A/1B and 2A/2B), each controlled by a single DIR input referenced to VCC(A). Directional control is synchronous: DIR = HIGH enables A→B transmission; DIR = LOW enables B→A transmission. Both ports support 3-state output disable via DIR assertion or power loss.

IOFF circuitry actively disables outputs when either VCC(A) or VCC(B) is at GND, preventing backflow current. Bus hold circuitry maintains valid logic levels on unused A/B port pins without external pull resistors-critical for hot-swap and low-power suspend modes in battery-backed systems.

Key Specifications

Pinout & Package

XSON8 package (SOT1089), 1.35 × 1.0 × 0.5 mm, no leads, 8-terminal surface-mount. Exposed die pad not present; thermal dissipation via solder joint and PCB copper.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply translating transceiver applications.

Compared with SN74AVC2T244RSVR and TXS0102DCUR, the 74LVCH2T45GF,115 uniquely delivers true dual-rail independence, IOFF-enabled power-loss safety, bus hold, and full –40 °C to +125 °C operation-making it the only choice for safety-critical, mixed-voltage, and suspend-capable embedded systems.

Availability

74LVCH2T45GF,115 is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive ADAS camera links, FPGA-to-microcontroller GPIO expansion, and server BMC-to-CPLD communication requiring stable component supply across extended temperature ranges.

Supply support for 74LVCH2T45GF,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable components for automotive, industrial, and consumer markets, with leadership in logic, power, and analog solutions.

The 74LVCH2T45 belongs to Nexperia's advanced level translation portfolio, engineered specifically for robust bidirectional voltage domain bridging in safety-critical and thermally demanding applications.

FAQ

Can 74LVCH2T45GF,115 translate between 1.2 V and 5.0 V simultaneously?

Yes. VCC(A) may be set to 1.2 V while VCC(B) is set to 5.0 V-or vice versa-enabling direct bidirectional translation. The device guarantees correct logic thresholds, drive strength, and timing across this full range per JEDEC standards JESD8-7 and JESD36, with measured tPLH/tPHL ≤ 23.5 ns at –40 °C to +125 °C.

Does the DIR pin require a pull-up or pull-down resistor?

No. DIR has no internal weak pull; it must be actively driven HIGH or LOW by the controlling logic. However, the A/B port pins feature active bus hold, eliminating external resistors there. DIR must be held static during data transfer to prevent metastability or bus contention.

What happens when VCC(A) = 0 V and VCC(B) = 3.3 V?

The device enters suspend mode: both A and B ports go high-impedance (OFF-state), and IOFF circuitry blocks current flow into the A-side pins. This prevents back-driving of the powered 3.3 V domain, protecting downstream circuitry-a key requirement for hot-swap and modular power architectures.

Is the XSON8 (SOT1089) package compatible with standard reflow profiles?

Yes. The 74LVCH2T45GF,115 in SOT1089 uses standard Pb-free solder paste and withstands peak reflow temperatures up to 260 °C per JEDEC J-STD-020. Its 0.5 mm profile and 0.35 mm pitch are compatible with Class 3 IPC-A-610 assembly requirements and AOI inspection.