Diodes Incorporated 74LVCH2T45HK3-7

Overview

74LVCH2T45HK3-7 from Diodes Incorporated is a dual-bit, dual-supply translating transceiver with tri-state outputs and bus-hold inputs, designed for bidirectional voltage-level translation between 1.2V–5.5V domains. It features independent VCC(A) and VCC(B) supplies, DIR-controlled data direction, ±24mA drive at 3.3V, and I_OFF protection enabling partial power-down isolation up to 5.5V. It is used in mobile SoC interconnects where 1.8V/3.3V or 3.3V/5V logic bridging is required.

For engineers reviewing the 74LVCH2T45HK3-7 datasheet, 74LVCH2T45HK3-7 pinout, 74LVCH2T45HK3-7 application, or 74LVCH2T45HK3-7 equivalent, this page delivers verified electrical specs, thermal characteristics, bus-hold behavior, directional control timing, and real-world use cases in portable electronics and embedded interfaces - all grounded in Diodes' DS43361 Rev. 1–2.

Technical Context

The device implements a dual-channel, direction-controlled bidirectional translator with separate supply rails per port (VCC(A) and VCC(B)), each supporting 1.2V–5.5V operation. Logic thresholds scale with respective VCC, enabling robust translation across mixed-voltage systems without external biasing.

Its bus-hold circuitry actively maintains last-valid input state on A/B ports, eliminating need for external pull resistors on unused lines. The I_OFF feature asserts high-impedance on all I/O when either VCC drops to 0V, preventing back-current and ensuring signal integrity during power sequencing.

Key Specifications

Pinout & Package

Package: X2-DFN1210-8 (1.2mm × 1.0mm, 0.5mm pitch, bottom thermal pad). Compact footprint suitable for space-constrained mobile and wearables PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply translating transceiver applications.

Compared with SN74LVC2T45DPWR and TXS0102DCUR, the 74LVCH2T45HK3-7 uniquely combines bus-hold, ±24mA drive, and sub-6ns propagation in an ultra-small DFN package - making it optimal for space-constrained, high-reliability mixed-voltage interconnects where input stability and speed are co-critical.

Availability

74LVCH2T45HK3-7 is available at Aetrix Electronics and suitable for smartphone SoC integration, automotive infotainment interfaces, industrial PLC I/O modules, and SSD controller signal isolation requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74LVCH2T45HK3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for consumer, industrial, and automotive markets.

The 74LVCH2T45 belongs to Diodes' LVC logic family, engineered specifically for low-voltage, multi-rail system interfacing in portable and embedded applications demanding compact size, low power, and robust voltage translation.

FAQ

What is the maximum allowable voltage difference between VCC(A) and VCC(B)?

The 74LVCH2T45HK3-7 permits any combination within its 1.2V–5.5V range per rail - including VCC(A) = 1.2V and VCC(B) = 5.5V simultaneously. Absolute maximum ratings confirm no restriction on differential voltage; only individual rail limits apply (–0.5V to +6.5V).

Can the DIR pin be left unconnected?

No. DIR is a CMOS input referenced to VCC(A) and has no internal pull-up/down. Leaving it floating risks metastability and undefined data direction. Tie to VCC(A) or GND via a 10kΩ resistor if fixed-direction operation is required.

Does the bus-hold feature affect propagation delay or power consumption?

Bus-hold adds ≤100μA leakage per input at 3.0V but does not alter propagation delay specifications. Measured tpLH/tpHL values in DS43361 include bus-hold active - no timing penalty is incurred versus non-bus-hold variants under identical conditions.

Is thermal pad soldering required for X2-DFN1210-8 package reliability?

Yes. The bottom thermal pad is electrically connected to GND and thermally critical. Diodes specifies minimum 80% solder coverage and 2oz copper thermal relief on PCB per DS43361 layout guidelines - omission risks exceeding θ_JA = 295°C/W and premature thermal shutdown.