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NXP Semiconductors 74LVCH32245AEC,557

Part No.:
74LVCH32245AEC,557
Manufacturer:
NXP Semiconductors
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
96-LFBGA
Datasheet:
Aetrix74LVCH32245AEC,557.pdf
Description:
IC TXRX NON-INVERT 3.6V 96LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,598

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Product details

Overview

74LVCH32245AEC,557 from NXP Semiconductors is a 32-bit non-inverting 3-state bus transceiver with four independent direction (nDIR) and output enable (nOE) controls. It operates from 2.3 V to 3.6 V, tolerates 5.5 V on inputs/outputs, and features bus hold on all data inputs-enabling robust mixed-voltage interfacing between 3.3 V and 5 V systems in high-density PCB designs.

For engineers reviewing the 74LVCH32245AEC,557 datasheet, 74LVCH32245AEC,557 pinout, 74LVCH32245AEC,557 application, or 74LVCH32245AEC,557 equivalent, this device delivers deterministic bidirectional data flow control, high-impedance isolation during power sequencing, and JEDEC-compliant voltage-level interoperability across industrial and telecom backplane interfaces.

Technical Context

The 74LVCH32245AEC,557 implements four independent 8-bit transceiver sections (1A/1B through 4A/4B), each with dedicated nDIR and nOE pins enabling granular bus segmentation. Its CMOS architecture supports simultaneous 3.3 V core logic and 5 V tolerant I/O, with bus hold circuitry eliminating external pull-ups on unused inputs.

Direction control is asynchronous and level-sensitive: nDIR = LOW enables A→B transfer; nDIR = HIGH enables B→A transfer; nOE = HIGH forces all outputs into high-impedance state regardless of nDIR. Power-up safety is ensured by tying nOE to VCC via pull-up resistor to prevent bus contention.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage 2.3 V to 3.6 V - Enables direct integration into 3.3 V systems without level-shifting circuitry.
I/O Voltage Tolerance Up to 5.5 V - Allows safe connection to legacy 5 V buses without clamping diodes or external protection.
Propagation Delay 1.0 ns (min) to 6.0 ns (max) at VCC = 3.0–3.6 V - Supports high-speed data transfer in DDR memory buffers and FPGA interconnects.
Bus Hold Current ±75 µA at VCC = 3.0 V - Maintains stable logic states on floating inputs, reducing board-level noise susceptibility.
Operating Temperature −40 °C to +125 °C - Qualified for under-hood automotive modules and industrial motor drives requiring extended thermal range.
ESD Protection HBM > 2000 V, CDM > 1000 V - Meets stringent handling requirements in automated SMT assembly lines.
Package LFBGA96 (SOT536-1), 13.5 × 5.5 × 1.05 mm - Fine-pitch BGA optimized for high I/O density and low-inductance power delivery.

Pinout & Package

74LVCH32245AEC,557 is packaged in a plastic low-profile fine-pitch ball grid array (LFBGA96, SOT536-1) with 96 solder balls arranged in a 13.5 mm × 5.5 mm body and 1.05 mm height. The package includes eight VCC and eight GND balls distributed across the array to minimize ground bounce and supply noise.

Pin/Terminal Circuit Role Design Meaning
nDIR (1–4) Direction control input Active-HIGH signal per section: LOW = A→B transfer; HIGH = B→A transfer; asynchronous operation.
nOE (1–4) Output enable input Active-LOW per section: HIGH = outputs forced to high-impedance; critical for bus arbitration and hot-swap isolation.
1A[0:7]–4A[0:7] Data port A (input/output) Eight-bit bidirectional data lane per section; accepts 0–5.5 V inputs regardless of VCC level.
1B[0:7]–4B[0:7] Data port B (input/output) Eight-bit bidirectional data lane per section; outputs drive to VCC or GND with 5.5 V tolerance in 3-state.
VCC Supply voltage Core logic supply (2.3–3.6 V); eight dedicated balls ensure low-impedance path for dynamic current demands.
GND Ground reference Zero-volt reference; sixteen dedicated balls provide return paths for all I/O and internal switching currents.

Key Features

Feature Design Value
5 V tolerant I/O Enables seamless interface between 3.3 V FPGAs and 5 V peripheral buses without external level shifters.
Bus hold on all data inputs Eliminates need for 10 kΩ external pull-up/down resistors on unused A/B pins, reducing BOM count and layout area.
MULTIBYTE flow-through pinout Standardized A/B port interleaving simplifies PCB routing and minimizes trace length mismatch in high-speed parallel buses.
Low-inductance power delivery Multiple VCC/GND balls reduce simultaneous switching noise (SSN), supporting clean signal integrity up to 100 MHz data rates.
JEDEC compliance Meets JESD8-7A (1.65–1.95 V), JESD8-5A (2.3–2.7 V), and JESD8-C/JESD36 (2.7–3.6 V) standards for interoperability across voltage domains.

Applications

Industrial PLC Backplane Interface FPGA-to-ASIC Data Bridge

Use Scenario: Bidirectional data exchange between 3.3 V FPGA I/O banks and legacy 5 V industrial I/O modules on a shared backplane.

IC Role / Device Role / Timing Role: 32-bit transceiver providing voltage-domain translation and bus isolation during module insertion/removal.

Use Value: Eliminates discrete level shifters and reduces PCB layer count by integrating 5 V tolerance and bus hold in one LFBGA96 package.

Use Scenario: High-speed parallel data handoff between a Xilinx Artix-7 FPGA and a custom ASIC operating at different supply voltages.

IC Role / Device Role / Timing Role: Direction-controlled buffer ensuring setup/hold timing compliance across voltage boundaries with sub-6 ns propagation delay.

Use Value: Enables deterministic latency and eliminates metastability risk in synchronous data transfers without clock domain crossing logic.

Automotive Body Control Module Telecom Line Card Interconnect

Use Scenario: Isolating microcontroller GPIOs from 5 V sensor interfaces in engine bay ECUs exposed to −40 °C to +125 °C ambient.

IC Role / Device Role / Timing Role: Robust transceiver with extended temperature qualification and high-impedance fail-safe behavior during cold cranking.

Use Value: Guarantees bus isolation when VCC drops below 1.2 V, preventing back-driving of MCU pins during power brownouts.

Use Scenario: Interfacing multiple DSPs and PHY chips on a line card where 3.3 V logic must communicate with 5 V analog front-end components.

IC Role / Device Role / Timing Role: Four independent 8-bit channels allow segmented bus control, minimizing contention during packet header/data bursts.

Use Value: Reduces signal skew across 32-bit paths via matched trace routing enabled by flow-through pinout and low-output skew (<1.5 ns).

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus transceiver applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC3245APM Same 32-bit function but in TSSOP-56 package; no bus hold; 1.65–3.6 V supply only; 5 V tolerance limited to 5.5 V on inputs only. Suitable for cost-sensitive consumer boards where BGA assembly is unavailable and external pull-ups are acceptable. Select when footprint compatibility with TSSOP-56 is required and extended temperature range (−40 °C to +125 °C) is not mandatory.
74ALVCH32245EAX Higher speed (tpd ≤ 3.5 ns at 3.3 V); same LFBGA96 package; identical bus hold and 5.5 V tolerance; −40 °C to +85 °C only. Preferred for high-frequency memory interfaces where sub-4 ns propagation delay is critical and extended temperature is unnecessary. Choose when timing margin is constrained and industrial temperature grade is not required-reduces design validation effort.

Compared with SN74LVC3245APM and 74ALVCH32245EAX, the 74LVCH32245AEC,557 uniquely combines extended temperature operation (−40 °C to +125 °C), integrated bus hold, and full 5.5 V I/O tolerance in an LFBGA96 package-making it optimal for automotive and industrial applications demanding reliability under thermal stress and layout simplicity.

Availability

74LVCH32245AEC,557 is available at Aetrix Electronics and suitable for industrial PLC backplanes, FPGA-to-ASIC bridges, automotive body control modules, and telecom line card interconnects requiring stable component supply across extended temperature ranges and mixed-voltage environments.

Supply support for 74LVCH32245AEC,557 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in mixed-signal IC design and automotive-grade qualification.

The 74LVCH32245AEC,557 belongs to NXP's LVCH logic family, engineered specifically for high-reliability, mixed-voltage system interfacing where bus isolation, voltage tolerance, and thermal robustness are critical design requirements.

FAQ

What is the maximum input voltage the 74LVCH32245AEC,557 can tolerate on its I/O pins?

The 74LVCH32245AEC,557 supports up to 5.5 V on all inputs and outputs regardless of VCC level, enabling safe interfacing with 5 V logic while powered from a 2.3–3.6 V supply. This 5 V tolerance is guaranteed across the full operating temperature range (−40 °C to +125 °C) and does not require external clamping components.

Does the 74LVCH32245AEC,557 require external pull-up resistors on unused data inputs?

No. The 74LVCH32245AEC,557 integrates bus hold circuitry on all data inputs (1A–4A and 1B–4B), which actively maintains the last-valid logic state without external components. This feature eliminates the need for 10 kΩ pull-up or pull-down resistors, reducing BOM cost and PCB real estate.

How does the 74LVCH32245AEC,557 ensure bus isolation during power-up and power-down sequences?

The 74LVCH32245AEC,557 achieves safe power sequencing by requiring nOE pins to be tied to VCC via a pull-up resistor. This ensures outputs remain in high-impedance state until VCC stabilizes, preventing bus contention. The minimum resistor value depends on the driver's current-sinking capability, typically ≥10 kΩ.

What is the propagation delay specification for the 74LVCH32245AEC,557 at 3.3 V supply?

At VCC = 3.0–3.6 V and −40 °C to +125 °C, the 74LVCH32245AEC,557 guarantees a maximum propagation delay (tpd) of 6.0 ns for both A→B and B→A directions. Typical delay is 2.4 ns, supporting reliable operation in 100+ MHz parallel bus applications such as memory expansion and FPGA interconnects.

Is the 74LVCH32245AEC,557 qualified for automotive applications?

The 74LVCH32245AEC,557 is specified for −40 °C to +125 °C operation and meets JEDEC standards for industrial use, but it is not officially automotive-qualified (AEC-Q100). For automotive body control modules, it may be used at the designer's risk with full system-level validation; NXP does not warrant suitability for safety-critical vehicle systems.

74LVCH32245AEC,557 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
74LVCH
Package/Case:
96-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Logic Type:
Transceiver, Non-Inverting
Number of Elements:
4
Number of Bits per Element:
8
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
24mA, 24mA
Voltage - Supply:
1.2V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
96-LFBGA (13.5x5.5)

74LVCH32245AEC,557 FAQ

1.How can I place an order for 74LVCH32245AEC,557 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVCH32245AEC,557 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74LVCH32245AEC,557 reliable?

The price and inventory of 74LVCH32245AEC,557 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVCH32245AEC,557 is usually 5 days.

3.What payment methods are accepted for 74LVCH32245AEC,557?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVCH32245AEC,557 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74LVCH32245AEC,557?

74LVCH32245AEC,557 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74LVCH32245AEC,557 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVCH32245AEC,557?

For technical support, including 74LVCH32245AEC,557 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVCH32245AEC,557 requirements.

6.How does Aetrix verify that 74LVCH32245AEC,557 is sourced from the original manufacturer or authorized distributors?

All 74LVCH32245AEC,557 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVCH32245AEC,557 meets industry standards.

7.What is the process for return or replacement of 74LVCH32245AEC,557?

All 74LVCH32245AEC,557 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVCH32245AEC,557, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVCH32245AEC,557 part is unused and in its original packaging.

Return procedure for 74LVCH32245AEC,557:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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