Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

NXP Semiconductors 74LVCH32245AEC/G:5

Name: 74LVCH32245AEC/G:5
Brand: NXP Semiconductors
SKU: 74LVCH32245AEC/G:5
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: 74LVCH32245AEC/G:5

Manufacturer:: NXP Semiconductors

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 96-LFBGA

Datasheet:: 74LVCH32245AEC/G:5.pdf

Description:: IC TXRX NON-INVERT 3.6V 96LFBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,979

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

74LVCH32245AEC/G:5 from NXP Semiconductors is a 32-bit non-inverting 3-state bus transceiver with four independent direction (nDIR) and output enable (nOE) controls, operating from 2.3 V to 3.6 V supply, tolerant to 5.5 V on I/O pins, and specified for −40 °C to +125 °C. It enables bidirectional data flow between mixed-voltage domains (e.g., 3.3 V logic interfacing with 5 V peripherals) in high-density PCB layouts.

For engineers reviewing the 74LVCH32245AEC/G:5 datasheet, 74LVCH32245AEC/G:5 pinout, 74LVCH32245AEC/G:5 application, or 74LVCH32245AEC/G:5 equivalent, key selection criteria include 5 V tolerance on all I/Os, bus hold on all data inputs eliminating external pull-ups, LFBGA96 package compatibility with fine-pitch routing, and guaranteed 3-state isolation during power sequencing.

Technical Context

This device implements four independent 8-bit transceiver sections (1A/1B through 4A/4B), each with dedicated nDIR and nOE control. Direction control determines signal flow (A→B or B→A); nOE asserts high-impedance on both sides when HIGH. Bus hold circuitry actively maintains last-valid logic state on unused data inputs without external components.

It complies with JEDEC standards JESD8-7A (1.65–1.95 V), JESD8-5A (2.3–2.7 V), and JESD8-C/JESD36 (2.7–3.6 V). ESD protection exceeds 2000 V HBM, 200 V MM, and 1000 V CDM, supporting robust operation in industrial environments with variable ground potentials.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply voltage	2.3 V to 3.6 V - Enables direct integration into 3.3 V systems while maintaining compatibility with legacy 2.7 V rails.
I/O voltage tolerance	Up to 5.5 V - Allows safe connection to 5 V buses without level shifters or clamping diodes.
Propagation delay	1.0 ns (min) to 6.0 ns (max) at VCC = 3.0–3.6 V - Supports high-speed data transfer in memory or peripheral interfaces up to ~160 MHz.
Bus hold current	±75 μA at VCC = 3.0 V - Ensures stable input state retention without external biasing, reducing BOM count and layout area.
Operating temperature	−40 °C to +125 °C - Qualified for under-hood automotive modules, industrial PLC backplanes, and telecom line cards.
Power dissipation capacitance	18.5 pF per buffer at VCC = 3.0–3.6 V - Enables accurate dynamic power estimation for thermal design in dense FPGA/ASIC interconnects.
Output drive strength	24 mA sink/source at VCC = 3.0 V - Drives standard TTL loads and multiple CMOS inputs with controlled edge rates.

Pinout & Package

Package: LFBGA96 (SOT536-1), plastic low-profile fine-pitch ball grid array, 13.5 × 5.5 × 1.05 mm body, 96 solder balls.

Pin/Terminal	Circuit Role	Design Meaning
1A[0:7], 1B[0:7]–4A[0:7], 4B[0:7]	Data I/O pairs per section	Eight bidirectional data lines per of four independent transceiver banks; A-side and B-side are electrically symmetric and interchangeable per section.
1DIR–4DIR	Direction control input (active HIGH)	Determines data flow direction per section: DIR = LOW → A→B; DIR = HIGH → B→A; no internal pull-up/pull-down.
1OE–4OE	Output enable input (active LOW)	Asserts 3-state (high-Z) on both A and B ports of corresponding section; must be pulled HIGH via resistor during power-up to prevent bus contention.
VCC	Supply voltage	Eight dedicated VCC balls (C3/C4/F3/F4/L3/L4/P3/P4) minimize IR drop and supply noise in high-current switching scenarios.
GND	Ground reference	Sixteen GND balls distributed across package perimeter reduce ground bounce and improve signal integrity for all 32 data paths.

Key Features

Feature	Design Value
5 V tolerant I/Os	Enables direct interface between 3.3 V ASIC/FPGA and 5 V legacy peripherals (e.g., EEPROMs, displays, sensors) without external level translators.
Integrated bus hold	Eliminates need for 32 external pull-up/pull-down resistors on data inputs, saving PCB area, BOM cost, and assembly steps in space-constrained modules.
MULTIBYTE flow-through pinout	Standardized A/B pairing and linear ball mapping (e.g., 1A0–1A7 adjacent, 1B0–1B7 mirrored) simplifies trace routing and reduces crosstalk in high-speed parallel buses.
Low-inductance power delivery	Multiple VCC/GND ball pairs distributed across package footprint suppress simultaneous switching noise (SSN), critical for clean timing in DDR or address/data multiplexed systems.
Wide temperature range	Guaranteed operation from −40 °C to +125 °C supports deployment in engine control units, base station RF modules, and industrial motor drives without derating.

Applications

Industrial PLC Backplane Interface	Automotive Body Control Module
Use Scenario: Interfacing a 3.3 V microcontroller unit to legacy 5 V sensor clusters and actuator drivers across a modular backplane. IC Role / Device Role / Timing Role: Bidirectional voltage-level agnostic data bridge between MCU and mixed-voltage peripherals, with per-section direction and enable control. Use Value: Eliminates discrete level shifters and pull-up networks, reducing component count by ≥34 parts per module while maintaining deterministic 3-state isolation during reset.	Use Scenario: Isolating CAN controller I/O from 5 V LIN transceivers and dashboard display drivers in a centralized body electronics gateway. IC Role / Device Role / Timing Role: Voltage-tolerant bus transceiver managing shared data lines between sub-systems with different supply domains and power sequencing requirements. Use Value: Prevents bus contention during partial power-up; bus hold maintains valid logic states on un-driven lines, avoiding spurious interrupts or latch-up in safety-critical subsystems.
FPGA-to-ASIC Parallel Interconnect	Telecom Line Card Data Multiplexing
Use Scenario: Connecting a 3.3 V FPGA I/O bank to a 2.5 V ASIC with 5 V tolerant test access ports in a reconfigurable compute accelerator card. IC Role / Device Role / Timing Role: High-speed, low-skew (≤1.5 ns) bidirectional data conduit enabling synchronous handshaking between heterogeneous logic devices. Use Value: Achieves <6 ns propagation delay with matched rise/fall times, supporting reliable 160 Mbps parallel transfers without added timing margin or retiming logic.	Use Scenario: Aggregating status signals from eight 5 V line interface units (LIUs) onto a single 3.3 V management processor bus in a carrier-grade DSLAM. IC Role / Device Role / Timing Role: Multi-section transceiver providing isolated, direction-controlled data paths for real-time fault reporting and configuration updates. Use Value: Four independent OE/DIR controls allow dynamic partitioning of the 32-bit bus-enabling concurrent read/write operations across distinct LIU groups without software arbitration overhead.

Industrial PLC Backplane Interface

Automotive Body Control Module

Use Scenario: Interfacing a 3.3 V microcontroller unit to legacy 5 V sensor clusters and actuator drivers across a modular backplane.

IC Role / Device Role / Timing Role: Bidirectional voltage-level agnostic data bridge between MCU and mixed-voltage peripherals, with per-section direction and enable control.

Use Value: Eliminates discrete level shifters and pull-up networks, reducing component count by ≥34 parts per module while maintaining deterministic 3-state isolation during reset.

Use Scenario: Isolating CAN controller I/O from 5 V LIN transceivers and dashboard display drivers in a centralized body electronics gateway.

IC Role / Device Role / Timing Role: Voltage-tolerant bus transceiver managing shared data lines between sub-systems with different supply domains and power sequencing requirements.

Use Value: Prevents bus contention during partial power-up; bus hold maintains valid logic states on un-driven lines, avoiding spurious interrupts or latch-up in safety-critical subsystems.

FPGA-to-ASIC Parallel Interconnect

Telecom Line Card Data Multiplexing

Use Scenario: Connecting a 3.3 V FPGA I/O bank to a 2.5 V ASIC with 5 V tolerant test access ports in a reconfigurable compute accelerator card.

IC Role / Device Role / Timing Role: High-speed, low-skew (≤1.5 ns) bidirectional data conduit enabling synchronous handshaking between heterogeneous logic devices.

Use Value: Achieves <6 ns propagation delay with matched rise/fall times, supporting reliable 160 Mbps parallel transfers without added timing margin or retiming logic.

Use Scenario: Aggregating status signals from eight 5 V line interface units (LIUs) onto a single 3.3 V management processor bus in a carrier-grade DSLAM.

IC Role / Device Role / Timing Role: Multi-section transceiver providing isolated, direction-controlled data paths for real-time fault reporting and configuration updates.

Use Value: Four independent OE/DIR controls allow dynamic partitioning of the 32-bit bus-enabling concurrent read/write operations across distinct LIU groups without software arbitration overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus transceiver applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74LVC3245APM	Same 32-bit architecture and 5 V tolerance, but uses TSSOP-56 package (14 × 6.2 mm) with gull-wing leads instead of LFBGA96; higher thermal resistance (θJA = 70 °C/W vs. 35 °C/W).	Preferred for prototyping or low-volume boards where reworkability and socket compatibility outweigh density constraints.	Select SN74LVC3245APM when manual soldering, visual inspection, or field repair is required; avoid in thermally constrained or high-reliability automotive modules.
74ALVCH32245AEC	Pin-compatible variant with ALVC logic family: wider supply range (2.3–3.6 V same), but lower drive strength (12 mA vs. 24 mA at 3.0 V) and higher static current (ICC ≤ 80 μA vs. ≤ 40 μA).	Suitable for ultra-low-power battery-backed monitoring nodes where peak drive capability is secondary to quiescent current minimization.	Choose 74ALVCH32245AEC only when system-level power budget demands sub-50 μA ICC and full 24 mA drive is unnecessary; verify timing margins with reduced slew rate.

Compared with SN74LVC3245APM and 74ALVCH32245AEC, the 74LVCH32245AEC/G:5 delivers superior thermal performance and drive strength in the smallest footprint, making it optimal for production-grade high-density interconnects where board space and power efficiency are co-constrained.

Availability

74LVCH32245AEC/G:5 is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and telecom infrastructure requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for 74LVCH32245AEC/G:5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The 74LVCH32245AEC/G:5 belongs to NXP's LVCH logic family, designed specifically for high-speed, low-power, mixed-voltage bus interfacing in space- and reliability-constrained embedded systems.

FAQ

What is the maximum allowable input voltage on data pins of the 74LVCH32245AEC/G:5?

The 74LVCH32245AEC/G:5 supports up to 5.5 V on all data input pins regardless of VCC level, enabling safe interfacing with 5 V logic families without external clamping. This rating is absolute and applies even when VCC = 0 V, provided input current remains within ±50 mA limits per the datasheet limiting values table.

How does the bus hold feature function on the 74LVCH32245AEC/G:5, and which pins support it?

The bus hold circuit is integrated on all data input pins (1A[0:7] through 4B[0:7]) of the 74LVCH32245AEC/G:5, actively maintaining the last-valid logic state without external resistors. It is disabled when VI > VCC, allowing 5.5 V inputs; control pins (nDIR/nOE) do not have bus hold. Sustaining current is ±75 μA at VCC = 3.0 V.

Can the 74LVCH32245AEC/G:5 operate reliably during power-up sequences where VCC ramps slowly?

Yes - the 74LVCH32245AEC/G:5 enters high-impedance state when VCC = 0 V and maintains 3-state outputs during power ramp. To ensure isolation before VCC stabilizes, tie all nOE pins to VCC via a pull-up resistor (minimum value determined by driver sink capability); this prevents bus contention in multi-rail systems.

What is the pin compatibility status between 74LVCH32245AEC/G:5 and other members of the LVCH family?

The 74LVCH32245AEC/G:5 shares identical pinout, functionality, and electrical characteristics with all 74LVCH32245A variants (e.g., 74LVCH32245ABQ, 74LVCH32245APW), differing only in packaging (LFBGA96 vs. TSSOP-56 vs. HVQFN-56). No PCB redesign is needed when migrating between these packages if mechanical constraints permit.

Does the 74LVCH32245AEC/G:5 meet automotive qualification standards?

No - the 74LVCH32245AEC/G:5 is specified for −40 °C to +125 °C operation but is not AEC-Q100 qualified. It lacks automotive-specific stress testing, failure analysis reporting, and PPAP documentation. For automotive use, NXP recommends the pin-compatible AEC-Q100 qualified 74LVCH32245AQEC variant.

74LVCH32245AEC/G:5 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: 74LVCH

Package/Case:: 96-LFBGA

Packaging:: Tray

Product Status:: Obsolete

Logic Type:: Transceiver, Non-Inverting

Number of Elements:: 4

Number of Bits per Element:: 8

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 24mA, 24mA

Voltage - Supply:: 1.2V ~ 3.6V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 96-LFBGA (13.5x5.5)

74LVCH32245AEC/G:5 FAQ

1.How can I place an order for 74LVCH32245AEC/G:5 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVCH32245AEC/G:5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74LVCH32245AEC/G:5 reliable?

The price and inventory of 74LVCH32245AEC/G:5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVCH32245AEC/G:5 is usually 5 days.

3.What payment methods are accepted for 74LVCH32245AEC/G:5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVCH32245AEC/G:5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74LVCH32245AEC/G:5?

74LVCH32245AEC/G:5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74LVCH32245AEC/G:5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVCH32245AEC/G:5?

For technical support, including 74LVCH32245AEC/G:5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVCH32245AEC/G:5 requirements.

6.How does Aetrix verify that 74LVCH32245AEC/G:5 is sourced from the original manufacturer or authorized distributors?

All 74LVCH32245AEC/G:5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVCH32245AEC/G:5 meets industry standards.

7.What is the process for return or replacement of 74LVCH32245AEC/G:5?

All 74LVCH32245AEC/G:5 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVCH32245AEC/G:5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVCH32245AEC/G:5 part is unused and in its original packaging.

Return procedure for 74LVCH32245AEC/G:5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-03 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-01 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…