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NXP Semiconductors 74LVCH32245AEC/G,5

Part No.:
74LVCH32245AEC/G,5
Manufacturer:
NXP Semiconductors
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
96-LFBGA
Datasheet:
Aetrix74LVCH32245AEC/G,5.pdf
Description:
IC TXRX NON-INVERT 3.6V 96LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,381

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Product details

Overview

74LVCH32245AEC/G,5 from NXP Semiconductors is a 32-bit non-inverting 3-state bus transceiver with four independent direction (nDIR) and output enable (nOE) controls. It operates from 2.3 V to 3.6 V, tolerates 5.5 V on I/O pins, and supports mixed 3.3 V/5 V system interfacing in high-density PCBs. Used for bidirectional data routing between ASICs, FPGAs, and memory subsystems.

For engineers reviewing the 74LVCH32245AEC/G,5 datasheet, 74LVCH32245AEC/G,5 pinout, 74LVCH32245AEC/G,5 application, or 74LVCH32245AEC/G,5 equivalent, key selection criteria include 5 V tolerance, bus hold on all data inputs, LFBGA96 package compatibility, and −40 °C to +125 °C industrial temperature operation.

Technical Context

This transceiver implements four parallel 8-bit bidirectional channels, each with dedicated nDIR and nOE control. Direction logic determines signal flow (A→B or B→A), while active-low nOE forces outputs into high-impedance state-enabling clean bus isolation during power-up/down sequences.

Bus hold circuitry eliminates external pull-ups on all 32 data inputs, and CMOS design ensures low static current (≤160 µA at VCC = 3.6 V). Input clamping allows safe 5.5 V application even when VCC = 0 V, supporting hot-swap and mixed-voltage domain resilience.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage 2.3 V to 3.6 V - Enables direct integration with 2.5 V/3.3 V logic rails without level shifters.
I/O Voltage Tolerance Up to 5.5 V - Permits connection to legacy 5 V peripherals without damage or external protection.
Propagation Delay 1.0 ns (min) to 6.0 ns (max) at VCC = 3.0–3.6 V - Supports >100 MHz data transfer in synchronous bus architectures.
Bus Hold Current ±75 µA at VCC = 3.0 V - Maintains stable logic states on floating inputs, removing need for 10 kΩ pull-up/down resistors.
Operating Temperature −40 °C to +125 °C - Qualified for under-hood automotive ECUs, industrial PLCs, and telecom base station modules.
ESD Protection HBM >2000 V, CDM >1000 V - Reduces field failure risk during handling and board assembly.
Package LFBGA96 (SOT536-1), 13.5 × 5.5 × 1.05 mm - Fine-pitch BGA optimized for high I/O density and thermal dissipation in compact designs.

Pinout & Package

Package: Plastic low-profile fine-pitch ball grid array (LFBGA96), 96-ball layout, body size 13.5 mm × 5.5 mm × 1.05 mm, compliant with JEDEC MO-245.

Pin/Terminal Circuit Role Design Meaning
nDIR (1–4) Direction control input Active-HIGH signal per channel selecting A→B (nDIR = H) or B→A (nDIR = L) data flow.
nOE (1–4) Output enable input Active-LOW signal disabling all 8 outputs in corresponding channel to high-impedance state.
1A[0:7]–4A[0:7] Data port A (input/output) Eight bidirectional I/O pins per channel; internally connected to A-side bus segment.
1B[0:7]–4B[0:7] Data port B (input/output) Eight bidirectional I/O pins per channel; internally connected to B-side bus segment.
VCC Power supply Single 2.3–3.6 V rail powering all logic and I/O buffers; eight dedicated VCC balls minimize supply noise.
GND Ground reference Zero-volt reference with sixteen GND balls ensuring low-inductance return paths and reduced ground bounce.

Key Features

Feature Design Value
5 V tolerant I/O Enables direct interface with 5 V TTL/CMOS devices without level-shifting circuitry or voltage dividers.
Integrated bus hold Eliminates 32 external pull-up resistors on data inputs, reducing BOM count, board area, and assembly cost.
MULTIBYTE flow-through pinout Standardized A/B port interleaving simplifies PCB routing and minimizes trace length mismatch across byte lanes.
Low-noise power delivery Multiple VCC/GND balls and low-inductance layout suppress switching noise, improving signal integrity in high-speed buses.
Hot-swap capable High-impedance state at VCC = 0 V and 5.5 V-tolerant I/O allow safe insertion/removal in live backplane systems.

Applications

Industrial PLC Backplane Interface Automotive ADAS Sensor Hub

Use Scenario: Bidirectional data exchange between FPGA-based motion controller and multiple I/O expansion modules over a 32-bit parallel bus.

IC Role / Device Role / Timing Role: Bus transceiver managing isolated read/write cycles between master and slave modules with precise timing control via nOE/nDIR.

Use Value: 5 V tolerance accommodates legacy analog I/O cards; bus hold prevents glitches during module hot-swap; −40 °C to +125 °C rating ensures reliability in cabinet environments.

Use Scenario: Aggregating camera, radar, and ultrasonic sensor data streams into a central domain controller using shared parallel memory-mapped interfaces.

IC Role / Device Role / Timing Role: Signal-direction-controlled transceiver enabling time-critical sensor data forwarding while isolating fault domains during error recovery.

Use Value: Low propagation delay (<6 ns) meets real-time latency budgets; ESD robustness (>2000 V HBM) withstands vehicle EMI; LFBGA96 footprint fits space-constrained ADAS ECUs.

Telecom Line Card Buffering Test Equipment Digital Pattern Generator

Use Scenario: Level translation and bus isolation between 3.3 V FPGA fabric and 5 V legacy line interface units (LIUs) in modular telecom switches.

IC Role / Device Role / Timing Role: Voltage-agile transceiver providing galvanic isolation between voltage domains while preserving signal edge integrity.

Use Value: 5.5 V I/O tolerance avoids external clamping diodes; 1.05 mm profile enables stacking with adjacent BGA components; JEDEC JESD8-C compliance ensures interoperability.

Use Scenario: Driving high-fanout digital stimulus patterns from pattern generator ASICs to DUTs requiring 5 V logic levels.

IC Role / Device Role / Timing Role: Output-buffering transceiver converting low-voltage internal signals to robust 5 V-compatible waveforms with controlled slew rate.

Use Value: 24 mA drive strength supports heavy capacitive loads; tpd < 6 ns maintains pattern fidelity at 100+ MHz; bus hold prevents undefined states during pattern pauses.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus transceiver applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC3245APM Same 32-bit function but 100-pin TQFP package; no bus hold; max VIO = 3.6 V only. Requires external pull-ups; unsuitable for hot-swap or floating-bus scenarios where bus hold is critical. Select when board space permits TQFP and system does not require 5 V tolerance or automatic input stabilization.
74ALVCH32245AEC/G,5 Pin-compatible upgrade with 1.65–3.6 V supply range and improved tpd (0.8 ns min); identical LFBGA96 footprint. Supports lower-voltage SoCs (e.g., 1.8 V cores); delivers faster timing margin in high-frequency bus designs. Choose for new designs targeting enhanced speed/power efficiency while retaining mechanical and logic compatibility.

Compared with SN74LVC3245APM, 74LVCH32245AEC/G,5 adds bus hold and 5.5 V I/O tolerance-critical for ruggedized systems-while 74ALVCH32245AEC/G,5 extends voltage range downward and improves propagation delay, offering a drop-in performance upgrade.

Availability

74LVCH32245AEC/G,5 is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive ADAS sensor hubs, telecom line cards, and automated test equipment requiring stable component supply across extended temperature ranges.

Supply support for 74LVCH32245AEC/G,5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with core expertise in mixed-signal IC design and high-reliability packaging.

The 74LVCH32245AEC/G,5 belongs to NXP's LVCH logic family, engineered for robust mixed-voltage interfacing in harsh-environment embedded systems where signal integrity, ESD resilience, and thermal stability are mission-critical.

FAQ

What is the maximum input voltage the 74LVCH32245AEC/G,5 can tolerate on its I/O pins?

The 74LVCH32245AEC/G,5 supports up to 5.5 V on all I/O pins regardless of VCC level-including when VCC = 0 V-enabling safe interfacing with 5 V logic families and hot-swap operation without external clamping components. This rating is validated per JEDEC JESD8-C and confirmed in Table 4 of the official datasheet.

Does the 74LVCH32245AEC/G,5 require external pull-up resistors on unused data inputs?

No. The 74LVCH32245AEC/G,5 integrates bus hold circuitry on all 32 data inputs (1A[0:7] through 4B[0:7]), actively maintaining valid logic states without external components. This feature eliminates the need for 32 individual pull-up resistors, reducing BOM cost and PCB area while preventing floating-input-induced noise.

What is the operating temperature range specified for the 74LVCH32245AEC/G,5?

The 74LVCH32245AEC/G,5 is rated for −40 °C to +125 °C ambient operation, verified across static and dynamic parameters in Tables 5 and 6 of the datasheet. This extended range qualifies it for under-hood automotive modules, industrial motor drives, and outdoor telecom infrastructure where thermal cycling is severe.

How many independent directional control inputs does the 74LVCH32245AEC/G,5 have?

The 74LVCH32245AEC/G,5 features four dedicated direction control inputs-1DIR, 2DIR, 3DIR, and 4DIR-each governing one 8-bit channel. This architecture allows granular bidirectional data flow management across four separate bus segments, enabling flexible partitioning in multi-processor or modular system designs.

What package type is used for the 74LVCH32245AEC/G,5 and how many terminals does it have?

The 74LVCH32245AEC/G,5 uses the LFBGA96 package (SOT536-1), a 96-ball fine-pitch ball grid array with dimensions 13.5 mm × 5.5 mm × 1.05 mm. It contains 8 VCC, 16 GND, 4 nDIR, 4 nOE, and 64 I/O balls (32 A-side + 32 B-side), totaling 96 terminations as defined in Table 2 and Figure 3 of the datasheet.

74LVCH32245AEC/G,5 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
74LVCH
Package/Case:
96-LFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Logic Type:
Transceiver, Non-Inverting
Number of Elements:
4
Number of Bits per Element:
8
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
24mA, 24mA
Voltage - Supply:
1.2V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
96-LFBGA (13.5x5.5)

74LVCH32245AEC/G,5 FAQ

1.How can I place an order for 74LVCH32245AEC/G,5 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVCH32245AEC/G,5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74LVCH32245AEC/G,5 reliable?

The price and inventory of 74LVCH32245AEC/G,5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVCH32245AEC/G,5 is usually 5 days.

3.What payment methods are accepted for 74LVCH32245AEC/G,5?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVCH32245AEC/G,5 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74LVCH32245AEC/G,5?

74LVCH32245AEC/G,5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74LVCH32245AEC/G,5 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVCH32245AEC/G,5?

For technical support, including 74LVCH32245AEC/G,5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVCH32245AEC/G,5 requirements.

6.How does Aetrix verify that 74LVCH32245AEC/G,5 is sourced from the original manufacturer or authorized distributors?

All 74LVCH32245AEC/G,5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVCH32245AEC/G,5 meets industry standards.

7.What is the process for return or replacement of 74LVCH32245AEC/G,5?

All 74LVCH32245AEC/G,5 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVCH32245AEC/G,5, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVCH32245AEC/G,5 part is unused and in its original packaging.

Return procedure for 74LVCH32245AEC/G,5:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

74LVCH32245AEC/G,5 Tags

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