Nexperia USA Inc. 74LVT08PW,112

Overview

74LVT08PW,112 from Nexperia is a 3.3 V quad 2-input AND gate in TSSOP14 package, featuring IOFF partial power-down protection, ±32 mA/±64 mA output drive, 5.5 V overvoltage-tolerant inputs, and operation from -40 °C to +85 °C. It serves as a level-shifting logic buffer in mixed-voltage digital systems such as industrial control backplanes and FPGA I/O expansion interfaces.

For engineers reviewing the 74LVT08PW,112 datasheet, 74LVT08PW,112 pinout, 74LVT08PW,112 application, or 74LVT08PW,112 equivalent, key selection criteria include its BiCMOS output drive strength, IOFF-enabled bus isolation during power sequencing, TTL-compatible input thresholds, and TSSOP14 thermal performance under 3.3 V supply conditions.

Technical Context

The 74LVT08PW,112 implements four independent AND gates using BiCMOS process technology, enabling high-speed switching (typ. 3.0 ns tPLH at 3.3 V) with rail-to-rail output swing and robust noise immunity. Its IOFF circuitry actively disables outputs when VCC = 0 V, blocking reverse current flow into powered-down sections of the system bus.

Input clamping supports 5.5 V tolerance regardless of VCC state, allowing safe interfacing with 5 V logic without external resistors. The device complies with JEDEC JESD8C for 2.7–3.6 V operation and meets JESD78 Class II Level B latch-up immunity (>500 mA).

Key Specifications

Pinout & Package

TSSOP14 (SOT402-1) package: 4.4 mm body width, 0.65 mm lead pitch, 1.20 mm max height, optimized for high-density PCB layouts and automated assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad 2-input AND gate applications.

Compared with SN74LVC08APW and 74ALVC08PW, the 74LVT08PW,112 uniquely combines high-current BiCMOS drive, guaranteed IOFF behavior, and superior CDM ESD resilience-making it optimal for mixed-voltage industrial systems requiring bus integrity during dynamic power sequencing.

Availability

74LVT08PW,112 is available at Aetrix Electronics and suitable for industrial backplane interfaces, FPGA I/O expansion, automated test equipment, and programmable logic controller I/O modules requiring stable component supply across extended temperature ranges and mixed-voltage domains.

Supply support for 74LVT08PW,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance logic, analog, and MOSFET solutions with focus on efficiency, reliability, and sustainability in industrial, automotive, and consumer applications.

The 74LVT series targets high-speed, mixed-voltage digital interfacing where robustness, bus isolation, and TTL compatibility are critical-designed specifically for industrial control, test equipment, and FPGA-adjacent signal conditioning.

FAQ

Does 74LVT08PW,112 support hot-swap insertion into a live 5 V bus?

Yes. Its inputs tolerate up to 5.5 V regardless of VCC state, and the IOFF circuit disables outputs when VCC = 0 V, preventing backfeed current. This allows safe insertion into powered-backplane systems provided GND connects first and VCC ramps cleanly after mechanical engagement.

What is the maximum capacitive load this device can drive while maintaining 3.0 ns propagation delay?

At VCC = 3.3 V and Tamb = 25 °C, the typical 3.0 ns tPLH is specified with 50 pF load (per Table 9). Driving >50 pF increases delay linearly-e.g., 100 pF adds ~1.2 ns-so for strict <4 ns timing, keep total load ≤75 pF including trace and probe capacitance.

Can 74LVT08PW,112 replace 74LV08 in an existing design?

No. While both are quad AND gates, 74LVT08PW,112 uses BiCMOS for higher drive (+64 mA sink) and includes IOFF, whereas 74LV08 is standard CMOS with ±6 mA drive and no power-down protection. Substitution requires verifying load current, timing margins, and power sequencing requirements.

Is there a recommended PCB layout practice for minimizing ground bounce with this device?

Yes. Place a 100 nF X7R ceramic capacitor between pins 14 (VCC) and 7 (GND) with vias ≤2 mm from each pad; route GND directly to a solid internal plane; avoid splitting the GND pour under the TSSOP14 body; and keep input traces short and away from noisy switching nodes to preserve noise margin.