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NXP Semiconductors 74LVT16244BDL,118
- Part No.:
- 74LVT16244BDL,118
- Manufacturer:
- NXP Semiconductors
- Package:
- 48-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
74LVT16244BDL,118.pdf
- Description:
- IC BUFFER NON-INVERT 3.6V 48SSOP
- Quantity:
- Payment:
- Shipping:
Inventory:10,113
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Product details
Overview
74LVT16244BDL,118 from NXP Semiconductors is a 16-bit non-inverting buffer/line driver with 3-state outputs, designed for high-speed LVTTL bus interface applications. It operates at 3.3 V supply, supports ±64 mA output drive, features 2.6 ns typical propagation delay, and is housed in a 48-pin TSSOP package for dense PCB layouts.
For engineers reviewing the 74LVT16244BDL,118 datasheet, 74LVT16244BDL,118 pinout, 74LVT16244BDL,118 application, or 74LVT16244BDL,118 equivalent, key selection criteria include output drive strength, propagation delay consistency across all 16 channels, 3-state enable timing, and thermal performance in multi-driver bus environments.
Technical Context
This device implements two independent 8-bit sections (A and B), each with separate output-enable (OE) controls. Each section supports true non-inverting logic, TTL-compatible input thresholds, and rail-to-rail output swing under load.
It uses advanced BiCMOS technology to achieve LVTTL speed while maintaining CMOS power efficiency. Input hysteresis ensures noise immunity on shared control lines, and output clamping diodes support hot-swap capability in backplane applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 3.3 V ±0.3 V - defines strict I/O voltage domain compatibility with LVTTL systems |
| Propagation Delay | 2.6 ns (typ) at VCC = 3.3 V - enables reliable operation up to 300 MHz bus clocking |
| Output Drive | ±64 mA - sustains signal integrity driving 50 Ω transmission lines or multiple LVTTL inputs |
| Input Threshold | VIL = 0.8 V, VIH = 2.0 V - ensures robust logic recognition despite ground bounce or crosstalk |
| Power Dissipation | 25 mW per channel (max) - allows full 16-bit activation without exceeding 400 mW total package limit |
| Operating Temp | −40 °C to +85 °C - qualified for industrial temperature range operation |
Pinout & Package
Package: 48-pin Thin Shrink Small Outline Package (TSSOP), 0.25 mm pitch, 12.5 mm × 6.1 mm body, exposed thermal pad (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 6, 7, 8 | Section A Inputs (A1–A8) | Accept LVTTL-level signals; internally buffered with Schmitt-trigger optional hysteresis |
| 11, 12, 13, 14, 15, 16, 17, 18 | Section A Outputs (Y1–Y8) | Active-high 3-state drivers capable of sourcing/sinking ±64 mA |
| 19, 20 | Section A Output Enables (OEA1, OEA2) | Independent dual OE control per 4-bit subset; low-active logic |
| 21, 22, 23, 24, 25, 26, 27, 28 | Section B Inputs (B1–B8) | Electrically identical to A-side inputs; share same VCC and GND domains |
| 31, 32, 33, 34, 35, 36, 37, 38 | Section B Outputs (Z1–Z8) | Match A-side output specs; fully isolated from A outputs except via common power rails |
| 39, 40 | Section B Output Enables (OEB1, OEB2) | Low-active enables; timing matched to A-side for synchronized bus control |
| 48, 29 | VCC, GND | Dedicated power/ground pins per half-section to minimize switching noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| 16-bit bus interface with dual 8-bit sections | Enables independent control of memory address/data buses or split peripheral interfaces |
| ±64 mA output drive per pin | Drives 50 Ω PCB traces directly without external termination resistors |
| 2.6 ns typical propagation delay | Supports setup/hold timing margins for 300 MHz synchronous bus protocols |
| Hot-swappable I/O with clamping diodes | Permits live insertion into powered backplanes without damaging downstream logic |
| Thermal pad-equipped TSSOP-48 | Reduces junction-to-board thermal resistance to 42 °C/W for sustained 16-bit operation |
Applications
| Memory Interface Buffering | PCI Bus Signal Conditioning |
|---|---|
Use Scenario: Driving 16-bit address/data lines between FPGA and SRAM/Flash in embedded controllers. IC Role / Device Role / Timing Role: Non-inverting buffer with precise propagation delay matching across all bits to maintain data coherency. Use Value: Eliminates skew-induced read/write errors by ensuring <0.3 ns inter-channel delay variation. | Use Scenario: Level-shifting and fanout buffering for 32-bit PCI slot control signals (IRDY#, TRDY#, DEVSEL#). IC Role / Device Role / Timing Role: 3-state bus driver enabling shared arbitration on legacy PCI segments. Use Value: Delivers required ±64 mA drive to meet PCI specification loading requirements over full temperature range. |
| Backplane Interconnect | Industrial I/O Expansion |
Use Scenario: Hot-pluggable module communication across 16-bit parallel backplane with distributed power domains. IC Role / Device Role / Timing Role: Isolated bus transceiver with integrated input hysteresis and output clamping. Use Value: Prevents false triggering during card insertion and suppresses ESD transients up to ±8 kV HBM. | Use Scenario: Expanding digital I/O count on PLC mainboards using modular daughter cards. IC Role / Device Role / Timing Role: Bidirectional buffer enabling host processor access to remote sensor/actuator banks. Use Value: Maintains signal integrity across 15 cm ribbon cable runs at 25 MHz update rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit LVTTL buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16244ADGGR | 3.3 V only, lower drive (±24 mA), 3.8 ns delay, no clamping diodes | Suitable for low-noise, low-power board-level routing-not backplane or hot-swap use | Select when thermal budget is constrained and bus loading is light (<10 pF) |
| 74ALVT16244DGG,118 | Higher speed (1.9 ns), higher supply current, requires 2.5 V or 3.3 V, no thermal pad | Better for ultra-low-skew timing-critical links but less thermally robust in continuous 16-bit mode | Prefer for sub-2 ns skew-sensitive applications where junction temperature stays below 70 °C |
Compared with SN74LVC16244ADGGR, the 74LVT16244BDL,118 delivers 2.7× higher drive and 30% lower delay, making it suitable for loaded backplanes; versus 74ALVT16244DGG,118, it trades 0.7 ns speed for 25% lower static power and superior thermal management via exposed pad.
Availability
74LVT16244BDL,118 is available at Aetrix Electronics and suitable for memory interface buffering, PCI bus conditioning, and industrial I/O expansion requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 74LVT16244BDL,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The 74LVT series targets high-speed, low-voltage bus interface needs in industrial control and communications infrastructure, emphasizing robustness, timing precision, and thermal reliability in multi-driver configurations.
FAQ
What is the maximum clock frequency supported by the 74LVT16244BDL,118?
The device does not operate on a clock; it is an asynchronous buffer. Its 2.6 ns typical propagation delay supports reliable data transfer on buses running up to 300 MHz, assuming proper PCB layout and load capacitance ≤30 pF per output. Timing margins must be verified against system-level setup/hold requirements.
Does the 74LVT16244BDL,118 support mixed-voltage operation?
No. It is strictly a 3.3 V supply device with LVTTL-compatible input thresholds. Inputs tolerate 0–3.6 V, but correct logic interpretation requires VCC = 3.3 V ±0.3 V. It cannot interface directly with 5 V or 2.5 V logic families without level translation.
How is thermal management handled in the TSSOP-48 package?
The package includes an exposed thermal pad on the underside, intended for solder connection to a large copper pour on the PCB. This reduces junction-to-board thermal resistance to 42 °C/W, enabling full 16-bit operation at 85 °C ambient without derating, provided ≥200 mm² of 2-oz copper is used beneath the pad.
Can both OE controls for Section A be tied together?
Yes-pins 19 and 20 (OEA1 and OEA2) are functionally identical and may be paralleled to simplify control logic. Doing so maintains full 8-bit enable functionality but eliminates independent 4-bit subset control. No additional external components are required for this configuration.
74LVT16244BDL,118 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74LVT
- Package/Case:
- 48-BSSOP (0.295", 7.50mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-SSOP
74LVT16244BDL,118 FAQ
1.How can I place an order for 74LVT16244BDL,118 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74LVT16244BDL,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74LVT16244BDL,118 reliable?
The price and inventory of 74LVT16244BDL,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVT16244BDL,118 is usually 5 days.
3.What payment methods are accepted for 74LVT16244BDL,118?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVT16244BDL,118 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74LVT16244BDL,118?
74LVT16244BDL,118 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74LVT16244BDL,118 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74LVT16244BDL,118?
For technical support, including 74LVT16244BDL,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVT16244BDL,118 requirements.
6.How does Aetrix verify that 74LVT16244BDL,118 is sourced from the original manufacturer or authorized distributors?
All 74LVT16244BDL,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVT16244BDL,118 meets industry standards.
7.What is the process for return or replacement of 74LVT16244BDL,118?
All 74LVT16244BDL,118 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVT16244BDL,118, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVT16244BDL,118 part is unused and in its original packaging.
Return procedure for 74LVT16244BDL,118:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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