NXP Semiconductors 74LVTH16245BDGG:51
- Part No.:
- 74LVTH16245BDGG:51
- Manufacturer:
- NXP Semiconductors
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
74LVTH16245BDGG:51.pdf
- Description:
- IC TXRX NON-INVERT 3.6V 48TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,708
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Product details
Overview
74LVTH16245BDGG:51 from Nexperia is a 3.3 V, 16-bit non-inverting bidirectional transceiver with 3-state bus-compatible outputs in both directions, featuring ±64 mA/±32 mA drive capability, TTL-level I/O compatibility with 5 V systems, and bus hold inputs eliminating external pull-ups. It serves as a level-shifting data interface between 3.3 V logic domains and legacy 5 V buses in industrial control backplanes.
For engineers reviewing the 74LVTH16245BDGG:51 datasheet, 74LVTH16245BDGG:51 pinout, 74LVTH16245BDGG:51 application, or 74LVTH16245BDGG:51 equivalent, key selection criteria include its TSSOP48 package, dual-directional 3-state control via nDIR/nOE, bus hold functionality, live insertion support, and guaranteed 1.0 ns propagation delay at 3.0–3.6 V supply.
Technical Context
This BiCMOS transceiver implements independent direction (nDIR) and output enable (nOE) controls per 8-bit port pair, enabling flexible data flow arbitration without external timing constraints. Its bus hold circuitry actively maintains input logic states at VI ≤ 0.8 V or VI ≥ 2.0 V, reducing floating node risks in unconnected or high-impedance system configurations.
The device supports mixed-voltage operation: inputs tolerate up to 5.5 V while powered from 2.7–3.6 V VCC, and outputs drive 5 V buses without current loading due to open-drain-compatible OFF-state behavior. Latch-up immunity exceeds 500 mA per JESD78B Class II, and ESD protection meets HBM >2000 V and MM >200 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Supply Range | 2.7 V to 3.6 V - Ensures stable operation across industrial-grade voltage tolerances and low-power system rails. |
| Drive Strength | +64 mA / −32 mA - Supports high-fanout 3.3 V bus driving and robust interfacing to 5 V TTL loads without external buffers. |
| Propagation Delay | 1.0 ns (typ) at 3.3 V - Enables high-speed data transfer in memory expansion and FPGA-to-ASIC interconnects. |
| Bus Hold Current | ±75 µA to ±135 µA - Maintains valid logic levels on unused inputs, eliminating need for discrete pull-up/pull-down resistors. |
| Input Voltage Range | 0 V to 5.5 V - Allows direct connection to 5 V CMOS/TTL outputs without level shifters in mixed-supply systems. |
| ESD Protection | HBM >2000 V, MM >200 V - Provides robust handling during board assembly and field service in industrial environments. |
| Operating Temperature | −40 °C to +85 °C - Qualified for use in extended-temperature industrial and computing applications. |
Pinout & Package
TSSOP48 package (SOT362-1): plastic thin shrink small outline, 48 leads, body width 6.1 mm, 0.5 mm pitch, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1DIR, 2DIR | Direction control input (active HIGH) | Determines data flow direction per 8-bit port: HIGH enables A→B, LOW enables B→A. |
| 1OE, 2OE | Output enable input (active LOW) | Places corresponding 8-bit port outputs into high-impedance state when HIGH; enables driving when LOW. |
| 1A0–1A7, 2A0–2A7 | Data I/O port A / port B | Bidirectional data terminals; function as inputs or outputs depending on nDIR state and nOE assertion. |
| 1B0–1B7, 2B0–2B7 | Data I/O port A / port B | Paired with A-side pins; same bidirectional behavior, supporting two independent 8-bit channels. |
| VCC | Supply voltage | 3.3 V core power rail; four dedicated pins minimize IR drop and improve noise immunity. |
| GND | Ground reference | Eight ground pins distributed across package for low-inductance return paths and reduced ground bounce. |
Key Features
| Feature | Design Value |
|---|---|
| 16-bit bidirectional bus interface | Two independent 8-bit transceiver channels (1A/1B and 2A/2B) simplify multi-bus arbitration in modular systems. |
| Bus hold on all data inputs | Eliminates external pull resistors and prevents metastability on unterminated or hot-plugged data lines. |
| Live insertion/extraction support | Power-up 3-state and controlled I/O leakage ensure safe hot-swap operation in backplane and modular rack systems. |
| 5 V tolerant inputs with 3.3 V outputs | Enables seamless integration between legacy 5 V peripherals and modern 3.3 V controllers without level translators. |
| No bus current loading at 5 V | Outputs present high impedance to 5 V buses when disabled, preventing contention and power loss in shared bus topologies. |
Applications
| Industrial Backplane Interface | FPGA-to-Memory Expansion |
|---|---|
Use Scenario: Interfacing 3.3 V FPGA I/O banks to legacy 5 V parallel address/data buses in programmable logic carrier boards. IC Role / Device Role / Timing Role: Bidirectional level-translating transceiver managing data flow between FPGA and SRAM/Flash devices with precise direction and enable timing. Use Value: Eliminates discrete level shifters and pull resistors, reduces BOM count by 7 components per channel, and guarantees sub-3.3 ns worst-case propagation. |
Use Scenario: Extending memory bus width in embedded computing modules using dual 8-bit ports for separate address and data lanes. IC Role / Device Role / Timing Role: Synchronized 16-bit data path controller with independent nDIR/nOE per port for time-multiplexed memory access. Use Value: Enables single-chip 16-bit bus extension with <1.0 ns typical skew between lanes, improving memory bandwidth efficiency. |
| Modular PLC I/O Carrier | Test Equipment Signal Routing |
Use Scenario: Hot-pluggable I/O module backplane where fieldbus nodes connect/disconnect while main controller remains active. IC Role / Device Role / Timing Role: Isolation and direction-controlled data bridge with bus hold maintaining signal integrity during insertion/removal events. Use Value: Prevents bus contention during live swap, reduces firmware complexity for hot-swap detection, and ensures deterministic recovery. |
Use Scenario: Reconfigurable signal routing matrix in automated test equipment connecting DUT pins to measurement instruments. IC Role / Device Role / Timing Role: Programmable bidirectional switch fabric with 3-state isolation for signal path selection and isolation. Use Value: Provides nanosecond-level switching with zero DC loading on unused paths, critical for high-accuracy parametric testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16245ADGGR | Lower drive (+24 mA/−24 mA), no bus hold, 1.65–3.6 V VCC range | Suitable for low-power, single-supply 3.3 V systems without 5 V tolerance requirements | Select when cost sensitivity outweighs 5 V interface needs and bus hold is managed externally. |
| 74ALVCH16245PAG | Higher speed (0.9 ns typ), same bus hold and 5 V tolerance, but 48-pin SSOP (SOT370-1) package | Compatible functional replacement with identical pinout but larger footprint and higher thermal resistance | Choose only if existing layout uses SSOP48 and thermal margin permits higher Ptot (500 mW vs. TSSOP's 400 mW). |
Compared with SN74LVC16245ADGGR and 74ALVCH16245PAG, the 74LVTH16245BDGG:51 uniquely balances 5 V tolerance, ±64 mA drive, bus hold, and TSSOP48 compactness-making it optimal for space-constrained industrial backplanes requiring mixed-voltage interoperability.
Availability
74LVTH16245BDGG:51 is available at Aetrix Electronics and suitable for industrial backplane interfaces, FPGA-to-memory expansion, modular PLC I/O carriers, and test equipment signal routing requiring stable component supply and long-term obsolescence management.
Supply support for 74LVTH16245BDGG:51 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global leader in high-performance discrete, logic, and PowerMOS semiconductors, serving automotive, industrial, computing, consumer, and wearable markets with robust, scalable silicon solutions.
The 74LVTH16245BDGG:51 belongs to Nexperia's advanced LVT logic family, engineered for high-speed, mixed-voltage system interfacing with emphasis on reliability, ESD resilience, and thermal efficiency in demanding industrial environments.
FAQ
What is the maximum operating voltage for 74LVTH16245BDGG:51 inputs?
The 74LVTH16245BDGG:51 supports input voltages up to 5.5 V regardless of VCC level, enabling direct connection to 5 V TTL/CMOS outputs without external level shifting. This 5 V tolerance is maintained across the full −40 °C to +85 °C temperature range and is specified in Table 5 of the official Nexperia datasheet Rev. 10.
Does 74LVTH16245BDGG:51 require external pull-up resistors on unused inputs?
No, the 74LVTH16245BDGG:51 integrates bus hold circuitry on all data I/O pins (1A0–1A7, 1B0–1B7, 2A0–2A7, 2B0–2B7), providing ±75 µA to ±135 µA holding current to maintain valid logic states. This eliminates the need for external pull-up or pull-down resistors on floating inputs, reducing BOM count and PCB area.
What is the propagation delay specification for 74LVTH16245BDGG:51 at 3.3 V?
At VCC = 3.3 V and Tamb = 25 °C, the 74LVTH16245BDGG:51 exhibits a typical propagation delay of 1.9 ns (tPLH/tPHL) and worst-case 3.3 ns across the −40 °C to +85 °C range. These values are measured from input transition (20 % to 80 %) to output transition (20 % to 80 %) under loaded conditions per Figure 6 in the datasheet.
Can 74LVTH16245BDGG:51 be used in hot-swap applications?
Yes, the 74LVTH16245BDGG:51 supports live insertion and extraction due to its power-up 3-state behavior, controlled I/O leakage (<±100 µA during power transitions), and bus hold functionality. These features prevent bus contention and signal corruption during hot-plug events in modular backplane systems.
What package type does 74LVTH16245BDGG:51 use and what are its key mechanical dimensions?
The 74LVTH16245BDGG:51 uses the TSSOP48 package (SOT362-1): 48-lead plastic thin shrink small outline with 6.1 mm body width, 0.5 mm lead pitch, and 1.2 mm max height. Its JEDEC MO-153-compliant footprint enables high-density routing while maintaining thermal performance up to 400 mW at +85 °C ambient.
74LVTH16245BDGG:51 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74LVTH
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
74LVTH16245BDGG:51 FAQ
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7.What is the process for return or replacement of 74LVTH16245BDGG:51?
All 74LVTH16245BDGG:51 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVTH16245BDGG:51, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVTH16245BDGG:51 part is unused and in its original packaging.
Return procedure for 74LVTH16245BDGG:51:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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