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NXP Semiconductors 74LVTH322245EC,551
- Part No.:
- 74LVTH322245EC,551
- Manufacturer:
- NXP Semiconductors
- Package:
- 96-LFBGA
- Datasheet:
-
74LVTH322245EC,551.pdf
- Description:
- IC TXRX NON-INVERT 3.6V 96LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:570
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Product details
Overview
74LVTH322245EC,551 from NXP Semiconductors is a 3.3 V, 32-bit bidirectional bus transceiver with integrated 30 Ω series output termination resistors, non-inverting 3-state outputs, four independent direction (nDIR) and output enable (nOE) controls, and bus-hold inputs-designed for memory address drivers, clock distribution, and high-noise-margin bus interfacing in industrial control backplanes.
For engineers reviewing the 74LVTH322245EC,551 datasheet, 74LVTH322245EC,551 pinout, 74LVTH322245EC,551 application, or 74LVTH322245EC,551 equivalent, key selection criteria include its 30 Ω on-die termination, ±12 mA drive strength, TTL-compatible I/O, −40 °C to +125 °C operating range, and LFBGA96 package with 96-ball fine-pitch layout.
Technical Context
This BiCMOS transceiver implements four independent 8-bit bidirectional channels (1A/1B through 4A/4B), each controlled by dedicated nDIR and nOE pins. Each channel supports true 3-state isolation and bidirectional data flow without external direction logic.
It integrates 30 Ω series resistors in both HIGH and LOW output states to suppress transmission-line reflections, eliminates need for external pull-ups via bus-hold circuitry on all data inputs, and supports live insertion/extraction with power-up 3-state behavior and latch-up protection exceeding 500 mA per JESD78 Class II Level A.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.7 V to 3.6 V - Enables stable operation across wide 3.3 V rail tolerances, including noisy industrial power domains. |
| Output Drive | ±12 mA - Sufficient to directly drive 50 Ω transmission lines or multiple TTL loads without external buffers. |
| Propagation Delay | 1.0–3.5 ns (VCC = 3.0–3.6 V) - Supports >300 MHz bus timing in point-to-point or short stub topologies. |
| Input Thresholds | VIL ≤ 0.8 V, VIH ≥ 2.0 V - Ensures robust noise immunity and compatibility with 5 V-tolerant input interfaces. |
| Bus-Hold Current | IBHL = 75–135 µA, IBHH = −135 to −75 µA - Actively holds unused inputs at valid logic levels, removing need for 10 kΩ external pull resistors. |
| Termination Resistance | 30 Ω (integrated series) - Matches typical PCB trace impedance to minimize ringing and EMI in high-speed address/data buses. |
| ESD Protection | HBM > 2000 V, MM > 200 V - Provides handling robustness during board assembly and field service without additional protection devices. |
Pinout & Package
LFBGA96 package: plastic low-profile fine-pitch ball grid array, 13.5 × 5.5 × 1.05 mm body, 96 solder balls, 0.5 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A[0:7], 2A[0:7], 3A[0:7], 4A[0:7] | Data port A (input/output) | Eight-bit bidirectional data terminals per channel; connected to local subsystem (e.g., CPU or FPGA side). |
| 1B[0:7], 2B[0:7], 3B[0:7], 4B[0:7] | Data port B (input/output) | Eight-bit bidirectional data terminals per channel; connected to remote bus (e.g., memory or peripheral side). |
| 1DIR–4DIR | Direction control (active HIGH) | Controls data flow direction per channel: HIGH = A→B, LOW = B→A; enables independent channel routing. |
| 1OE–4OE | Output enable (active LOW) | Places corresponding A/B ports in high-impedance state; allows bus isolation and multi-drop arbitration. |
| VCC | Power supply | 3.3 V core supply; eight dedicated balls (C3, C4, F3, F4, L3, L4, P3, P4) reduce IR drop and improve PSRR. |
| GND | Ground reference | 16 ground balls distributed across package perimeter and center for low-inductance return paths and thermal dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 30 Ω series termination | Eliminates external series resistors on all 32 outputs, reducing BOM count and PCB area while ensuring consistent impedance matching. |
| Bus-hold on all data inputs | Maintains valid logic state on floating A/B pins without external pull resistors, simplifying unconnected or hot-swap scenarios. |
| TTL-compatible I/O voltage thresholds | Supports direct interface to legacy 5 V systems without level shifters, enabling mixed-voltage backplane designs. |
| Live insertion/extraction support | Power-up 3-state and robust ESD/latch-up protection allow safe hot-plug operation in modular rack systems. |
| Four independent channel controls | Enables granular bus segmentation-e.g., isolate memory address vs. data lanes or separate control vs. status channels. |
Applications
| Memory Address Buffering | Industrial Backplane Interface |
|---|---|
|
Use Scenario: Driving 32-bit address lines from a microcontroller to multiple SRAM or Flash devices on a shared bus. IC Role / Device Role / Timing Role: Bidirectional address transceiver with per-channel direction control and 30 Ω termination to suppress reflections on long traces. Use Value: Eliminates need for 32 discrete series resistors and 32 pull-up resistors, reducing component count by 64 parts and improving signal integrity at >100 MHz. |
Use Scenario: Interfacing a 3.3 V FPGA to a 5 V legacy I/O module in an industrial PLC backplane. IC Role / Device Role / Timing Role: Level-shifting bus transceiver with 5 V-tolerant inputs and TTL-compatible outputs, supporting hot-swap capability. Use Value: Enables direct connection without external level translators or protection diodes, while maintaining <3.5 ns propagation delay for deterministic timing. |
| Clock Distribution Hub | Modular System Data Bridge |
|
Use Scenario: Distributing a system clock to multiple synchronous peripherals with matched trace lengths. IC Role / Device Role / Timing Role: Low-skew, terminated clock driver with 3-state control to enable dynamic clock gating per subsystem. Use Value: Integrated 30 Ω resistors dampen edge overshoot/undershoot, reducing jitter accumulation and EMI emissions by >6 dB compared to unterminated drivers. |
Use Scenario: Bridging two isolated 32-bit data buses in a modular test instrument with swappable daughterboards. IC Role / Device Role / Timing Role: Isolated bidirectional data conduit with independent OE/DIR per 8-bit lane for flexible lane allocation. Use Value: Four nOE pins allow selective activation of only active modules, cutting quiescent current by up to 90% versus always-on transceivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVT32245ZQLR | TI part in 96-pin BGA; identical 32-bit function, 30 Ω termination, and 3.3 V operation-but lacks bus-hold inputs and has lower ESD rating (HBM = 2000 V vs. 74LVTH322245EC,551's 2000 V, MM = 200 V same). | Requires external pull-up resistors on unused inputs; less suitable for hot-swap or floating-bus environments. | Select when bus-hold is not required and TI supply chain preference applies. |
| 74ALVCH32245QG | ON Semiconductor part in 96-pin TQFP; same 32-bit transceiver function but no integrated termination resistors-requires external 33 Ω series resistors per line. | Higher BOM cost and PCB area due to 64 external resistors; lacks live-insertion support and has narrower temp range (−40 °C to +85 °C). | Select when TQFP package is mandated and termination can be added externally. |
Compared with SN74LVT32245ZQLR and 74ALVCH32245QG, the 74LVTH322245EC,551 uniquely combines on-die 30 Ω termination, bus-hold inputs, and extended −40 °C to +125 °C operation-making it optimal for ruggedized industrial backplanes where reliability, component count, and thermal margin are critical.
Availability
74LVTH322245EC,551 is available at Aetrix Electronics and suitable for industrial control backplanes, modular test instrumentation, and high-reliability memory subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 74LVTH322245EC,551 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The 74LVTH322245EC,551 belongs to NXP's LVTH logic family-designed specifically for high-speed, low-noise 3.3 V bus interfacing in mission-critical industrial and telecom infrastructure where signal integrity and thermal resilience are paramount.
FAQ
What is the maximum operating temperature range for the 74LVTH322245EC,551?
The 74LVTH322245EC,551 is rated for operation from −40 °C to +125 °C ambient temperature, validated per its LFBGA96 package specification and JEDEC industrial temperature grading. This extended range supports deployment in under-hood automotive modules, industrial motor drives, and base station equipment where thermal margins exceed standard commercial-grade logic.
Does the 74LVTH322245EC,551 require external pull-up resistors on unused inputs?
No-the 74LVTH322245EC,551 features integrated bus-hold circuitry on all A and B data inputs, providing 75–135 µA holding current to maintain valid logic states without external components. This eliminates the need for 10 kΩ pull-up or pull-down resistors on floating pins, simplifying design and reducing BOM cost.
Can the 74LVTH322245EC,551 interface directly with 5 V logic systems?
Yes-the 74LVTH322245EC,551 accepts input voltages up to 5.5 V and provides TTL-compatible output thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V), enabling direct connection to 5 V CMOS or TTL devices without level-shifting circuitry. Its outputs remain compatible with 5 V bus loads even when powered from 3.3 V.
How does the integrated 30 Ω termination in the 74LVTH322245EC,551 improve signal integrity?
The 74LVTH322245EC,551 embeds 30 Ω series resistors in both HIGH and LOW output states, matching typical PCB trace impedances to suppress reflections, reduce ringing, and lower EMI emissions. This eliminates 64 external resistors and ensures consistent termination across all 32 bits-critical for clean edges in memory address and clock distribution.
What package type is used for the 74LVTH322245EC,551 and what are its key mechanical features?
The 74LVTH322245EC,551 uses the LFBGA96 (SOT536-1) package: a 13.5 × 5.5 × 1.05 mm plastic low-profile fine-pitch ball grid array with 96 solder balls on 0.5 mm pitch. It features 8 VCC and 16 GND balls for low-impedance power delivery, optimized for automated reflow assembly and thermal performance in dense industrial PCB layouts.
74LVTH322245EC,551 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74LVTH
- Package/Case:
- 96-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 12mA, 12mA
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-LFBGA (13.5x5.5)
74LVTH322245EC,551 FAQ
1.How can I place an order for 74LVTH322245EC,551 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74LVTH322245EC,551 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74LVTH322245EC,551 reliable?
The price and inventory of 74LVTH322245EC,551 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVTH322245EC,551 is usually 5 days.
3.What payment methods are accepted for 74LVTH322245EC,551?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVTH322245EC,551 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74LVTH322245EC,551?
74LVTH322245EC,551 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74LVTH322245EC,551 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74LVTH322245EC,551?
For technical support, including 74LVTH322245EC,551 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVTH322245EC,551 requirements.
6.How does Aetrix verify that 74LVTH322245EC,551 is sourced from the original manufacturer or authorized distributors?
All 74LVTH322245EC,551 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVTH322245EC,551 meets industry standards.
7.What is the process for return or replacement of 74LVTH322245EC,551?
All 74LVTH322245EC,551 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVTH322245EC,551, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVTH322245EC,551 part is unused and in its original packaging.
Return procedure for 74LVTH322245EC,551:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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