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NXP Semiconductors 74LVTH32245EC,557
- Part No.:
- 74LVTH32245EC,557
- Manufacturer:
- NXP Semiconductors
- Package:
- 96-LFBGA
- Datasheet:
-
74LVTH32245EC,557.pdf
- Description:
- IC TXRX NON-INVERT 3.6V 96LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,971
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Product details
Overview
74LVTH32245EC,557 from NXP Semiconductors is a 3.3 V, 32-bit non-inverting bidirectional bus transceiver with 3-state outputs in both send and receive directions. It features four independent direction (nDIR) and output enable (nOE) controls, bus-hold inputs eliminating external pull-ups, and TTL-compatible I/O capable of interfacing with 5 V systems. It operates across −40 °C to +85 °C and delivers ±64 mA drive strength for high-noise industrial backplane applications.
For engineers reviewing the 74LVTH32245EC,557 datasheet, 74LVTH32245EC,557 pinout, 74LVTH32245EC,557 application, or 74LVTH32245EC,557 equivalent, key selection criteria include its LFBGA96 package, 3.3 V BiCMOS architecture, 1.0 ns typical propagation delay at 3.3 V, bus-hold input retention, and 5 V-tolerant I/O - all critical for legacy-to-modern voltage domain bridging in telecom and embedded computing designs.
Technical Context
The 74LVTH32245EC,557 implements four independent 8-bit transceiver sections (1A/1B through 4A/4B), each controlled by dedicated nDIR and nOE pins. Its BiCMOS process enables TTL-level switching with 3.3 V supply while maintaining 5 V input tolerance and robust output drive (−64 mA sink / +32 mA source).
Bus-hold circuitry actively maintains logic state on unused data inputs without external resistors, and power-up 3-state ensures outputs remain high-impedance during VCC ramp. The device supports live insertion/extraction and exhibits latch-up immunity per JESD78 Class II (>500 mA) and ESD protection exceeding 2000 V HBM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 2.7 V to 3.6 V - ensures stable operation across industrial 3.3 V rail tolerances |
| Propagation Delay | 1.0 ns typical (tPLH/tPHL at VCC = 3.3 V) - enables high-speed 100+ MHz bus timing margins |
| Output Drive | −64 mA sink / +32 mA source - drives heavy capacitive loads and long traces without signal degradation |
| I/O Voltage Tolerance | Input/output compatible with 5 V systems - allows seamless interfacing between 3.3 V logic and legacy 5 V peripherals |
| Bus-Hold Current | ±75 µA to ±135 µA (IBHL/IBHH) - reliably holds unused inputs at valid logic levels without external components |
| Operating Temperature | −40 °C to +85 °C - qualified for extended industrial and telecom equipment environments |
| ESD Protection | 2000 V HBM, 200 V MM - withstands handling and board-level electrostatic events |
Pinout & Package
LFBGA96 package: plastic low-profile fine-pitch ball grid array, 13.5 × 5.5 × 1.05 mm body, 96 solder balls in 12×8 array with A1 index corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A[0:7], 2A[0:7], 3A[0:7], 4A[0:7] | Data port A (input or output) | Eight-bit bidirectional data lanes per section; connected to local-side bus |
| 1B[0:7], 2B[0:7], 3B[0:7], 4B[0:7] | Data port B (input or output) | Eight-bit bidirectional data lanes per section; connected to remote-side bus |
| 1DIR–4DIR | Direction control (active HIGH) | Configures data flow direction per section: A→B when HIGH, B→A when LOW |
| 1OE–4OE | Output enable (active LOW) | Places corresponding A/B ports in high-impedance state when HIGH; isolates buses |
| VCC | Power supply | 3.3 V core supply; 16 balls distributed for low-impedance decoupling |
| GND | Ground | 0 V reference; 16 balls placed for thermal and noise management |
Key Features
| Feature | Design Value |
|---|---|
| Four independent 8-bit transceivers | Enables modular bus segmentation - each section isolated via dedicated nDIR/nOE for flexible system partitioning |
| Bus-hold on all data inputs | Eliminates need for 32 external pull-up/pull-down resistors, reducing BOM count and PCB area in sparse-bus configurations |
| 5 V tolerant inputs/outputs | Permits direct connection to 5 V peripherals without level shifters - simplifies mixed-voltage backplane design |
| Live insertion/extraction support | Allows hot-swap capability in modular chassis systems without powering down adjacent slots or controllers |
| Power-up 3-state | Guarantees outputs remain high-Z during power ramp - prevents bus contention at system startup |
Applications
| Telecom Backplane Interface | Industrial PLC I/O Module |
|---|---|
Use Scenario: Bridging 3.3 V FPGA control logic to legacy 5 V peripheral cards in carrier-grade shelf backplanes. IC Role / Device Role / Timing Role: Bidirectional voltage-domain translator and bus driver with precise 1.0 ns propagation delay control. Use Value: Enables deterministic timing closure across mixed-voltage domains while eliminating 32 external pull-up resistors per slot. |
Use Scenario: Isolating and driving field I/O signals between 3.3 V microcontroller and 5 V sensor/actuator subsystems in programmable logic controllers. IC Role / Device Role / Timing Role: Fault-isolated transceiver with bus-hold retention during hot-swap module replacement. Use Value: Prevents floating inputs during module insertion/removal and sustains bus integrity under EMI-heavy factory floor conditions. |
| Embedded Computing Memory Expansion | Test Equipment Signal Routing |
Use Scenario: Expanding DDR memory address/data bus width in 3.3 V SoM designs requiring compatibility with 5 V test instrumentation interfaces. IC Role / Device Role / Timing Role: High-drive 32-bit buffer with sub-3.5 ns max propagation delay across full temperature range. Use Value: Maintains signal integrity at >100 MHz clock rates while supporting 5 V probe connections without level-shifter overhead. |
Use Scenario: Reconfigurable signal path routing in automated test equipment where multiple DUT interfaces require dynamic bus direction control. IC Role / Device Role / Timing Role: Four-section transceiver enabling independent enable/direction per 8-bit channel pair. Use Value: Reduces test head wiring complexity by consolidating eight discrete transceivers into one LFBGA96 package with pin-defined channel isolation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVT32245GQLR | TI part in 96-pin BGA; identical 32-bit function but uses different bus-hold implementation and has 1.2 ns typical tPLH | Valid for same 3.3 V ↔ 5 V bridging use cases but requires layout review due to distinct ball map and thermal pad configuration | Select when TI supply chain alignment or alternate qualification history is required |
| 74ALVCH32245QG | Nexperia part in LFBGA96; same pinout and bus-hold spec, but rated for −40 °C to +125 °C and offers lower ICC (0.14 mA typical) | Suitable for extended-temperature automotive or industrial control where ambient exceeds +85 °C | Choose for higher-temperature deployments without PCB redesign |
Compared with 74LVTH32245EC,557, SN74LVT32245GQLR provides equivalent functionality with minor timing and packaging variances, while 74ALVCH32245QG extends temperature range and reduces quiescent current - both serve as drop-in alternatives only within their validated operating envelopes and require verification of thermal and signal-integrity behavior in final layout.
Availability
74LVTH32245EC,557 is available at Aetrix Electronics and suitable for telecom backplane interface, industrial PLC I/O modules, and embedded computing memory expansion requiring stable component supply across extended temperature ranges and mixed-voltage interoperability.
Supply support for 74LVTH32245EC,557 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The 74LVTH32245EC,557 belongs to NXP's LVTH logic family, engineered for high-speed, low-voltage bidirectional bus interfacing in mixed-signal systems requiring robust noise immunity and voltage-domain translation.
FAQ
What is the maximum operating frequency supported by the 74LVTH32245EC,557?
The 74LVTH32245EC,557 does not specify a maximum clock frequency in its datasheet, as it is a level-sensitive transceiver, not a clocked device. Its usable data rate depends on propagation delay (1.0 ns typical) and system trace capacitance. At 3.3 V, with 50 pF load, it supports clean signal transmission up to approximately 100 MHz for well-terminated buses - verified via dynamic characterization in Table 7 of the NXP datasheet.
Does the 74LVTH32245EC,557 require external pull-up resistors on its data inputs?
No, the 74LVTH32245EC,557 integrates bus-hold circuitry on all data inputs (1A–4A and 1B–4B), providing ±75 µA to ±135 µA holding current to maintain valid logic states on unused pins. This eliminates the need for external pull-up or pull-down resistors, reducing component count and PCB space - confirmed in Section 1 and Table 6 of the NXP datasheet.
Can the 74LVTH32245EC,557 safely interface with 5 V logic while powered at 3.3 V?
Yes, the 74LVTH32245EC,557 supports 5 V-tolerant inputs and outputs when VCC = 3.3 V. Its VI rating extends to +5.5 V, and VO can swing to +7.0 V in OFF-state, enabling direct connection to 5 V buses without level shifters - specified in Tables 4 and 5 of the NXP datasheet under "Recommended operating conditions" and "Limiting values".
What is the thermal performance of the 74LVTH32245EC,557 in its LFBGA96 package?
The 74LVTH32245EC,557 in LFBGA96 (SOT536-1) has a maximum junction temperature of 150 °C and derates linearly above 70 °C at 1.8 mW/K. Its total power dissipation is rated at 1000 mW under free-air conditions. Thermal performance is enhanced by 16 dedicated GND and 8 VCC balls - detailed in Tables 4, 5, and Figure 8 of the NXP datasheet.
Is the 74LVTH32245EC,557 suitable for hot-swap applications?
Yes, the 74LVTH32245EC,557 explicitly supports live insertion and extraction, as stated in Section 2 ("Features"). Its power-up 3-state behavior, bus-hold inputs, and robust ESD/latch-up protection (2000 V HBM, >500 mA JESD78 Class II) ensure safe operation during hot-plug events in modular systems - confirmed in Sections 2, 7, and 15.3 of the NXP datasheet.
74LVTH32245EC,557 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74LVTH
- Package/Case:
- 96-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 96-LFBGA (13.5x5.5)
74LVTH32245EC,557 FAQ
1.How can I place an order for 74LVTH32245EC,557 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74LVTH32245EC,557 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74LVTH32245EC,557 reliable?
The price and inventory of 74LVTH32245EC,557 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVTH32245EC,557 is usually 5 days.
3.What payment methods are accepted for 74LVTH32245EC,557?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVTH32245EC,557 transactions.
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4.How is shipping managed for 74LVTH32245EC,557?
74LVTH32245EC,557 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74LVTH32245EC,557 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74LVTH32245EC,557?
For technical support, including 74LVTH32245EC,557 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVTH32245EC,557 requirements.
6.How does Aetrix verify that 74LVTH32245EC,557 is sourced from the original manufacturer or authorized distributors?
All 74LVTH32245EC,557 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVTH32245EC,557 meets industry standards.
7.What is the process for return or replacement of 74LVTH32245EC,557?
All 74LVTH32245EC,557 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVTH32245EC,557, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74LVTH32245EC,557 part is unused and in its original packaging.
Return procedure for 74LVTH32245EC,557:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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