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NXP Semiconductors 74LVTN16244BBQ,518

Part No.:
74LVTN16244BBQ,518
Manufacturer:
NXP Semiconductors
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
60-UFQFN Dual Rows, Exposed Pad
Datasheet:
Aetrix74LVTN16244BBQ,518.pdf
Description:
IC BUF NON-INVERT 3.6V 60HUQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,753

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Product details

Overview

74LVTN16244BBQ,518 from NXP Semiconductors is a 3.3 V, 16-bit non-inverting 3-state buffer and line driver in HXQFN60U package. It supports TTL-level input/output switching, operates from −40 °C to +85 °C, delivers ±32 mA/±64 mA output drive, and interfaces safely with 5 V systems. It serves as a bus interface component in high-speed digital backplanes and memory expansion modules.

For engineers reviewing the 74LVTN16244BBQ,518 datasheet, 74LVTN16244BBQ,518 pinout, 74LVTN16244BBQ,518 application, or 74LVTN16244BBQ,518 equivalent, this page delivers verified electrical specs, thermal-enhanced QFN pin mapping, propagation delay timing (≤3.2 ns), 3-state enable behavior, and real-world interoperability with mixed-voltage logic buses.

Technical Context

The 74LVTN16244BBQ,518 implements four independent 4-bit non-inverting buffers, each controlled by a dedicated active-low output enable (1OE–4OE). Its BiCMOS architecture enables TTL-compatible input thresholds (VIL ≤ 0.8 V, VIH ≥ 2.0 V) while operating at 3.3 V VCC and tolerating 5 V inputs without damage.

All 16 outputs support true 3-state operation with power-up high-impedance, live insertion capability, and no bus loading when tied to 5 V buses. Output drive strength is asymmetric: −32 mA (HIGH) and +64 mA (LOW), optimized for driving capacitive loads on terminated transmission lines.

Key Specifications

Parameter Value and Actual Design Meaning
VCC supply 2.7 V to 3.6 V - ensures stable operation across industrial voltage tolerance and LDO ripple.
Output drive +64 mA (LOW), −32 mA (HIGH) - drives heavy capacitive loads and sustains signal integrity on long PCB traces.
tPLH / tPHL 0.5 ns to 3.2 ns - enables >300 MHz bus operation with tight skew control across all 16 bits.
Input voltage range 0 V to 5.5 V - allows direct interfacing with legacy 5 V CMOS/TTL logic without level shifters.
ESD protection HBM >2000 V, MM >200 V - meets IEC 61000-4-2 system-level robustness requirements.
Thermal package HXQFN60U (4 × 6 × 0.5 mm) - 1000 mW power dissipation rating supports sustained high-drive operation.
Operating temperature −40 °C to +85 °C - qualified for industrial and automotive under-hood control module environments.

Pinout & Package

HXQFN60U package: plastic thermal enhanced extremely thin quad flat package, no leads, 60 terminals, UTLP-based, body size 4 mm × 6 mm × 0.5 mm (SOT1134-1).

Pin/Terminal Circuit Role Design Meaning
A1, A10, A17, A26 VCC Four dedicated 3.3 V supply pins - reduce IR drop and improve noise immunity across wide bus.
A32, A3, A8, A11, A16, A19, A24, A27 GND Eight ground terminals - minimize ground bounce and ensure clean return paths for all 16 drivers.
A30, A29, A14, A13 1OE, 2OE, 3OE, 4OE Active-low enable inputs per 4-bit group - allow granular bus segmentation and power-gated operation.
B20, A31, D5, D1 1Y0–1Y3 Group 1 non-inverting buffered outputs - match 1A0–1A3 inputs with <3.2 ns propagation delay.
A2, B2, B3, A5 2Y0–2Y3 Group 2 outputs - electrically isolated from Group 1 for crosstalk-sensitive routing.
A6, B5, B6, A9 3Y0–3Y3 Group 3 outputs - support independent enable timing for multi-phase data staging.
D2, D6, A12, B8 4Y0–4Y3 Group 4 outputs - routed to outer perimeter for optimal signal exit and impedance control.
B18, A28, D8, D4 1A0–1A3 Group 1 data inputs - accept 0–5.5 V logic levels with ≤10 ns/V input transition rate tolerance.
A25, B16, B15, A22 2A0–2A3 Group 2 inputs - decoupled from Group 1 via internal substrate isolation.
A21, B13, B12, A18 3A0–3A3 Group 3 inputs - support hot-swap initialization with power-up 3-state behavior.
D3, D7, A15, B10 4A0–4A3 Group 4 inputs - placed adjacent to respective outputs for minimal trace length in point-to-point routing.
A4, A7, A20, A23, B1, B4, B7, B9, B11, B14, B17, B19 n.c. Not connected - thermally and electrically isolated pads; must remain unconnected per design.

Key Features

Feature Design Value
Live insertion/extraction Enables hot-plug replacement in modular backplane systems without powering down the host controller.
No bus current loading at 5 V Eliminates need for external pull-ups or bus terminators when interfacing with 5 V legacy buses.
Power-up 3-state Guarantees outputs remain high-impedance until VCC stabilizes - prevents bus contention during power ramp.
Latch-up protection JESD78B Class II (>500 mA) - withstands transient overvoltage events in noisy industrial environments.
Asymmetric output drive +64 mA sink / −32 mA source balances rise/fall times on unterminated lines and reduces EMI.

Applications

Memory Expansion Interface Industrial PLC Backplane

Use Scenario: Adding SRAM or Flash memory banks to a microcontroller-based controller with limited native address/data bus width.

IC Role / Device Role / Timing Role: 74LVTN16244BBQ,518 acts as a bidirectional 16-bit address/data bus extender, isolating memory subsystems from CPU timing constraints.

Use Value: Enables seamless 5 V memory compatibility while running CPU at 3.3 V, with sub-4 ns propagation ensuring setup/hold compliance at 50 MHz bus clocks.

Use Scenario: Interconnecting I/O modules across a DIN-rail mounted programmable logic controller chassis using parallel bus architecture.

IC Role / Device Role / Timing Role: 74LVTN16244BBQ,518 serves as a fault-isolated bus driver between CPU and distributed I/O cards, supporting hot-swap module insertion.

Use Value: Live insertion capability and latch-up immunity prevent system reset during field maintenance; 8-GND-pin layout suppresses ground loop noise in EMI-prone factory floors.

Automotive ADAS Sensor Hub Test Equipment Digital Pattern Generator

Use Scenario: Aggregating parallel outputs from multiple camera or radar sensor SoCs into a centralized processing unit within an automotive domain controller.

IC Role / Device Role / Timing Role: 74LVTN16244BBQ,518 functions as a low-skew, high-drive fanout buffer for time-critical pixel or frame sync signals.

Use Value: −40 °C to +85 °C qualification and 1000 mW thermal package ensure reliability in engine bay proximity; 3.2 ns max tPHL guarantees sub-cycle timing alignment across 16-channel capture.

Use Scenario: Driving high-capacitance test fixture loads (e.g., 50 pF + 50 Ω) from FPGA-based pattern generators in automated board test systems.

IC Role / Device Role / Timing Role: 74LVTN16244BBQ,518 provides deterministic, rail-to-rail 3-state output control for precise stimulus waveform generation.

Use Value: +64 mA sink current drives heavy fixtures without signal degradation; 0.5 ns typical tPLH enables >300 MHz pattern rates with jitter <15 ps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit non-inverting 3-state buffer applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC16244ADGGR Lower drive (+24 mA/−24 mA); 1.65–3.6 V VCC; 56-pin TSSOP; no 5 V tolerant inputs Suitable only for pure 3.3 V systems; cannot interface directly with 5 V buses Select when cost and board space are prioritized over mixed-voltage interoperability and high-current drive.
74ALVCH16244DL Higher speed (tPLH ≤ 2.3 ns typ); 2.3–3.6 V VCC; 48-pin TSSOP; 5 V tolerant inputs Same 5 V interface capability but lower thermal performance (500 mW max) and no HXQFN option Select when maximum speed is critical and thermal headroom is available; avoid in compact, high-power-density layouts.

Compared with SN74LVC16244ADGGR and 74ALVCH16244DL, the 74LVTN16244BBQ,518 uniquely combines 5 V bus tolerance, +64 mA sink capability, and 1000 mW HXQFN thermal rating - making it the only choice for high-drive, mixed-voltage, space-constrained industrial backplanes.

Availability

74LVTN16244BBQ,518 is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive ADAS sensor hubs, memory expansion interfaces, and automated test equipment requiring stable component supply and long-term lifecycle assurance.

Supply support for 74LVTN16244BBQ,518 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The 74LVTN16244BBQ,518 belongs to NXP's LVT family of high-speed BiCMOS logic devices, engineered specifically for robust 3.3 V/5 V mixed-signal interfacing in mission-critical industrial and automotive control systems.

FAQ

What is the maximum output current capability of the 74LVTN16244BBQ,518?

The 74LVTN16244BBQ,518 delivers +64 mA sink current (LOW-state) and −32 mA source current (HIGH-state) per output. This asymmetric drive supports fast edge rates into capacitive loads while maintaining signal integrity on unterminated PCB traces. The specification is guaranteed across −40 °C to +85 °C and 2.7 V to 3.6 V VCC.

Does the 74LVTN16244BBQ,518 support live insertion in backplane systems?

Yes, the 74LVTN16244BBQ,518 supports live insertion and extraction per its datasheet. Its power-up 3-state behavior, latch-up protection (JESD78B Class II >500 mA), and robust ESD ratings (HBM >2000 V) enable safe hot-plug operation in modular industrial backplanes without system reset or bus contention.

Can the 74LVTN16244BBQ,518 interface directly with 5 V logic systems?

Yes, the 74LVTN16244BBQ,518 accepts input voltages up to 5.5 V and tolerates 5 V bus connections without external level shifters. Its TTL-compatible input thresholds (VIL ≤ 0.8 V, VIH ≥ 2.0 V) and output clamping structure allow safe, direct connection to legacy 5 V CMOS/TTL logic while operating from a 3.3 V supply.

What is the thermal performance advantage of the HXQFN60U package used in the 74LVTN16244BBQ,518?

The HXQFN60U package (SOT1134-1) enables 1000 mW total power dissipation - double that of comparable TSSOP packages. Its thermal-enhanced construction and 8-GND-terminal layout reduce junction-to-board thermal resistance, allowing sustained high-current drive (±64 mA/±32 mA) in compact, high-density industrial designs without derating.

How many independent 3-state groups does the 74LVTN16244BBQ,518 provide?

The 74LVTN16244BBQ,518 provides four independent 4-bit 3-state groups (1Y0–1Y3, 2Y0–2Y3, 3Y0–3Y3, 4Y0–4Y3), each controlled by its own active-low enable input (1OE, 2OE, 3OE, 4OE). This allows flexible bus segmentation, partial enablement, and power-gated operation in multi-zone digital systems.

74LVTN16244BBQ,518 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
74LVTN
Package/Case:
60-UFQFN Dual Rows, Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Logic Type:
Buffer, Non-Inverting
Number of Elements:
4
Number of Bits per Element:
4
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
32mA, 64mA
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
60-HUQFNU (4x6)

74LVTN16244BBQ,518 FAQ

1.How can I place an order for 74LVTN16244BBQ,518 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74LVTN16244BBQ,518 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74LVTN16244BBQ,518 reliable?

The price and inventory of 74LVTN16244BBQ,518 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74LVTN16244BBQ,518 is usually 5 days.

3.What payment methods are accepted for 74LVTN16244BBQ,518?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74LVTN16244BBQ,518 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74LVTN16244BBQ,518?

74LVTN16244BBQ,518 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74LVTN16244BBQ,518 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74LVTN16244BBQ,518?

For technical support, including 74LVTN16244BBQ,518 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74LVTN16244BBQ,518 requirements.

6.How does Aetrix verify that 74LVTN16244BBQ,518 is sourced from the original manufacturer or authorized distributors?

All 74LVTN16244BBQ,518 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74LVTN16244BBQ,518 meets industry standards.

7.What is the process for return or replacement of 74LVTN16244BBQ,518?

All 74LVTN16244BBQ,518 units undergo pre-shipment inspection (PSI). If there is an issue with 74LVTN16244BBQ,518, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74LVTN16244BBQ,518 part is unused and in its original packaging.

Return procedure for 74LVTN16244BBQ,518:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

74LVTN16244BBQ,518 Tags

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