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Texas Instruments 74SSTL16847DGGRE4
- Part No.:
- 74SSTL16847DGGRE4
- Manufacturer:
- Texas Instruments
- Package:
- 64-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
74SSTL16847DGGRE4.pdf
- Description:
- IC BUF NON-INVERT 3.6V 64TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,993
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Product details
Overview
74SSTL16847DGGRE4 from Texas Instruments is a 20-bit SSTL_3 interface buffer with 3-state outputs, designed for 3.0–3.6 V VCC/VDDQ operation, supporting SSTL_3 Class I and II specifications, featuring flow-through pinout, and operating across 0°C to 70°C for memory subsystem signal conditioning in DDR SDRAM interfaces.
For engineers reviewing the 74SSTL16847DGGRE4 datasheet, 74SSTL16847DGGRE4 pinout, 74SSTL16847DGGRE4 application, or 74SSTL16847DGGRE4 equivalent, key selection criteria include SSTL_3 input/output compatibility, 3-state enable timing (ten ≤ 4.1 ns, tdis ≤ 4.9 ns), VREF = 0.45 × VDDQ reference tracking, and thermal impedance of 73°C/W in the 64-pin TSSOP package.
Technical Context
This device implements a noninverting, 20-channel unidirectional buffer with independent output-enable (OE) control per bank. It uses dual supply domains: VCC powers logic circuitry and OE inputs, while VDDQ supplies the SSTL_3 output drivers-enabling clean separation between core logic and I/O termination.
The architecture supports precise SSTL_3 signaling via dedicated VREF input (1.3–1.7 V), matched to VTT = VREF ± 50 mV, and meets AC/DC VIH/VIL thresholds (±400 mV AC, ±200 mV DC around VREF). Input and output capacitances are characterized at 2–3.5 pF, minimizing signal integrity impact in high-speed parallel buses.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 3.0 V to 3.6 V - powers internal logic and OE control without requiring external level-shifting |
| VDDQ Range | 3.0 V to 3.6 V - supplies SSTL_3 output drivers; must match memory bus voltage |
| VREF Range | 1.3 V to 1.7 V - set to 0.45 × VDDQ; defines AC/DC switching thresholds for SSTL_3 compliance |
| tpd (A→Y) | 1.5 ns to 3.0 ns - ensures sub-3 ns propagation delay under Class I/II load conditions (10/30 pF) |
| ten / tdis | 1.5–4.9 ns - enables fast, predictable 3-state entry/exit timing critical for burst-mode memory access |
| IOH / IOL | –20 mA / +20 mA - provides sufficient drive strength for point-to-point or lightly loaded SSTL_3 stubs |
| JA | 73°C/W - specifies thermal performance in DGG package; informs heatsink or airflow requirements |
Pinout & Package
Packaged in a 64-pin Plastic Thin Shrink Small-Outline Package (DGG), 10.0 mm × 12.5 mm body, 0.5 mm pitch, with exposed thermal pad (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A20 | Data inputs | Accept SSTL_3 logic levels; referenced to VREF; require stable VTT termination |
| Y1–Y20 | 3-state outputs | Drive SSTL_3 loads; powered by VDDQ; high-impedance when OE = high |
| OE | Output-enable control | Active-low; must be pulled up to VCC during power-up/down to prevent bus contention |
| VREF | Reference voltage input | Defines VIH/VIL thresholds; must be decoupled and matched to VTT within ±50 mV |
| VDDQ | I/O supply | Separate from VCC; supplies only output drivers; requires local 0.1 µF + bulk decoupling |
| VCC | Core logic supply | Powers input buffers, OE logic, and internal control; not used for output drive |
| GND | Ground return | Multiple dedicated GND pins (pins 3, 9, 15, 23, 31, 39, 47, 55, 63) reduce ground bounce |
| NC | No internal connection | Pins 33 and 34 are unused; must remain unconnected per datasheet |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through pinout | Input A1–A20 and output Y1–Y20 aligned on opposite sides minimizes trace crossovers and improves PCB routing efficiency |
| SSTL_3 Class I & II compliance | Fully meets JEDEC SSTL_3 timing, voltage, and loading requirements for both low- and high-capacitance memory interfaces |
| Dual-supply architecture | VCC (logic) and VDDQ (I/O) separation prevents noise coupling from output switching into core logic |
| VREF-referenced thresholds | VIH/VIL dynamically track VDDQ via VREF = 0.45 × VDDQ, ensuring robust noise margin across voltage and temperature |
| ESD & latch-up robustness | Exceeds 2000 V HBM and 200 V MM ESD; latch-up immune to ≥250 mA per JESD 17-suitable for industrial handling |
Applications
| DDR SDRAM Memory Interface | Registered DIMM Address Buffer |
|---|---|
Use Scenario: Driving address/command signals from memory controller to multiple DDR SDRAM chips on a DIMM module. IC Role / Device Role / Timing Role: Unidirectional 20-bit SSTL_3 buffer with 3-state control, providing fanout and signal integrity for clock-aligned command/address busses. Use Value: Enables reliable 133 MHz+ operation with <3 ns propagation delay and matched VIH/VIL thresholds referenced to VREF. | Use Scenario: Isolating and buffering register control lines (e.g., CKE, CS#, ODT) on registered DIMMs. IC Role / Device Role / Timing Role: SSTL_3-compliant 3-state buffer allowing dynamic enable/disable of register access paths during memory initialization or self-refresh. Use Value: Supports precise timing control with ten/tdis ≤ 4.9 ns and eliminates bus contention during mode register writes. |
| Memory Subsystem Signal Re-timing | High-Speed Parallel Bus Isolation |
Use Scenario: Re-timing and re-driving data strobe (DQS) and data mask (DM) signals in multi-rank DDR systems. IC Role / Device Role / Timing Role: Low-skew, low-jitter buffer preserving setup/hold margins across rank boundaries using matched propagation characteristics. Use Value: Delivers 1.5–3.0 ns tpd with <0.5 ns channel-to-channel skew, maintaining timing closure in 2T/4T latency configurations. | Use Scenario: Electrically isolating two SSTL_3 domains (e.g., FPGA I/O bank ↔ memory controller) to suppress ground bounce and crosstalk. IC Role / Device Role / Timing Role: Directional interface buffer with independent OE control enabling bidirectional domain separation via controlled 3-state windows. Use Value: Prevents simultaneous switching noise (SSN) propagation with dedicated VDDQ/GND planes and 9 ground pins reducing ΔI/Δt-induced noise. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SSTL_3 interface buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74SSTL16839DGGR | 18-bit, same DGG package, identical VREF/VDDQ architecture and timing specs | Fewer channels; suitable where 18-bit bus width suffices (e.g., partial address or control lines) | Select when channel count reduction simplifies layout or reduces BOM cost without sacrificing timing or signal integrity |
| SN74SSTL16857DGGR | 20-bit, but includes dual-directional flow-through with separate A→B and B→A paths and independent OE controls | Supports bidirectional data transfer (e.g., DQ lines); adds complexity vs. unidirectional 74SSTL16847DGGRE4 | Choose only if bidirectional buffering is required; otherwise 74SSTL16847DGGRE4 offers lower gate count and simpler control |
Compared with SN74SSTL16839DGGR and SN74SSTL16857DGGR, the 74SSTL16847DGGRE4 delivers optimal balance of channel count, unidirectional simplicity, and proven SSTL_3 timing for address/command buffering-avoiding unnecessary complexity or underutilized capacity.
Availability
74SSTL16847DGGRE4 is available at Aetrix Electronics and suitable for DDR SDRAM memory interfaces, registered DIMM modules, and high-speed parallel bus isolation requiring stable component supply, long-term lifecycle support, and consistent electrical performance across temperature.
Supply support for 74SSTL16847DGGRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions with emphasis on reliability, precision, and industrial-grade qualification.
The Widebus™ family-including the 74SSTL16847DGGRE4-is engineered specifically for high-speed memory interface applications requiring SSTL, GTL, or LVTTL signal conditioning with flow-through packaging and robust noise immunity.
FAQ
What is the recommended power-up sequence for the 74SSTL16847DGGRE4?
Apply VCC first, then VDDQ, and finally assert stable VREF and VTT before enabling OE. Tie OE to VCC via a pullup resistor (value determined by driver sink capability) during power-up/down to ensure outputs remain in high-impedance state and prevent bus contention. The 74SSTL16847DGGRE4 datasheet specifies this sequence to avoid undefined states and potential damage from back-driving.
Does the 74SSTL16847DGGRE4 support both SSTL_3 Class I and Class II loads?
Yes, the 74SSTL16847DGGRE4 is explicitly characterized and compliant with both JEDEC SSTL_3 Class I (CL = 10 pF) and Class II (CL = 30 pF) specifications. Its switching characteristics-tpd ≤ 3 ns, ten ≤ 4.1 ns, tdis ≤ 4.9 ns-are guaranteed across both load conditions, making the 74SSTL16847DGGRE4 suitable for a wide range of DDR memory topologies including point-to-point and multi-drop configurations.
How should VREF be generated and decoupled for the 74SSTL16847DGGRE4?
VREF must be set to 0.45 × VDDQ and maintained within ±50 mV of VTT. Use a precision resistive divider from VDDQ or a dedicated VREF generator IC, with local 0.1 µF ceramic decoupling placed within 5 mm of the 74SSTL16847DGGRE4 VREF pin. The 74SSTL16847DGGRE4 datasheet specifies ±150 µA input current at VREF, so the source must drive this load without droop or noise exceeding the 50 mV window.
Can unused inputs on the 74SSTL16847DGGRE4 be left floating?
No. All unused inputs-including A1–A20 and OE-must be actively held at VCC or GND to prevent increased ICC, oscillation, or ESD susceptibility. TI's application report SCBA004 details risks of floating CMOS inputs. For the 74SSTL16847DGGRE4, tie unused A inputs to GND or VCC through ≤10 kΩ resistors; OE must be pulled up to VCC to maintain 3-state safety during idle periods.
What is the thermal performance limit of the 74SSTL16847DGGRE4 in its DGG package?
The 74SSTL16847DGGRE4 has a junction-to-ambient thermal resistance (JA) of 73°C/W in the standard DGG package with JEDEC-standard board layout. At maximum ICC = 90 mA and worst-case VCC = 3.6 V, power dissipation remains below 324 mW, resulting in ~24°C junction rise above ambient. For continuous operation at 70°C ambient, no additional heatsinking is required-but airflow or copper pour improves margin. This thermal rating applies specifically to the 74SSTL16847DGGRE4 in its defined test environment.
74SSTL16847DGGRE4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74SSTL
- Package/Case:
- 64-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 20
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 20mA, 20mA
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-TSSOP
74SSTL16847DGGRE4 FAQ
1.How can I place an order for 74SSTL16847DGGRE4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74SSTL16847DGGRE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74SSTL16847DGGRE4 reliable?
The price and inventory of 74SSTL16847DGGRE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74SSTL16847DGGRE4 is usually 5 days.
3.What payment methods are accepted for 74SSTL16847DGGRE4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74SSTL16847DGGRE4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74SSTL16847DGGRE4?
74SSTL16847DGGRE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74SSTL16847DGGRE4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74SSTL16847DGGRE4?
For technical support, including 74SSTL16847DGGRE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74SSTL16847DGGRE4 requirements.
6.How does Aetrix verify that 74SSTL16847DGGRE4 is sourced from the original manufacturer or authorized distributors?
All 74SSTL16847DGGRE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74SSTL16847DGGRE4 meets industry standards.
7.What is the process for return or replacement of 74SSTL16847DGGRE4?
All 74SSTL16847DGGRE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74SSTL16847DGGRE4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74SSTL16847DGGRE4 part is unused and in its original packaging.
Return procedure for 74SSTL16847DGGRE4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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