Nexperia USA Inc. 74VHCT126BQ,115

Overview

74VHCT126BQ,115 from Nexperia is a quad non-inverting 3-state buffer/line driver with TTL-compatible inputs, operating at 4.5–5.5 V supply, −40 °C to +125 °C temperature range, and DHVQFN14 (SOT762-1) package. It provides logic-level translation and bus isolation in digital interface circuits, commonly used in industrial control backplanes and FPGA I/O expansion.

For engineers reviewing the 74VHCT126BQ,115 datasheet, 74VHCT126BQ,115 pinout, 74VHCT126BQ,115 application, or 74VHCT126BQ,115 equivalent, key selection criteria include TTL input threshold compatibility (VIL ≤ 0.8 V, VIH ≥ 2.0 V), propagation delay ≤ 7.0 ns (CL = 15 pF, VCC = 5 V), 3-state enable timing (ten ≤ 9.0 ns), and thermal-enhanced QFN packaging for high-density PCB layouts.

Technical Context

This device implements four independent non-inverting buffers, each with an active-HIGH output enable (nOE) controlling high-impedance tri-state outputs. Input pins accept TTL voltage levels while driving CMOS loads, enabling mixed-logic interfacing without level shifters.

Each channel features Schmitt-trigger action on inputs, supports input voltages up to 7.0 V (beyond VCC), and maintains rail-to-rail output swing (VOH ≥ 3.70 V, VOL ≤ 0.55 V at IO = ±8 mA). The DHVQFN14 package provides low thermal resistance (9.6 mW/K derating above 98 °C) and 14-terminal footprint compatible with dual-inline routing conventions.

Key Specifications

Pinout & Package

DHVQFN14 (SOT762-1) package: 2.5 × 3.0 × 0.85 mm body, no leads, exposed thermal pad, 14 terminals, pin 1 index area marked.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad 3-state buffer applications.

Compared with 74LVC126ABQ, the 74VHCT126BQ,115 ensures reliable TTL-level recognition in legacy industrial systems, while versus SN74HCT126QPWRQ1, it delivers 22% lower thermal resistance in the DHVQFN package-critical for fanless PLC modules operating continuously at +125 °C ambient.

Availability

74VHCT126BQ,115 is available at Aetrix Electronics and suitable for industrial backplane interfaces, FPGA I/O expansion, automated test equipment signal routing, and programmable logic controller digital I/O modules requiring stable component supply across extended temperature ranges.

Supply support for 74VHCT126BQ,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and MOSFET solutions for industrial, automotive, and consumer markets.

The 74VHCT series targets robust, pin-compatible replacements for legacy TTL logic in industrial control and infrastructure applications-designed specifically for interoperability, wide temperature operation, and ESD-hardened reliability.

FAQ

What is the maximum clock frequency supported by the 74VHCT126BQ,115?

The 74VHCT126BQ,115 does not operate as a clocked device-it is a combinational buffer with propagation delay ≤7.0 ns (CL = 15 pF, VCC = 5 V). This supports data rates up to ~140 MHz in point-to-point configurations, assuming clean edges and proper termination. Maximum usable frequency depends on system-level factors including trace length, load capacitance, and noise margin.

Can the 74VHCT126BQ,115 drive a 50 pF load at full speed?

Yes. At VCC = 5 V and CL = 50 pF, the device achieves tpd ≤ 9.5 ns and ten ≤ 9.0 ns, maintaining VOL ≤ 0.55 V and VOH ≥ 3.70 V under ±8 mA load. These values are explicitly specified in the datasheet's Dynamic Characteristics table for the DHVQFN14 package across −40 °C to +125 °C.

Is the exposed thermal pad on the DHVQFN14 package electrically connected?

No-the exposed pad on the SOT762-1 (DHVQFN14) package is a thermal slug only, not internally connected to any circuit node. It must be soldered to a PCB thermal plane using a solid copper pour and thermal vias for optimal heat dissipation, but no electrical connection or biasing is required or recommended.

Does the 74VHCT126BQ,115 support partial power-down operation?

No. The device lacks Ioff (power-off protection) or IOZ (high-impedance on power-down) functionality. When VCC = 0 V, inputs and outputs become undefined; VI ratings remain valid up to 7.0 V, but no guaranteed logic behavior or clamping is specified in that state. External isolation or power sequencing is required for true partial-power-down systems.