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Renesas 844003BG-01LF

Part No.:
844003BG-01LF
Manufacturer:
Renesas
Category:
Clock Generators, PLLs, Frequency Synthesizers
Package:
24-TSSOP (0.173", 4.40mm Width)
Datasheet:
Aetrix844003BG-01LF.pdf
Description:
IC FREQ SYNTH 24TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:10,974

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Product details

Overview

844003BG-01LF from Renesas Electronics (formerly IDT) is a 3-output LVDS frequency synthesizer designed for Ethernet reference clock generation. It accepts a 19.53125 MHz or 25 MHz parallel-resonant crystal, delivers three differential LVDS outputs across two independent banks (Bank A: 1 pair; Bank B: 2 pairs), and achieves ≤0.58 ps typical RMS phase jitter at 125–625 MHz - meeting 10GbE jitter requirements. Its primary system role is low-jitter clock synthesis in high-speed networking PHYs and switches.

For engineers reviewing the 844003BG-01LF datasheet, 844003BG-01LF pinout, 844003BG-01LF application, or 844003BG-01LF equivalent, key selection considerations include bank-independent frequency configuration (625/312.5/156.25/125 MHz), 24-pin TSSOP-E package with exposed thermal pad, 3.3 V single-supply operation, LVDS output compliance, and crystal-to-LVDS conversion without external PLL components.

Technical Context

The 844003BG-01LF integrates a third-generation low-phase-noise VCO (490–680 MHz range) with dual independent output divider banks, each controlled by dedicated 2-bit DIV_SEL pins and selectable feedback dividers (÷25 or ÷32). It supports both crystal oscillator interface (18 pF parallel resonant) and single-ended LVCMOS/LVTTL REF_CLK input via XTAL_SEL control.

Its architecture enables simultaneous generation of up to three LVDS clock signals at different frequencies - e.g., 625 MHz on Bank A and 156.25 MHz on Bank B - with bank skew ≤33 ps and inter-bank output skew ≤170 ps. All inputs feature internal pullup/pulldown resistors (51 kΩ typical), and power domains are segregated (VDD, VDDA, VDDO_A, VDDO_B) to minimize noise coupling into sensitive analog and output stages.

Key Specifications

Parameter Value and Actual Design Meaning
Output Count & Type Three differential LVDS output pairs: Bank A (QA0/nQA0), Bank B (QB0/nQB0, QB1/nQB1)
Frequency Range 125 MHz to 625 MHz per bank, configurable independently via DIV_SELA/B[1:0] and FB_DIV
RMS Phase Jitter 0.53 ps (typical) at 625 MHz, 0.56 ps at 156.25 MHz (1.875 MHz – 20 MHz integration band)
VCO Range 490 MHz – 680 MHz; enables precise multiplication of 19.53125/25 MHz crystal inputs
Supply Voltage 3.3 V ±5% across all rails (VDD, VDDA, VDDO_A, VDDO_B); full single-supply operation
Operating Temp 0°C to +70°C ambient; validated for commercial Ethernet infrastructure environments
Package 24-pin TSSOP with exposed thermal pad (G package, 4.40 × 7.80 × 0.925 mm)

Pinout & Package

844003BG-01LF is housed in a lead-free, RoHS-compliant 24-pin TSSOP package with an exposed E-pad for thermal and electrical grounding. The package measures 4.40 mm × 7.80 mm × 0.925 mm and requires PCB land pattern matching the exposed pad area plus thermal vias to ground plane for optimal thermal performance.

Pin/Terminal Circuit Role Design Meaning
1, 24
DIV_SELB0, DIV_SELB1
Bank B frequency select inputs LVCMOS/LVTTL control pins setting Bank B output divider (÷2/÷4/÷5/÷8); internal pullups default to ÷8
2
VCO_SEL
VCO bypass control Active-low pin; when LOW, bypasses PLL and passes crystal/REF_CLK directly to output dividers
3
MR
Master reset Active-HIGH asynchronous reset; forces all Qx outputs LOW and nQx HIGH; internal pulldown enables outputs at power-up
4, 23
VDDO_A, VDDO_B
Bank-specific LVDS output supplies Independent 3.3 V supplies for Bank A and Bank B outputs; enable supply isolation to reduce crosstalk
5, 6
QA0, nQA0
Bank A LVDS output pair Differential LVDS clock output (250–450 mV swing, 1.25–1.41 V common-mode); terminated internally
7, 8
OEB, OEA
Bank B/A output enable Active-HIGH enables respective bank's outputs; internal pullups ensure enabled state at power-up
9
FB_DIV
Feedback divider select Configures PLL feedback divider as ÷25 (default) or ÷32 to support 19.53125 MHz or 25 MHz crystals
10, 11, 14
VDDA, VDD, GND
Analog/core/ground supplies VDDA powers VCO/analog circuitry; VDD powers digital logic; separate routing required for jitter-sensitive operation
12, 13
DIV_SELA0, DIV_SELA1
Bank A frequency select inputs Set Bank A output divider (÷1/÷2/÷3/÷4); internal pullups default to ÷4
15, 16
XTAL_OUT, XTAL_IN
Crystal oscillator interface Supports 18 pF parallel-resonant crystals at 19.53125 MHz or 25 MHz; XTAL_IN also accepts AC-coupled LVCMOS REF_CLK
17
REF_CLK
Single-ended reference input LVCMOS/LVTTL-compatible clock input; internal pulldown allows floating when crystal mode is active
18
XTAL_SEL
Interface selection High = crystal mode (default); Low = REF_CLK mode; internal pullup ensures crystal interface at startup
19–22
nQB1/QB1, nQB0/QB0
Bank B LVDS output pairs Two independent differential LVDS outputs; each pair shares same frequency but may differ from Bank A

Key Features

Feature Design Value
Independent dual-bank frequency synthesis Bank A and Bank B configured separately via dedicated DIV_SEL pins and FB_DIV, enabling mixed-frequency clock trees (e.g., 625 MHz + 156.25 MHz)
Ultra-low phase jitter performance ≤0.58 ps RMS (1.875 MHz – 20 MHz) meets IEEE 802.3ae 10GbE jitter mask without external filtering
Flexible clock source interface Supports either 19.53125/25 MHz crystal (18 pF) or single-ended LVCMOS REF_CLK via pin-selectable XTAL_SEL
Segregated power domains Dedicated VDDA (analog/VCO), VDD (core), and VDDO_A/VDDO_B (LVDS outputs) minimize supply-induced jitter and crosstalk
Thermally enhanced TSSOP package 24-pin TSSOP with exposed E-pad and recommended thermal via array reduces junction temperature rise to <95°C at 70°C ambient

Applications

10GbE PHY Clocking Data Center Switch Fabric

Use Scenario: Generating synchronized 156.25 MHz and 625 MHz reference clocks for multi-lane 10GbE SFP+ transceivers and MAC interfaces.

IC Role / Device Role / Timing Role: Crystal-to-LVDS frequency synthesizer providing low-jitter, bank-isolated clock outputs to separate PHY lanes and switch fabric controllers.

Use Value: Eliminates need for multiple discrete oscillators or complex clock distribution ICs while maintaining sub-1 ps jitter compliance across all lanes.

Use Scenario: Supplying independent clock domains to line cards, packet processors, and SerDes blocks in modular Ethernet switches.

IC Role / Device Role / Timing Role: Dual-bank LVDS synthesizer delivering distinct frequencies (e.g., 312.5 MHz for packet processing, 125 MHz for management CPU) from one crystal.

Use Value: Reduces board space and BOM count versus multiple clock generators; bank-level OEA/OEB enables dynamic clock gating per subsystem.

Optical Transport Network (OTN) Line Cards Industrial Ethernet Controllers

Use Scenario: Providing compliant 622.08 MHz (OC-12) and 155.52 MHz (STM-1) clocks for forward error correction (FEC) and framing logic in OTN line cards.

IC Role / Device Role / Timing Role: Precision frequency synthesizer translating standard crystals into SONET/SDH/OTN line-rate clocks using FB_DIV and DIV_SEL configurations.

Use Value: Achieves required ±20 ppm frequency accuracy and <0.6 ps jitter without external VCXO or loop filter components.

Use Scenario: Delivering deterministic 125 MHz and 250 MHz clocks to real-time industrial Ethernet ASICs (e.g., PROFINET IRT, EtherCAT) in harsh factory environments.

IC Role / Device Role / Timing Role: Robust, single-supply LVDS clock generator supporting 0°C to 70°C operation with integrated power rail isolation.

Use Value: Ensures timing predictability under variable load conditions via segregated VDDO_A/VDDO_B supplies and bank-specific output enables.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LVDS clock synthesizer applications.

Alternative Part Technical Difference Application Difference Selection Advice
Si5338A-D-GM
(Silicon Labs)
Programmable I2C-based synthesizer with wider output frequency range (0.16–350 MHz per output), higher integration (integrated crystal option), but requires external configuration EEPROM or host MCU. Preferred where flexible frequency planning, multi-protocol support (Ethernet, CPRI, PCIe), or crystal-less design is required; not drop-in compatible. Select Si5338A-D-GM when programmability, broader frequency coverage, or embedded crystal option outweighs fixed-function simplicity and lower component count of 844003BG-01LF.
ICS844002AGI-01LF
(Renesas, legacy IDT)
2-output variant (Bank A only) with identical pinout, same VCO architecture and jitter performance, but lacks Bank B outputs and DIV_SELB pins. Suitable only for single-bank applications; cannot replace 844003BG-01LF where three LVDS outputs or independent dual-bank control are required. Choose ICS844002AGI-01LF only if design uses only one LVDS clock domain and board layout accommodates pin-compatible footprint reduction.

Compared with Si5338A-D-GM and ICS844002AGI-01LF, the 844003BG-01LF offers fixed-function simplicity, zero-configuration operation from crystal, and guaranteed 3-output LVDS capability - making it optimal for cost-sensitive, high-volume Ethernet PHY clocking where frequency flexibility is secondary to jitter performance and ease of use.

Availability

844003BG-01LF is available at Aetrix Electronics and suitable for 10GbE PHY clocking, data center switch fabric timing, optical transport network line cards, and industrial Ethernet controller applications requiring stable component supply, RoHS-compliant packaging, and commercial-temperature-grade reliability.

Supply support for 844003BG-01LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader formed through the merger of Renesas Technology and NEC Electronics, specializing in microcontrollers, analog, power, and timing solutions for automotive, industrial, and communications markets.

The 844003BG-01LF belongs to Renesas' FemtoClocks™ family of ultra-low-jitter clock synthesizers, engineered specifically for high-speed serial interface timing in Ethernet, OTN, and datacenter applications where phase noise and deterministic skew directly impact bit-error rate.

FAQ

What crystal specifications are required for reliable operation of the 844003BG-01LF?

The 844003BG-01LF is characterized for use with 18 pF parallel-resonant fundamental-mode crystals operating at 19.53125 MHz or 25 MHz. Crystals must have ESR ≤50 Ω and shunt capacitance ≈7 pF. Drive level must not exceed 1 mW. Using non-compliant crystals may result in start-up failure, frequency inaccuracy, or increased phase jitter beyond datasheet limits.

Can the 844003BG-01LF generate different frequencies on Bank A and Bank B simultaneously?

Yes, the 844003BG-01LF supports independent frequency configuration: Bank A uses DIV_SELA[1:0] and Bank B uses DIV_SELB[1:0], each paired with shared FB_DIV to set the PLL feedback ratio. For example, Bank A can output 625 MHz (DIV_SELA = 00, FB_DIV = 0) while Bank B outputs 156.25 MHz (DIV_SELB = 11, FB_DIV = 0), verified in Tables 3F and 3G of the datasheet.

How does the 844003BG-01LF achieve its low phase jitter specification?

The 844003BG-01LF achieves ≤0.58 ps RMS phase jitter using Renesas' third-generation low-noise VCO architecture (490–680 MHz), fully segregated analog (VDDA) and output (VDDO_A/VDDO_B) power domains, and optimized on-die divider design. Measured jitter values are specified over 1.875 MHz–20 MHz offset bandwidth and validated against 10GbE phase noise masks.

Is the 844003BG-01LF pin-compatible with other devices in the 84400x family?

The 844003BG-01LF shares the same 24-pin TSSOP package and core pinout with the 844002AGI-01LF (2-output variant), but is not pin-compatible with 844004 or 844005 variants due to differing pin functions and counts. Bank B pins (QB0/nQB0, QB1/nQB1, DIV_SELB[1:0]) are unused on the 844002AGI-01LF, requiring PCB redesign for substitution.

What is the purpose of the exposed thermal pad (E-pad) on the 844003BG-01LF package?

The exposed E-pad on the 844003BG-01LF serves dual purposes: thermal dissipation (reducing θJA from 32.1°C/W to <27°C/W with proper via array) and electrical grounding for noise suppression. It must be soldered to a PCB copper land pattern connected to ground via ≥6 thermal vias (12–13 mil diameter, 1 oz plating) to meet jitter and reliability specifications.

844003BG-01LF Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
FemtoClock®
Package/Case:
24-TSSOP (0.173", 4.40mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Type:
Frequency Synthesizer
PLL:
Yes with Bypass
Input:
LVCMOS, LVTTL, Crystal
Output:
LVDS
Number of Circuits:
1
Ratio - Input:Output:
2:3
Differential - Input:Output:
No/Yes
Frequency - Max:
680MHz
Divider/Multiplier:
Yes/No
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
24-TSSOP

844003BG-01LF FAQ

1.How can I place an order for 844003BG-01LF through Aetrix?

Please submit a Request for Quotation (RFQ) for 844003BG-01LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 844003BG-01LF reliable?

The price and inventory of 844003BG-01LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 844003BG-01LF is usually 5 days.

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844003BG-01LF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 844003BG-01LF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 844003BG-01LF?

For technical support, including 844003BG-01LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 844003BG-01LF requirements.

6.How does Aetrix verify that 844003BG-01LF is sourced from the original manufacturer or authorized distributors?

All 844003BG-01LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 844003BG-01LF meets industry standards.

7.What is the process for return or replacement of 844003BG-01LF?

All 844003BG-01LF units undergo pre-shipment inspection (PSI). If there is an issue with 844003BG-01LF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 844003BG-01LF part is unused and in its original packaging.

Return procedure for 844003BG-01LF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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