Renesas 844003BGI-01LF
- Part No.:
- 844003BGI-01LF
- Manufacturer:
- Renesas
- Package:
- 24-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Datasheet:
-
844003BGI-01LF.pdf
- Description:
- IC FREQ SYNTH 24TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:11,321
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Product details
Overview
844003BGI-01LF from IDT is a 3-output LVDS frequency synthesizer IC designed for Ethernet reference clock generation. It accepts 19.53125 MHz or 25 MHz parallel-resonant crystals and delivers independently configurable differential outputs at 625 MHz, 312.5 MHz, 156.25 MHz, or 125 MHz across two banks (Bank A: 1 pair; Bank B: 2 pairs). It achieves ≤0.56 ps typical RMS phase jitter at 156.25 MHz (1.875–20 MHz offset) and operates from a single 3.3 V supply over –40°C to +85°C.
For engineers reviewing the 844003BGI-01LF datasheet, 844003BGI-01LF pinout, 844003BGI-01LF application, or 844003BGI-01LF equivalent, this page provides verified technical context, bank-specific frequency configuration logic, LVDS output skew and jitter performance, thermal design guidance for the 24-pin TSSOP E-Pad package, and validated alternative options for Ethernet clock synthesis.
Technical Context
The 844003BGI-01LF integrates a third-generation low-phase-noise VCO (490–680 MHz), dual independent PLL output divider banks with dedicated DIV_SELA[1:0] and DIV_SELB[1:0] control, and selectable crystal or LVCMOS/LVTTL reference input via XTAL_SEL. Feedback division is set to ÷25 (default) or ÷32 via FB_DIV.
Each bank features separate output supply rails (VDDO_A, VDDO_B), independent output enable (OEA/OEB), and LVDS-compliant differential outputs with 250–450 mV differential voltage and 1.25–1.41 V common-mode offset. Bank skew is ≤33 ps; inter-bank output skew is ≤75 ps at same frequency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Count & Type | Three LVDS differential pairs: Bank A (QA0/nQA0), Bank B (QB0/nQB0, QB1/nQB1) |
| Input Reference | 19.53125 MHz or 25 MHz parallel-resonant crystal (18 pF load); also supports LVCMOS/LVTTL REF_CLK |
| Output Frequencies | Configurable per bank: 625 / 312.5 / 156.25 / 125 MHz (with default ÷25 feedback and standard dividers) |
| RMS Phase Jitter | 0.53 ps (typical) at 625 MHz; 0.56 ps (typical) at 156.25 MHz (1.875–20 MHz integration band) |
| Supply Voltage | 3.3 V ±5% on VDD (core), VDDA (analog), VDDO_A, and VDDO_B (output rails) |
| Operating Temperature | –40°C to +85°C ambient; junction temperature remains ≤109.4°C under full-load, 1 m/s airflow |
| Package | 24-pin TSSOP with exposed thermal pad (G package, 4.40 × 7.80 × 0.925 mm) |
Pinout & Package
24-pin TSSOP with exposed E-pad (G package), RoHS-compliant lead-free finish. Thermal pad must be soldered to PCB ground plane via ≥6 thermal vias (12–13 mil diameter, 1 oz plating) for reliable operation at full power dissipation (786.6 mW max).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 24 DIV_SELB0, DIV_SELB1 |
Bank B frequency select inputs | LVCMOS/LVTTL inputs with internal pullups; configure ÷2/÷4/÷5/÷8 output division (default ÷8) |
| 2 VCO_SEL |
VCO bypass control | Pullup input; LOW bypasses PLL to pass crystal/REF_CLK directly to dividers (default = HIGH, PLL active) |
| 3 MR |
Master reset | Active-HIGH pulldown input; resets internal dividers, forcing QA0/nQA0/QBx to known states at power-up |
| 4, 23 VDDO_A, VDDO_B |
Bank-specific LVDS output supplies | Enable independent noise isolation: decouple each with 0.01 µF capacitor; tie to 3.3 V |
| 5–6, 19–20, 21–22 QA0/nQA0, QB1/nQB1, QB0/nQB0 |
Differential LVDS outputs | Matched 100 Ω termination required at receiver; 200–450 ps rise/fall time; 47–53% duty cycle |
| 7–8 OEB, OEA |
Bank B/A output enables | Pullup inputs; HIGH enables respective bank's outputs (default = enabled); LOW places outputs in high-Z |
| 9 FB_DIV |
Feedback divider select | Pulldown input; LOW = ÷25 (default), HIGH = ÷32 - sets VCO multiplication factor for crystal input |
| 10–11, 14 VDDA, VDD, GND |
Analog/core/ground supplies | VDDA requires 10 Ω + 10 µF RC filter; VDD and GND require individual 0.01 µF bypassing per pin |
| 12–13, 15–16 DIV_SELA0/1, XTAL_OUT/IN |
Bank A division control & crystal interface | DIV_SELA[1:0] selects ÷1/÷2/÷3/÷4 (default ÷4); XTAL_IN/OUT support 18 pF parallel-resonant crystals |
| 17–18 REF_CLK, XTAL_SEL |
Reference clock input & source select | XTAL_SEL pullup selects crystal by default; REF_CLK pulldown input accepts LVCMOS/LVTTL single-ended clock |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent output banks | Bank A (1 LVDS pair) and Bank B (2 LVDS pairs) each have dedicated frequency select pins and output supplies - enables mixed-frequency clock distribution without external multiplexing |
| Ultra-low phase jitter | 0.53 ps typical RMS jitter at 625 MHz meets stringent 10GbE and SyncE timing requirements without additional cleanup circuitry |
| Flexible reference interface | Crystal oscillator (19.53125/25 MHz, 18 pF) or LVCMOS/LVTTL single-ended REF_CLK selectable via XTAL_SEL - simplifies board-level clock sourcing |
| Robust power domain separation | Dedicated VDD, VDDA, VDDO_A, and VDDO_B rails with individual bypassing isolate PLL noise from LVDS outputs - maintains signal integrity in dense routing environments |
| Thermally enhanced package | 24-pin TSSOP with exposed E-pad and defined thermal via pattern supports ≤786.6 mW total power dissipation while maintaining Tj ≤109.4°C at 85°C ambient |
Applications
| 10 Gigabit Ethernet Switches | Synchronous Ethernet (SyncE) Base Stations |
|---|---|
|
Use Scenario: Generating precise 156.25 MHz and 625 MHz reference clocks for SERDES PHYs and packet timing engines in layer-3 switches. IC Role / Device Role / Timing Role: Primary clock synthesizer providing jitter-clean, independently routed LVDS clocks to multiple PHY lanes and timing ASICs. Use Value: 0.56 ps RMS jitter at 156.25 MHz ensures compliance with IEEE 802.3ae and ITU-T G.8262; dual-bank architecture eliminates need for discrete clock buffers. |
Use Scenario: Delivering traceable, phase-aligned 125 MHz and 312.5 MHz clocks to PTP grandmaster clocks and boundary clocks in mobile backhaul networks. IC Role / Device Role / Timing Role: Stratum-3-equivalent frequency synthesizer with low wander transfer, used as primary timing source in SyncE-compliant equipment. Use Value: Independent bank configuration allows simultaneous delivery of different SyncE line rates (e.g., 125 MHz for 10GE, 312.5 MHz for OTU2) with <33 ps intra-bank skew. |
| Optical Transport Network (OTN) Line Cards | High-Speed Data Center Routers |
|
Use Scenario: Providing 156.25 MHz and 312.5 MHz reference clocks to OTU frame mappers and FEC engines in 100G/400G line cards. IC Role / Device Role / Timing Role: Low-jitter clock generator feeding multiple ASICs requiring synchronous sampling and deterministic latency. Use Value: 0.53 ps RMS jitter at 625 MHz enables error-free 25+ Gbaud PAM4 signaling; E-pad thermal design sustains reliability under continuous full-load operation. |
Use Scenario: Distributing synchronized 125 MHz and 156.25 MHz clocks to CPU, FPGA, and switch fabric interfaces in multi-terabit routers. IC Role / Device Role / Timing Role: Centralized clock synthesis node replacing multiple discrete oscillators and fanout buffers in high-density compute modules. Use Value: Single 24-pin TSSOP replaces ≥3 components; independent OEA/OEB enables dynamic power gating of unused banks during low-traffic periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar frequency synthesizer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si5338A-A-GM | 4-output I2C-programmable synthesizer; wider output range (0.16–350 MHz); higher integration (integrated EEPROM, no external crystal needed) | Requires I2C configuration; lacks native 625 MHz support; optimized for variable-rate systems vs. fixed Ethernet frequencies | Choose for programmability and multi-rate flexibility; avoid if 625 MHz LVDS output and crystal-based simplicity are mandatory |
| ICS8430I-01T | 3-output LVDS synthesizer; identical 24-pin TSSOP package; supports same 19.53125/25 MHz crystals and 125/156.25/312.5/625 MHz outputs | Higher typical RMS jitter (0.85 ps at 156.25 MHz); no VCO bypass mode; single shared output supply rail (no VDDO_A/VDDO_B separation) | Choose for footprint compatibility and cost sensitivity; accept higher jitter and reduced noise isolation versus 844003BGI-01LF |
Compared with Si5338A-A-GM and ICS8430I-01T, the 844003BGI-01LF uniquely combines sub-0.55 ps jitter at 625 MHz, dual isolated output supplies, and hardware-only frequency selection - making it optimal for fixed-frequency, jitter-critical Ethernet infrastructure where configuration overhead and supply noise coupling must be minimized.
Availability
844003BGI-01LF is available at Aetrix Electronics and suitable for 10GbE switch design, Synchronous Ethernet base station deployment, and OTN line card manufacturing requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant lead-free packaging.
Supply support for 844003BGI-01LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing markets.
The 844003BGI-01LF belongs to IDT's FEMTOCLOCKS™ family of ultra-low-jitter clock synthesizers, engineered specifically for Ethernet, SyncE, and OTN infrastructure where deterministic phase noise and bank-isolated LVDS outputs are critical.
FAQ
What crystal specifications are required for stable operation of the 844003BGI-01LF?
The 844003BGI-01LF is characterized for use with 18 pF parallel-resonant crystals operating at either 19.53125 MHz or 25 MHz. The crystal must meet fundamental-mode oscillation, ESR ≤50 Ω, shunt capacitance ≈7 pF, and drive level ≤1 mW. Deviations outside these parameters may cause start-up failure or increased phase jitter. The 844003BGI-01LF datasheet specifies FB_DIV-dependent frequency ranges: ÷25 mode supports 19.6–27.2 MHz; ÷32 mode supports 15.313–21.25 MHz.
How does the VCO_SEL pin affect the 844003BGI-01LF's output behavior?
When VCO_SEL is driven LOW, the 844003BGI-01LF bypasses its internal PLL and passes the selected reference (crystal or REF_CLK) directly to the output dividers - effectively converting the device into a programmable divider-only clock generator. This mode disables VCO-related jitter but limits output frequencies to integer divisions of the input. By default (VCO_SEL = HIGH, internal pullup), the PLL is active, enabling multiplication and the full 490–680 MHz VCO range for low-jitter synthesis.
Can the 844003BGI-01LF generate different frequencies on Bank A and Bank B simultaneously?
Yes, the 844003BGI-01LF supports fully independent frequency configuration: Bank A uses DIV_SELA[1:0] and Bank B uses DIV_SELB[1:0], each selecting from ÷1/÷2/÷3/÷4 (Bank A) or ÷2/÷4/÷5/÷8 (Bank B), combined with FB_DIV (÷25 or ÷32) to produce distinct output frequencies. For example, Bank A can output 156.25 MHz while Bank B outputs 312.5 MHz - confirmed in Tables 3F and 3G of the 844003BGI-01LF datasheet.
What is the recommended termination for the 844003BGI-01LF's LVDS outputs?
IDT specifies 90–132 Ω differential termination for the 844003BGI-01LF's LVDS outputs, with 100 Ω being optimal for standard point-to-point layouts. Termination must be placed as close as possible to the receiving device. Unused LVDS pairs should be either left floating (with no attached trace) or terminated with 100 Ω across the differential pair. The 844003BGI-01LF's LVDS drivers comply with ANSI TIA/EIA-644, delivering 250–450 mV differential swing and 1.25–1.41 V common-mode voltage.
Does the 844003BGI-01LF require separate power supply filtering for each VDDO rail?
Yes - the 844003BGI-01LF mandates individual 0.01 µF ceramic bypass capacitors on VDDO_A and VDDO_B, in addition to separate decoupling on VDD and VDDA. This isolation prevents switching noise from one bank's outputs from modulating the other bank's supply and degrading phase noise. VDDA further requires a 10 Ω series resistor and 10 µF bulk capacitor. Layout guidelines specify direct via connections from each supply pin to the PCB ground plane to minimize inductance.
844003BGI-01LF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- FemtoClock®
- Package/Case:
- 24-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Type:
- Frequency Synthesizer
- PLL:
- Yes with Bypass
- Input:
- LVCMOS, LVTTL, Crystal
- Output:
- LVDS
- Number of Circuits:
- 1
- Ratio - Input:Output:
- 2:3
- Differential - Input:Output:
- No/Yes
- Frequency - Max:
- 680MHz
- Divider/Multiplier:
- Yes/No
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 24-TSSOP-EP
844003BGI-01LF FAQ
1.How can I place an order for 844003BGI-01LF through Aetrix?
Please submit a Request for Quotation (RFQ) for 844003BGI-01LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 844003BGI-01LF reliable?
The price and inventory of 844003BGI-01LF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 844003BGI-01LF is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 844003BGI-01LF?
For technical support, including 844003BGI-01LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 844003BGI-01LF requirements.
6.How does Aetrix verify that 844003BGI-01LF is sourced from the original manufacturer or authorized distributors?
All 844003BGI-01LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 844003BGI-01LF meets industry standards.
7.What is the process for return or replacement of 844003BGI-01LF?
All 844003BGI-01LF units undergo pre-shipment inspection (PSI). If there is an issue with 844003BGI-01LF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 844003BGI-01LF part is unused and in its original packaging.
Return procedure for 844003BGI-01LF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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