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Renesas 844003BGI-01LF

Part No.:
844003BGI-01LF
Manufacturer:
Renesas
Category:
Clock Generators, PLLs, Frequency Synthesizers
Package:
24-TSSOP (0.173", 4.40mm Width) Exposed Pad
Datasheet:
Aetrix844003BGI-01LF.pdf
Description:
IC FREQ SYNTH 24TSSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:11,321

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Product details

Overview

844003BGI-01LF from IDT is a 3-output LVDS frequency synthesizer IC designed for Ethernet reference clock generation. It accepts 19.53125 MHz or 25 MHz parallel-resonant crystals and delivers independently configurable differential outputs at 625 MHz, 312.5 MHz, 156.25 MHz, or 125 MHz across two banks (Bank A: 1 pair; Bank B: 2 pairs). It achieves ≤0.56 ps typical RMS phase jitter at 156.25 MHz (1.875–20 MHz offset) and operates from a single 3.3 V supply over –40°C to +85°C.

For engineers reviewing the 844003BGI-01LF datasheet, 844003BGI-01LF pinout, 844003BGI-01LF application, or 844003BGI-01LF equivalent, this page provides verified technical context, bank-specific frequency configuration logic, LVDS output skew and jitter performance, thermal design guidance for the 24-pin TSSOP E-Pad package, and validated alternative options for Ethernet clock synthesis.

Technical Context

The 844003BGI-01LF integrates a third-generation low-phase-noise VCO (490–680 MHz), dual independent PLL output divider banks with dedicated DIV_SELA[1:0] and DIV_SELB[1:0] control, and selectable crystal or LVCMOS/LVTTL reference input via XTAL_SEL. Feedback division is set to ÷25 (default) or ÷32 via FB_DIV.

Each bank features separate output supply rails (VDDO_A, VDDO_B), independent output enable (OEA/OEB), and LVDS-compliant differential outputs with 250–450 mV differential voltage and 1.25–1.41 V common-mode offset. Bank skew is ≤33 ps; inter-bank output skew is ≤75 ps at same frequency.

Key Specifications

Parameter Value and Actual Design Meaning
Output Count & Type Three LVDS differential pairs: Bank A (QA0/nQA0), Bank B (QB0/nQB0, QB1/nQB1)
Input Reference 19.53125 MHz or 25 MHz parallel-resonant crystal (18 pF load); also supports LVCMOS/LVTTL REF_CLK
Output Frequencies Configurable per bank: 625 / 312.5 / 156.25 / 125 MHz (with default ÷25 feedback and standard dividers)
RMS Phase Jitter 0.53 ps (typical) at 625 MHz; 0.56 ps (typical) at 156.25 MHz (1.875–20 MHz integration band)
Supply Voltage 3.3 V ±5% on VDD (core), VDDA (analog), VDDO_A, and VDDO_B (output rails)
Operating Temperature –40°C to +85°C ambient; junction temperature remains ≤109.4°C under full-load, 1 m/s airflow
Package 24-pin TSSOP with exposed thermal pad (G package, 4.40 × 7.80 × 0.925 mm)

Pinout & Package

24-pin TSSOP with exposed E-pad (G package), RoHS-compliant lead-free finish. Thermal pad must be soldered to PCB ground plane via ≥6 thermal vias (12–13 mil diameter, 1 oz plating) for reliable operation at full power dissipation (786.6 mW max).

Pin/Terminal Circuit Role Design Meaning
1, 24
DIV_SELB0, DIV_SELB1
Bank B frequency select inputs LVCMOS/LVTTL inputs with internal pullups; configure ÷2/÷4/÷5/÷8 output division (default ÷8)
2
VCO_SEL
VCO bypass control Pullup input; LOW bypasses PLL to pass crystal/REF_CLK directly to dividers (default = HIGH, PLL active)
3
MR
Master reset Active-HIGH pulldown input; resets internal dividers, forcing QA0/nQA0/QBx to known states at power-up
4, 23
VDDO_A, VDDO_B
Bank-specific LVDS output supplies Enable independent noise isolation: decouple each with 0.01 µF capacitor; tie to 3.3 V
5–6, 19–20, 21–22
QA0/nQA0, QB1/nQB1, QB0/nQB0
Differential LVDS outputs Matched 100 Ω termination required at receiver; 200–450 ps rise/fall time; 47–53% duty cycle
7–8
OEB, OEA
Bank B/A output enables Pullup inputs; HIGH enables respective bank's outputs (default = enabled); LOW places outputs in high-Z
9
FB_DIV
Feedback divider select Pulldown input; LOW = ÷25 (default), HIGH = ÷32 - sets VCO multiplication factor for crystal input
10–11, 14
VDDA, VDD, GND
Analog/core/ground supplies VDDA requires 10 Ω + 10 µF RC filter; VDD and GND require individual 0.01 µF bypassing per pin
12–13, 15–16
DIV_SELA0/1, XTAL_OUT/IN
Bank A division control & crystal interface DIV_SELA[1:0] selects ÷1/÷2/÷3/÷4 (default ÷4); XTAL_IN/OUT support 18 pF parallel-resonant crystals
17–18
REF_CLK, XTAL_SEL
Reference clock input & source select XTAL_SEL pullup selects crystal by default; REF_CLK pulldown input accepts LVCMOS/LVTTL single-ended clock

Key Features

Feature Design Value
Dual independent output banks Bank A (1 LVDS pair) and Bank B (2 LVDS pairs) each have dedicated frequency select pins and output supplies - enables mixed-frequency clock distribution without external multiplexing
Ultra-low phase jitter 0.53 ps typical RMS jitter at 625 MHz meets stringent 10GbE and SyncE timing requirements without additional cleanup circuitry
Flexible reference interface Crystal oscillator (19.53125/25 MHz, 18 pF) or LVCMOS/LVTTL single-ended REF_CLK selectable via XTAL_SEL - simplifies board-level clock sourcing
Robust power domain separation Dedicated VDD, VDDA, VDDO_A, and VDDO_B rails with individual bypassing isolate PLL noise from LVDS outputs - maintains signal integrity in dense routing environments
Thermally enhanced package 24-pin TSSOP with exposed E-pad and defined thermal via pattern supports ≤786.6 mW total power dissipation while maintaining Tj ≤109.4°C at 85°C ambient

Applications

10 Gigabit Ethernet Switches Synchronous Ethernet (SyncE) Base Stations

Use Scenario: Generating precise 156.25 MHz and 625 MHz reference clocks for SERDES PHYs and packet timing engines in layer-3 switches.

IC Role / Device Role / Timing Role: Primary clock synthesizer providing jitter-clean, independently routed LVDS clocks to multiple PHY lanes and timing ASICs.

Use Value: 0.56 ps RMS jitter at 156.25 MHz ensures compliance with IEEE 802.3ae and ITU-T G.8262; dual-bank architecture eliminates need for discrete clock buffers.

Use Scenario: Delivering traceable, phase-aligned 125 MHz and 312.5 MHz clocks to PTP grandmaster clocks and boundary clocks in mobile backhaul networks.

IC Role / Device Role / Timing Role: Stratum-3-equivalent frequency synthesizer with low wander transfer, used as primary timing source in SyncE-compliant equipment.

Use Value: Independent bank configuration allows simultaneous delivery of different SyncE line rates (e.g., 125 MHz for 10GE, 312.5 MHz for OTU2) with <33 ps intra-bank skew.

Optical Transport Network (OTN) Line Cards High-Speed Data Center Routers

Use Scenario: Providing 156.25 MHz and 312.5 MHz reference clocks to OTU frame mappers and FEC engines in 100G/400G line cards.

IC Role / Device Role / Timing Role: Low-jitter clock generator feeding multiple ASICs requiring synchronous sampling and deterministic latency.

Use Value: 0.53 ps RMS jitter at 625 MHz enables error-free 25+ Gbaud PAM4 signaling; E-pad thermal design sustains reliability under continuous full-load operation.

Use Scenario: Distributing synchronized 125 MHz and 156.25 MHz clocks to CPU, FPGA, and switch fabric interfaces in multi-terabit routers.

IC Role / Device Role / Timing Role: Centralized clock synthesis node replacing multiple discrete oscillators and fanout buffers in high-density compute modules.

Use Value: Single 24-pin TSSOP replaces ≥3 components; independent OEA/OEB enables dynamic power gating of unused banks during low-traffic periods.

Equivalent & Alternatives

The following parts are listed as comparable options for similar frequency synthesizer applications.

Alternative Part Technical Difference Application Difference Selection Advice
Si5338A-A-GM 4-output I2C-programmable synthesizer; wider output range (0.16–350 MHz); higher integration (integrated EEPROM, no external crystal needed) Requires I2C configuration; lacks native 625 MHz support; optimized for variable-rate systems vs. fixed Ethernet frequencies Choose for programmability and multi-rate flexibility; avoid if 625 MHz LVDS output and crystal-based simplicity are mandatory
ICS8430I-01T 3-output LVDS synthesizer; identical 24-pin TSSOP package; supports same 19.53125/25 MHz crystals and 125/156.25/312.5/625 MHz outputs Higher typical RMS jitter (0.85 ps at 156.25 MHz); no VCO bypass mode; single shared output supply rail (no VDDO_A/VDDO_B separation) Choose for footprint compatibility and cost sensitivity; accept higher jitter and reduced noise isolation versus 844003BGI-01LF

Compared with Si5338A-A-GM and ICS8430I-01T, the 844003BGI-01LF uniquely combines sub-0.55 ps jitter at 625 MHz, dual isolated output supplies, and hardware-only frequency selection - making it optimal for fixed-frequency, jitter-critical Ethernet infrastructure where configuration overhead and supply noise coupling must be minimized.

Availability

844003BGI-01LF is available at Aetrix Electronics and suitable for 10GbE switch design, Synchronous Ethernet base station deployment, and OTN line card manufacturing requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant lead-free packaging.

Supply support for 844003BGI-01LF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing markets.

The 844003BGI-01LF belongs to IDT's FEMTOCLOCKS™ family of ultra-low-jitter clock synthesizers, engineered specifically for Ethernet, SyncE, and OTN infrastructure where deterministic phase noise and bank-isolated LVDS outputs are critical.

FAQ

What crystal specifications are required for stable operation of the 844003BGI-01LF?

The 844003BGI-01LF is characterized for use with 18 pF parallel-resonant crystals operating at either 19.53125 MHz or 25 MHz. The crystal must meet fundamental-mode oscillation, ESR ≤50 Ω, shunt capacitance ≈7 pF, and drive level ≤1 mW. Deviations outside these parameters may cause start-up failure or increased phase jitter. The 844003BGI-01LF datasheet specifies FB_DIV-dependent frequency ranges: ÷25 mode supports 19.6–27.2 MHz; ÷32 mode supports 15.313–21.25 MHz.

How does the VCO_SEL pin affect the 844003BGI-01LF's output behavior?

When VCO_SEL is driven LOW, the 844003BGI-01LF bypasses its internal PLL and passes the selected reference (crystal or REF_CLK) directly to the output dividers - effectively converting the device into a programmable divider-only clock generator. This mode disables VCO-related jitter but limits output frequencies to integer divisions of the input. By default (VCO_SEL = HIGH, internal pullup), the PLL is active, enabling multiplication and the full 490–680 MHz VCO range for low-jitter synthesis.

Can the 844003BGI-01LF generate different frequencies on Bank A and Bank B simultaneously?

Yes, the 844003BGI-01LF supports fully independent frequency configuration: Bank A uses DIV_SELA[1:0] and Bank B uses DIV_SELB[1:0], each selecting from ÷1/÷2/÷3/÷4 (Bank A) or ÷2/÷4/÷5/÷8 (Bank B), combined with FB_DIV (÷25 or ÷32) to produce distinct output frequencies. For example, Bank A can output 156.25 MHz while Bank B outputs 312.5 MHz - confirmed in Tables 3F and 3G of the 844003BGI-01LF datasheet.

What is the recommended termination for the 844003BGI-01LF's LVDS outputs?

IDT specifies 90–132 Ω differential termination for the 844003BGI-01LF's LVDS outputs, with 100 Ω being optimal for standard point-to-point layouts. Termination must be placed as close as possible to the receiving device. Unused LVDS pairs should be either left floating (with no attached trace) or terminated with 100 Ω across the differential pair. The 844003BGI-01LF's LVDS drivers comply with ANSI TIA/EIA-644, delivering 250–450 mV differential swing and 1.25–1.41 V common-mode voltage.

Does the 844003BGI-01LF require separate power supply filtering for each VDDO rail?

Yes - the 844003BGI-01LF mandates individual 0.01 µF ceramic bypass capacitors on VDDO_A and VDDO_B, in addition to separate decoupling on VDD and VDDA. This isolation prevents switching noise from one bank's outputs from modulating the other bank's supply and degrading phase noise. VDDA further requires a 10 Ω series resistor and 10 µF bulk capacitor. Layout guidelines specify direct via connections from each supply pin to the PCB ground plane to minimize inductance.

844003BGI-01LF Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
FemtoClock®
Package/Case:
24-TSSOP (0.173", 4.40mm Width) Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Type:
Frequency Synthesizer
PLL:
Yes with Bypass
Input:
LVCMOS, LVTTL, Crystal
Output:
LVDS
Number of Circuits:
1
Ratio - Input:Output:
2:3
Differential - Input:Output:
No/Yes
Frequency - Max:
680MHz
Divider/Multiplier:
Yes/No
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
24-TSSOP-EP

844003BGI-01LF FAQ

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Please submit a Request for Quotation (RFQ) for 844003BGI-01LF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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Once your 844003BGI-01LF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 844003BGI-01LF?

For technical support, including 844003BGI-01LF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 844003BGI-01LF requirements.

6.How does Aetrix verify that 844003BGI-01LF is sourced from the original manufacturer or authorized distributors?

All 844003BGI-01LF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 844003BGI-01LF meets industry standards.

7.What is the process for return or replacement of 844003BGI-01LF?

All 844003BGI-01LF units undergo pre-shipment inspection (PSI). If there is an issue with 844003BGI-01LF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 844003BGI-01LF part is unused and in its original packaging.

Return procedure for 844003BGI-01LF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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