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NXP Semiconductors 88W8987-A1-NYEI/AZ
- Part No.:
- 88W8987-A1-NYEI/AZ
- Manufacturer:
- NXP Semiconductors
- Category:
- RF Transceiver ICs
- Package:
- 68-VFQFN Exposed Pad
- Datasheet:
-
88W8987-A1-NYEI/AZ.pdf
- Description:
- IC RF TXRX BLE 68HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,133
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Product details
Overview
88W8987-A1-NYEI/AZ from NXP Semiconductors is a dual-band 2.4/5 GHz Wi-Fi 5 (802.11ac) and Bluetooth 5.2 System-on-Chip, delivering up to 433 Mbit/s PHY data rate, simultaneous independent Wi-Fi/Bluetooth operation, and integrated RF front-end control for 1x1 MIMO. It supports SDIO 3.0 host interface, AES/GCMP/WAPI security, and 802.11mc indoor positioning-targeted at compact mobile computing and IoT gateway designs.
For engineers reviewing the 88W8987-A1-NYEI/AZ datasheet, 88W8987-A1-NYEI/AZ pinout, 88W8987-A1-NYEI/AZ application, or 88W8987-A1-NYEI/AZ equivalent, this page delivers verified package mapping (68-pin HVQFN), confirmed power domains (1.1V/1.8V/2.2V), validated coexistence arbitration, and real-world use-case constraints including industrial temperature range (−40°C to +85°C) and eWLP/QFN configuration trade-offs.
Technical Context
The 88W8987-A1-NYEI/AZ integrates independent ARM-based Wi-Fi and Bluetooth CPUs with dedicated baseband and RF subsystems. Its dual-band 2.4/5 GHz radio uses direct-conversion architecture with on-chip LNA, internal PA, and fractional-N LO supporting 20/40/80 MHz channels. Coexistence arbitration is handled internally between Wi-Fi and Bluetooth paths.
It implements full IEEE 802.11ac Wave 2 features-including MCS9 (433 Mbit/s), MU-MIMO beamformee support, DFS radar detection per Japan W53/W56 bands, and 802.11mc fine timing measurement-alongside Bluetooth 5.2 LE roles (Central/Peripheral/Broadcaster/Observer), Secure Connections, and 2 Mbit/s LE PHY.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Wi-Fi Standard | IEEE 802.11ac/n/a/g/b with MCS9 (433 Mbit/s @ 80 MHz), DFS, and 802.11mc indoor location |
| Bluetooth Version | Bluetooth 5.2 with LE 2 Mbit/s, Secure Connections, Advertising Extensions, and CQDDR |
| Host Interface | SDIO 3.0 (4-bit, up to 208 MHz clock) and high-speed UART for separate Wi-Fi/Bluetooth transport |
| Supply Voltages | VCORE = 1.1 V, VIO/VIO_SD = 1.8 V, VIO_RF = 2.2 V - enabling low-power domain partitioning |
| Operating Temp | Industrial grade: −40°C to +85°C - validated for embedded gateway and portable compute thermal profiles |
| Security | AES-CCMP, AES-GCMP, AES-CMAC, and WAPI - hardware-accelerated encryption for concurrent Wi-Fi/Bluetooth sessions |
| Package | 68-pin HVQFN (8 × 8 × 0.85 mm, 0.4 mm pitch) with wettable flanks - compatible with automated optical inspection |
Pinout & Package
68-pin HVQFN package (8 × 8 × 0.85 mm, 0.4 mm pitch) with exposed thermal pad (EPAD) on pin 69. Designed for high-density PCB layouts with wettable flanks supporting solder joint inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SD_DAT[3:0] | SDIO Data Bus | 4-bit bidirectional data path for Wi-Fi/Bluetooth host communication at up to 208 MHz |
| RF_TR_2 / RF_TR_5 | Wi-Fi Transceiver I/O | Dual-band antenna interface: RF_TR_2 for 2.4 GHz, RF_TR_5 for 5 GHz - supports separate-path QFN configuration |
| BRF_ANT | Bluetooth RF I/O | Single-ended 2.4 GHz Bluetooth Tx/Rx terminal - isolated from Wi-Fi paths in QFN package |
| PDn | Power-Down Control | Active-low global enable; asserts hardware reset and disables all power domains when deasserted |
| XTAL_IN / XTAL_OUT | Crystal Oscillator Interface | Supports 38.4 MHz fundamental-mode crystal; enables precise frequency reference without external oscillator |
| GPIO[20:0] | Multi-Function I/O | 21 configurable pins supporting wake-up signaling (Wi-Fi/Bluetooth host), voltage scaling (DVSC[1:0]), and JTAG test modes |
Key Features
| Feature | Design Value |
|---|---|
| Simultaneous Dual-Protocol Operation | Independent Wi-Fi and Bluetooth CPUs with hardware coexistence arbitration eliminate software scheduling latency |
| Integrated RF Front-End Control | Four dedicated RF control outputs (RF_CNTL[0–3]) drive external switches/filters without MCU intervention |
| 802.11mc Fine Timing Measurement | Sub-meter indoor positioning accuracy enabled by hardware timestamping of 802.11mc FTM frames |
| Low-Power Management | Multiple sleep/standby modes with external SLP_CLK_IN support reduce average current to <10 µA in deep-sleep |
| Secure Boot & Calibration Storage | OTP memory stores MAC address, RF calibration data, and secure boot keys - immune to firmware overwrite |
Applications
| Smartphone/Tablet Connectivity | Notebook/Ultrabook Integration |
|---|---|
Use Scenario: Embedded wireless module in space-constrained handheld devices requiring concurrent Wi-Fi hotspot and Bluetooth audio streaming. IC Role / Device Role / Timing Role: Dual-protocol SoC handling 802.11ac AP mode and Bluetooth LE peripheral role with shared antenna switching via RF_CNTL signals. Use Value: Eliminates discrete Wi-Fi + BT chipsets, reducing BOM count by 2 and PCB area by 35% versus discrete solutions. | Use Scenario: Wireless subsystem in thin-and-light notebooks needing low-latency coexistence during video conferencing (Wi-Fi download + Bluetooth mic input). IC Role / Device Role / Timing Role: Hardware-level Wi-Fi/Bluetooth arbitration ensures deterministic packet scheduling without OS-level driver coordination. Use Value: Achieves <15 ms A2DP audio latency and maintains 433 Mbit/s Wi-Fi throughput under concurrent load. |
| IoT Gateway Hub | Wireless Home Audio |
Use Scenario: Central node aggregating BLE sensors and bridging to 5 GHz Wi-Fi backhaul in smart home infrastructure. IC Role / Device Role / Timing Role: Simultaneous Central (BLE) and Infrastructure (Wi-Fi) mode with 802.11k/v/r roaming for seamless multi-AP handoff. Use Value: Supports ≥16 concurrent BLE connections while maintaining 5 GHz DFS-compliant channel agility. | Use Scenario: Multi-room audio system requiring synchronized playback across speakers using Bluetooth LE mesh and Wi-Fi control. IC Role / Device Role / Timing Role: PCM interface drives stereo audio directly; SDIO handles metadata/control over Wi-Fi with hardware QoS prioritization. Use Value: Enables sub-100 µs inter-speaker timing sync via 802.11mc FTM and hardware PCM clock recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-band Wi-Fi 5 + Bluetooth 5.2 SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| QCA9377-3 | Single-core CPU, no integrated Bluetooth stack; requires external BT controller via UART | Lacks native Bluetooth 5.2 LE Secure Connections and 2 Mbit/s PHY; limited coexistence arbitration | Select only when Bluetooth functionality is implemented externally and cost-per-function outweighs integration benefits |
| BCM4356KMLG | Supports Wi-Fi 5 + BT 4.2 (not 5.2); no 802.11mc or DFS compliance in 5 GHz band | Missing Bluetooth LE Privacy 1.2, Advertising Extensions, and indoor location capability | Choose only for legacy compatibility where Bluetooth 5.2 features and precise indoor positioning are not required |
Compared with QCA9377-3 and BCM4356KMLG, the 88W8987-A1-NYEI/AZ provides full hardware-integrated Bluetooth 5.2 with LE Secure Connections and 802.11mc, eliminating external controllers and enabling unified firmware updates, while its industrial temperature rating and wettable-flank QFN support ruggedized embedded deployments.
Availability
88W8987-A1-NYEI/AZ is available at Aetrix Electronics and suitable for smartphone connectivity modules, notebook wireless subsystems, and IoT gateway hubs requiring stable component supply across extended product lifecycles.
Supply support for 88W8987-A1-NYEI/AZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications.
The 88W8987-A1-NYEI/AZ belongs to NXP's Marvell-derived Wi-Fi/Bluetooth SoC family, engineered specifically for space-constrained, power-sensitive mobile and edge devices demanding concurrent dual-protocol operation and certified regulatory compliance.
FAQ
What Wi-Fi standards does the 88W8987-A1-NYEI/AZ support?
The 88W8987-A1-NYEI/AZ supports IEEE 802.11ac (Wave 2), 802.11n, 802.11a/g/b, plus advanced features including 802.11h DFS, 802.11k/v/r roaming, 802.11e QoS, and 802.11mc indoor positioning. It achieves up to 433 Mbit/s PHY rate using MCS9 at 80 MHz bandwidth. All Wi-Fi capabilities are fully implemented in the 88W8987-A1-NYEI/AZ silicon and validated per regulatory test reports.
Does the 88W8987-A1-NYEI/AZ include Bluetooth 5.2 Low Energy features?
Yes, the 88W8987-A1-NYEI/AZ fully implements Bluetooth 5.2 LE features including 2 Mbit/s PHY, Secure Connections, Privacy 1.2, Data Length Extension, Advertising Extensions, and Intelligent AFH. These are hardware-accelerated and supported in both Central and Peripheral roles - confirmed in the official 88W8987_SDS Rev. 6 documentation for the 88W8987-A1-NYEI/AZ variant.
What package type is used for the 88W8987-A1-NYEI/AZ?
The 88W8987-A1-NYEI/AZ uses a 68-pin HVQFN package measuring 8 × 8 × 0.85 mm with 0.4 mm pitch and wettable flanks. This matches the "NYE" prefix in the part number and is distinct from the eWLP variant (e.g., EAHE). The EPAD on pin 69 provides thermal dissipation and grounding - critical for RF stability in the 88W8987-A1-NYEI/AZ design.
How does the 88W8987-A1-NYEI/AZ handle Wi-Fi and Bluetooth coexistence?
The 88W8987-A1-NYEI/AZ implements internal hardware coexistence arbitration between Wi-Fi and Bluetooth subsystems, eliminating reliance on software-based time-slicing. This ensures deterministic latency and prevents packet collisions during concurrent operation - a key differentiator confirmed in Section 4.4 of the 88W8987_SDS for the 88W8987-A1-NYEI/AZ device.
What host interfaces are supported by the 88W8987-A1-NYEI/AZ?
The 88W8987-A1-NYEI/AZ supports SDIO 3.0 (4-bit, up to 208 MHz) for primary Wi-Fi/Bluetooth host communication and a high-speed UART for auxiliary Bluetooth HCI transport. Both interfaces are electrically and functionally validated in the 88W8987-A1-NYEI/AZ - with SDIO enabling full throughput and UART providing fallback or debug access without impacting Wi-Fi performance.
88W8987-A1-NYEI/AZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 68-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Programmable:
- -
- Type:
- TxRx Only
- RF Family/Standard:
- Bluetooth, WiFi
- Protocol:
- 802.11a/b/g/-c, Bluetooth v5.2
- Modulation:
- 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
- Frequency:
- 2.4GHz, 5GHz
- Data Rate (Max):
- 433Mbps
- Power - Output:
- 22dBm
- Sensitivity:
- -99dBm
- Memory Size:
- -
- Serial Interfaces:
- GPIO, JTAG, PCM, SDIO, UART
- GPIO:
- 21
- Voltage - Supply:
- 1.1V, 1.8V, 2.2V
- Current - Receiving:
- 38mA ~ 82mA
- Current - Transmitting:
- 79mA ~ 145mA
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 68-HVQFN (8x8)
88W8987-A1-NYEI/AZ FAQ
1.How can I place an order for 88W8987-A1-NYEI/AZ through Aetrix?
Please submit a Request for Quotation (RFQ) for 88W8987-A1-NYEI/AZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 88W8987-A1-NYEI/AZ reliable?
The price and inventory of 88W8987-A1-NYEI/AZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 88W8987-A1-NYEI/AZ is usually 5 days.
3.What payment methods are accepted for 88W8987-A1-NYEI/AZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 88W8987-A1-NYEI/AZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 88W8987-A1-NYEI/AZ?
88W8987-A1-NYEI/AZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 88W8987-A1-NYEI/AZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 88W8987-A1-NYEI/AZ?
For technical support, including 88W8987-A1-NYEI/AZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 88W8987-A1-NYEI/AZ requirements.
6.How does Aetrix verify that 88W8987-A1-NYEI/AZ is sourced from the original manufacturer or authorized distributors?
All 88W8987-A1-NYEI/AZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 88W8987-A1-NYEI/AZ meets industry standards.
7.What is the process for return or replacement of 88W8987-A1-NYEI/AZ?
All 88W8987-A1-NYEI/AZ units undergo pre-shipment inspection (PSI). If there is an issue with 88W8987-A1-NYEI/AZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 88W8987-A1-NYEI/AZ part is unused and in its original packaging.
Return procedure for 88W8987-A1-NYEI/AZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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