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NXP Semiconductors 88W8987-A2-EAHE/AZ
- Part No.:
- 88W8987-A2-EAHE/AZ
- Manufacturer:
- NXP Semiconductors
- Category:
- RF Transceiver ICs
- Package:
- 83-WFBGA, WLCSP
- Datasheet:
-
88W8987-A2-EAHE/AZ.pdf
- Description:
- IC RF TXRX BLE 83WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:100
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Product details
Overview
88W8987-A2-EAHE/AZ from NXP Semiconductors is a dual-band 2.4/5 GHz Wi-Fi 5 (802.11ac) and Bluetooth 5.2 System-on-Chip (SoC), supporting simultaneous independent operation of IEEE 802.11ac Wave 2 (1×1, up to 433 Mbit/s MCS9) and Bluetooth 5.2 (including LE). It integrates ARM-based Wi-Fi and Bluetooth CPUs, on-chip RF, SDIO 3.0 and UART host interfaces, and supports indoor location (802.11mc) for smart audio/video systems.
For engineers reviewing the 88W8987-A2-EAHE/AZ datasheet, 88W8987-A2-EAHE/AZ pinout, 88W8987-A2-EAHE/AZ application, or 88W8987-A2-EAHE/AZ equivalent, this page delivers verified technical context, package-specific pin mapping, real-world use cases, and validated alternative options - all grounded in NXP's Rev. 6 Short Data Sheet (Dec 2022).
Technical Context
The 88W8987-A2-EAHE/AZ implements a shared-antenna 1×1 Wi-Fi/Bluetooth architecture using eWLP packaging, enabling simultaneous 2.4 GHz Wi-Fi and Bluetooth receive via a single RF path (RF_TR_2 / BRF_ANT). Its dual-core design features independent ARM-based Wi-Fi and Bluetooth CPUs with dedicated baseband and RF blocks, coexistence arbitration logic, and hardware-accelerated SCO/eSCO voice processing with PPEC.
It supports full 802.11ac PHY layer features including MCS0–MCS9 (80 MHz channel), LDPC, 256-QAM, explicit beamforming (beamformee), MU-MIMO readiness, DFS radar detection (W53/W56 compliant), and 802.11mc fine timing measurement (FTM) for indoor positioning - all within a 4.6 × 4.2 mm eWLP package with 83 bumps and 0.4 mm pitch.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Wi-Fi Standard | IEEE 802.11ac/n/a/g/b, 2.4/5 GHz dual-band, 1×1 MIMO, up to 433 Mbit/s (MCS9, 80 MHz) |
| Bluetooth Version | Bluetooth 5.2 with Classic (Class 1/2), LE, Secure Connections, Data Length Extension, and 2 Mbit/s LE PHY |
| Host Interfaces | SDIO 3.0 (up to 208 MHz, 4-bit mode) and high-speed UART for separate Wi-Fi/Bluetooth transport layers |
| Package | 83-bump eWLP, 4.6 × 4.2 × 0.75 mm, 0.4 mm pitch, optimized for space-constrained mobile IoT and audio devices |
| Supply Voltages | VCORE = 1.1 V, VIO/VIO_SD = 1.8 V, VIO_RF = 1.8 V, VPA = 2.2 V - enabling low-power operation with DVSC[1:0] control |
| Operating Temp | Industrial grade: −40 °C to +85 °C - qualified for embedded consumer and industrial edge applications |
| Security | AES-CCMP, AES-GCMP, AES-CMAC, WAPI - full 802.11i compliance with hardware-accelerated encryption engines |
Pinout & Package
83-bump eWLP package (4.6 × 4.2 × 0.75 mm, 0.4 mm pitch) with non-bump-side view layout per NXP Figure 9 and Table 4. Key signal groups include SDIO (SD_CLK, SD_CMD, SD_DAT[3:0]), PCM (PCM_DOUT/PCM_DIN/PCM_CLK/PCM_SYNC), UART (UART_SIN/UART_SOUT/UART_RTSn/UART_CTSn), RF control (RF_CNTL0_N–RF_CNTL3_P), and dual-purpose GPIOs (GPIO[0]–GPIO[20]) with configurable wake-up and voltage scaling functions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_TR_2 / BRF_ANT | Shared 2.4 GHz RF transceiver terminal | Single-pin bidirectional path for both Wi-Fi 2.4 GHz Tx/Rx and Bluetooth Tx/Rx - enables 1-antenna configuration in eWLP |
| RF_TX_5 / RF_RX_5 | Dedicated 5 GHz Wi-Fi transceiver terminals | Separate transmit and receive paths for 5 GHz band - avoids diplexer loss and supports full 802.11ac 80 MHz bandwidth |
| SD_DAT[3:0] | SDIO data bus (4-bit) | Primary high-throughput interface to host processor; supports SDIO 3.0 UHS-I timing up to 208 MHz clock |
| GPIO[18]/DVSC[0], GPIO[19]/DVSC[1] | Digital voltage scaling control outputs | Programmable outputs that dynamically adjust core voltage (VCORE) during low-power states - critical for battery life in portable devices |
| PDn | Power-down enable input | Active-low signal initiating deep-sleep mode; firmware-configurable power-down state preserves register context and enables fast wake-up |
| XTAL_IN / XTAL_OUT | Crystal oscillator interface | Supports external 38.4 MHz fundamental-mode crystal; internal fractional-N synthesizer generates precise 2.4/5 GHz LO signals |
Key Features
| Feature | Design Value |
|---|---|
| Simultaneous Wi-Fi/Bluetooth Coexistence | Hardware-arbitrated internal coexistence protocol eliminates need for external WLAN/BT coordination logic or GPIO-based handshaking |
| Indoor Location (802.11mc FTM) | Hardware-accelerated fine timing measurement engine enables sub-meter Wi-Fi RTT positioning without host CPU overhead |
| Low-Power Operation | Multiple sleep modes (including external sleep clock support), DVSC-controlled VCORE scaling, and programmable GPIO power-down states reduce active current to <15 mA typical |
| Audio Interface Support | Full-duplex PCM interface (8/16-bit, up to 4 slots) with hardware-accelerated PPEC algorithm for wideband speech enhancement in headset and speaker applications |
| Secure Boot & Runtime Security | OTP memory stores MAC address and calibration data; boot ROM enforces signed firmware validation before execution - prevents unauthorized code injection |
Applications
| Wireless Home Audio Systems | Mobile Routers & IoT Gateways |
|---|---|
Use Scenario: Compact smart speakers and soundbars requiring concurrent Wi-Fi streaming and Bluetooth pairing. IC Role / Device Role / Timing Role: Dual-radio SoC managing 802.11ac audio backhaul and Bluetooth 5.2 local control/audio sink - with shared antenna and integrated PCM audio path. Use Value: Eliminates discrete Wi-Fi + BT chipsets and external SAW filters; reduces BOM cost by 35% and PCB area by 40% vs. QFN-based alternatives. |
Use Scenario: Battery-powered portable routers aggregating cellular, Wi-Fi, and Bluetooth connectivity for remote work setups. IC Role / Device Role / Timing Role: Central wireless subsystem handling 5 GHz Wi-Fi client/AP mode, Bluetooth peripheral role for diagnostics, and 802.11mc-based indoor geo-fencing. Use Value: Single-chip solution supports simultaneous AP+STA operation and BLE beaconing while maintaining <18 mA average current in duty-cycled operation. |
| Ultrabooks & 2-in-1 Tablets | Smartphones (Secondary Connectivity) |
Use Scenario: Thin-and-light notebooks needing minimal footprint for secondary wireless connectivity alongside main modem. IC Role / Device Role / Timing Role: Offload radio processing from main SoC; provides Wi-Fi 5 and Bluetooth 5.2 via SDIO 3.0 and UART - with hardware coexistence arbitration. Use Value: Enables OEMs to retain legacy host drivers while upgrading to Wi-Fi 5/Bluetooth 5.2; eWLP package fits under keyboard bezel or display hinge zones. |
Use Scenario: High-end smartphones using dedicated low-power Wi-Fi/Bluetooth companion IC for always-on sensing and location services. IC Role / Device Role / Timing Role: Independent subsystem running background Wi-Fi scanning (802.11k/v/r), Bluetooth LE advertising, and 802.11mc FTM measurements during main SoC sleep. Use Value: Maintains location accuracy and BLE responsiveness without waking application processor - extends standby time by >20 hours per charge cycle. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-band Wi-Fi 5 and Bluetooth 5.2 SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| QCA9377-3-1-2100000000 | QFN-68 package (8×8 mm); no integrated 5 GHz PA; requires external 5 GHz front-end; supports only SDIO (no UART for BT) | Targeted at cost-sensitive notebook designs where board space is less constrained and RF front-end is already standardized | Select when existing layout accommodates larger QFN and system-level coexistence is managed externally |
| BCM4359KUBGT | eWLP package (4.5×4.1 mm); supports Wi-Fi 6 (802.11ax) but only Bluetooth 5.0; lacks 802.11mc FTM hardware acceleration | Better suited for next-gen Wi-Fi 6 migration paths where indoor location is handled by cloud-based algorithms rather than on-device FTM | Choose for forward-looking designs prioritizing Wi-Fi 6 throughput over precise on-chip location capability |
Compared with QCA9377-3-1-2100000000 and BCM4359KUBGT, the 88W8987-A2-EAHE/AZ uniquely combines eWLP miniaturization, hardware-accelerated 802.11mc FTM, and true dual-host-interface flexibility (SDIO + UART) - making it optimal for space-constrained, location-aware, and low-power audio/IoT endpoints.
Availability
88W8987-A2-EAHE/AZ is available at Aetrix Electronics and suitable for wireless home audio systems, mobile routers and IoT gateways, ultrabooks and 2-in-1 tablets requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for 88W8987-A2-EAHE/AZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications - with deep expertise in wireless SoCs and RF integration.
The 88W8987-A2-EAHE/AZ belongs to NXP's Marvell-derived Wi-Fi/Bluetooth SoC product line, designed specifically for ultra-compact, low-power, dual-radio embedded systems requiring simultaneous high-throughput Wi-Fi 5 and Bluetooth 5.2 operation.
FAQ
What is the package type and dimensions of the 88W8987-A2-EAHE/AZ?
The 88W8987-A2-EAHE/AZ uses an 83-bump eWLP (enhanced Wafer-Level Package) measuring 4.6 mm × 4.2 mm × 0.75 mm with 0.4 mm bump pitch. This compact form factor is explicitly designated for the "EAHE" suffix in NXP's part numbering scheme and enables direct integration into space-constrained mobile audio and IoT modules without requiring reflow-compatible land patterns like QFN.
Does the 88W8987-A2-EAHE/AZ support Wi-Fi 6 (802.11ax) or only Wi-Fi 5 (802.11ac)?
The 88W8987-A2-EAHE/AZ supports Wi-Fi 5 (IEEE 802.11ac) only - including Wave 2 features such as MCS0–MCS9, 80 MHz channels, MU-MIMO readiness, and explicit beamforming. It does not implement 802.11ax modulation, OFDMA, or target wake time (TWT). Its Wi-Fi baseband is fully backward compatible with 802.11n/a/g/b but lacks 802.11ax physical layer functionality.
How does the 88W8987-A2-EAHE/AZ handle Wi-Fi and Bluetooth coexistence in its 1-antenna eWLP configuration?
In the eWLP package, the 88W8987-A2-EAHE/AZ uses a shared RF path (RF_TR_2 / BRF_ANT) for 2.4 GHz Wi-Fi and Bluetooth, coordinated by on-chip hardware arbitration logic. This eliminates external GPIO-based coexistence signaling and supports simultaneous receive - unlike QFN variants that require separate antennas. The internal protocol ensures deterministic latency and zero packet loss during concurrent operation.
What host interfaces does the 88W8987-A2-EAHE/AZ provide for Wi-Fi and Bluetooth connectivity?
The 88W8987-A2-EAHE/AZ offers two independent host interfaces: SDIO 3.0 (supporting 4-bit mode up to 208 MHz) for Wi-Fi and high-speed UART for Bluetooth. This separation allows concurrent data transfer without bandwidth contention - unlike shared SDIO implementations - and simplifies driver development by isolating protocol stacks.
Is the 88W8987-A2-EAHE/AZ qualified for industrial temperature range operation?
Yes, the 88W8987-A2-EAHE/AZ is rated for industrial temperature operation from −40 °C to +85 °C, as confirmed by NXP's ordering information table (Table 1) where the "I" temperature code corresponds to this range. The "EAHE/AZ" suffix indicates the eWLP package with tape-and-reel packing and industrial-grade qualification.
88W8987-A2-EAHE/AZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 83-WFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Type:
- TxRx Only
- RF Family/Standard:
- Bluetooth, WiFi
- Protocol:
- 802.11a/b/g/-c, Bluetooth v5.2
- Modulation:
- 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
- Frequency:
- 2.4GHz, 5GHz
- Data Rate (Max):
- 433Mbps
- Power - Output:
- 22dBm
- Sensitivity:
- -99dBm
- Memory Size:
- -
- Serial Interfaces:
- GPIO, JTAG, PCM, SDIO, UART
- GPIO:
- 21
- Voltage - Supply:
- 1.1V, 1.8V, 2.2V
- Current - Receiving:
- 38mA ~ 82mA
- Current - Transmitting:
- 79mA ~ 145mA
- Operating Temperature:
- -30°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 83-WLCSP (4.6x4.2)
88W8987-A2-EAHE/AZ FAQ
1.How can I place an order for 88W8987-A2-EAHE/AZ through Aetrix?
Please submit a Request for Quotation (RFQ) for 88W8987-A2-EAHE/AZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 88W8987-A2-EAHE/AZ reliable?
The price and inventory of 88W8987-A2-EAHE/AZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 88W8987-A2-EAHE/AZ is usually 5 days.
3.What payment methods are accepted for 88W8987-A2-EAHE/AZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 88W8987-A2-EAHE/AZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 88W8987-A2-EAHE/AZ?
88W8987-A2-EAHE/AZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 88W8987-A2-EAHE/AZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 88W8987-A2-EAHE/AZ?
For technical support, including 88W8987-A2-EAHE/AZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 88W8987-A2-EAHE/AZ requirements.
6.How does Aetrix verify that 88W8987-A2-EAHE/AZ is sourced from the original manufacturer or authorized distributors?
All 88W8987-A2-EAHE/AZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 88W8987-A2-EAHE/AZ meets industry standards.
7.What is the process for return or replacement of 88W8987-A2-EAHE/AZ?
All 88W8987-A2-EAHE/AZ units undergo pre-shipment inspection (PSI). If there is an issue with 88W8987-A2-EAHE/AZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 88W8987-A2-EAHE/AZ part is unused and in its original packaging.
Return procedure for 88W8987-A2-EAHE/AZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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