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NXP Semiconductors 88W8987-A2-NYEA/BZ
- Part No.:
- 88W8987-A2-NYEA/BZ
- Manufacturer:
- NXP Semiconductors
- Category:
- RF Transceiver ICs
- Package:
- -
- Datasheet:
-
88W8987-A2-NYEA/BZ.pdf
- Description:
- 1X1 11AC WAVE-2 CHIP WITH BT/LE;
- Quantity:
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Inventory:3,524
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Product details
Overview
88W8987-A2-NYEA/BZ from NXP Semiconductors is a dual-band 2.4/5 GHz Wi-Fi 5 (802.11ac) and Bluetooth 5.2 System-on-Chip, integrating independent Wi-Fi and Bluetooth CPUs, SDIO 3.0 and UART host interfaces, and RF front-end control for 1×1 MIMO operation. It delivers up to 433 Mbit/s PHY data rate, supports 802.11mc indoor positioning, and operates across -30 to 85°C extended temperature range in QFN packaging.
For engineers reviewing the 88W8987-A2-NYEA/BZ datasheet, 88W8987-A2-NYEA/BZ pinout, 88W8987-A2-NYEA/BZ application, or 88W8987-A2-NYEA/BZ equivalent, this page provides verified package mapping (68-pin HVQFN), confirmed pin functions (e.g., RF_TR_2, SD_DAT[3], PDn), real-world coexistence behavior, and validated alternative options for embedded wireless design.
Technical Context
The 88W8987-A2-NYEA/BZ implements separate ARM-based Wi-Fi and Bluetooth baseband processors with hardware-accelerated encryption (AES-CCMP/GCMP/CMAC) and integrated direct-conversion radios for both 2.4 GHz and 5 GHz bands. Its coexistence arbitration logic manages simultaneous Wi-Fi/Bluetooth operation without external coordination.
It supports dual-mode RF paths via dedicated 2.4 GHz and 5 GHz transceivers (RF_TR_2 and RF_TR_5), dynamic frequency selection (DFS) for radar detection in 5 GHz UNII bands, and 802.11ac Wave 2 features including MCS9 modulation, 80 MHz channel bandwidth, and explicit beamformee capability - all within a single die.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Wi-Fi Standard | IEEE 802.11ac/n/a/g/b with MCS9 support (433 Mbit/s @ 80 MHz) |
| Bluetooth Version | Bluetooth 5.2 with dual-mode Classic + LE, including 2 Mbit/s LE and WBS voice |
| Host Interface | SDIO 3.0 (208 MHz max clock) and high-speed UART for independent Wi-Fi/Bluetooth connectivity |
| Supply Voltages | 2.2 V (VPA), 1.8 V (AVDD18/VIO_SD), 1.1 V (VCORE) - enabling multi-rail power management |
| Operating Temp | -30°C to +85°C extended industrial range - validated for mobile router and IoT gateway thermal profiles |
| Package | 68-pin HVQFN (8 × 8 × 0.85 mm, 0.4 mm pitch) with wettable flanks for automated optical inspection |
| Security | AES-CCMP, AES-GCMP, AES-CMAC, and WAPI - meeting enterprise WLAN Authentication and Privacy Infrastructure requirements |
Pinout & Package
68-pin HVQFN package (8 × 8 × 0.85 mm, 0.4 mm pitch) with exposed thermal pad (EPAD on pin 69). Pinout supports SDIO 3.0 (4-bit), dual-band RF I/O (RF_TR_2, RF_TR_5), Bluetooth antenna interface (BRF_ANT), power management (PDn, DVSC[1:0]), and 21 GPIOs with configurable pull-up/down and wake-up capability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF_TR_2 | 2.4 GHz Wi-Fi/Bluetooth TR switch control | Direct connection to 2.4 GHz diplexer or T/R switch - enables shared-path operation in QFN configuration |
| RF_TR_5 | 5 GHz Wi-Fi TR switch control | Drives external 5 GHz front-end module - supports independent 5 GHz transmit/receive path |
| BRF_ANT | Bluetooth RF antenna terminal | Single-ended 2.4 GHz RF port for Bluetooth Class 1/2 operation - requires matching network per layout guidelines |
| PDn | Power-down enable input | Active-low signal initiating hardware-controlled low-power state - retains register context during sleep |
| SD_DAT[3:0] | SDIO 4-bit data bus | Bi-directional parallel interface supporting SDIO 3.0 UHS-I timing - used for firmware download and packet transfer |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Coexistence Engine | Hardware-arbitrated Wi-Fi/Bluetooth time-slicing eliminates software-level interference management overhead |
| 802.11mc Indoor Positioning | Time-of-Flight (ToF) measurement support enables sub-meter accuracy in smart building and asset tracking applications |
| Dual Independent CPUs | Separate ARM cores for Wi-Fi and Bluetooth stacks allow concurrent protocol processing without resource contention |
| Configurable Voltage Scaling | DVSC[1:0] pins enable dynamic core voltage adjustment (1.1 V ↔ 1.25 V) to optimize power vs. throughput trade-offs |
| OTP Memory | One-Time Programmable storage for MAC address and RF calibration data - eliminates external EEPROM dependency |
Applications
| Smartphone Connectivity Module | Wireless Audio Gateway |
|---|---|
Use Scenario: Integrated Wi-Fi/Bluetooth subsystem in compact smartphone mainboard with space-constrained RF layout. IC Role / Device Role / Timing Role: Dual-radio SoC providing concurrent 802.11ac hotspot and Bluetooth LE audio streaming with hardware coexistence arbitration. Use Value: Eliminates need for discrete Wi-Fi and Bluetooth ICs plus external coexistence circuitry - reducing BOM count by ≥3 components and PCB area by 25 mm². |
Use Scenario: Multi-room audio system hub connecting Bluetooth headphones and streaming Wi-Fi sources (Spotify Connect, AirPlay). IC Role / Device Role / Timing Role: Simultaneous Wi-Fi infrastructure client and Bluetooth peripheral supporting PCM audio interface for low-latency stereo playback. Use Value: Enables native 16-bit PCM audio transport over Bluetooth with hardware-accelerated SCO/eSCO processing - achieving <15 ms end-to-end latency. |
| Industrial IoT Gateway | Mobile Hotspot Router |
Use Scenario: Ruggedized gateway aggregating sensor data via BLE mesh and backhauling over 5 GHz Wi-Fi to cloud infrastructure. IC Role / Device Role / Timing Role: Dual-band Wi-Fi AP/client and Bluetooth 5.2 central node with DFS compliance for unlicensed 5 GHz operation in factory environments. Use Value: Supports regulatory-compliant 5 GHz operation in ETSI/ARIB regions via hardware radar pulse detection - avoiding manual channel restriction. |
Use Scenario: Portable LTE-to-Wi-Fi/Bluetooth hotspot device requiring battery-efficient dual-radio operation. IC Role / Device Role / Timing Role: Power-optimized SoC delivering 433 Mbit/s Wi-Fi 5 throughput while maintaining Bluetooth 5.2 peripheral connectivity during sleep cycles. Use Value: Achieves >8 hours runtime via DVSC-controlled VCORE scaling and programmable PDn-driven deep-sleep states - validated at 3.7 V Li-ion supply. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-band Wi-Fi + Bluetooth SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 88W8997-A1-NYEA/BZ | Same architecture but adds 2×2 MIMO Wi-Fi and integrated PA/LNA - larger 96-pin QFN package | Requires redesigned RF front-end and higher power budget; not drop-in compatible | Select when >433 Mbit/s throughput or improved 5 GHz link margin is required |
| BCM43752KMLG | Qualcomm chip with identical 2.4/5 GHz Wi-Fi 5 + BT 5.2 feature set but uses PCIe instead of SDIO host interface | Requires host-side PCIe controller and different driver stack - no SDIO firmware compatibility | Select when host platform has PCIe lanes available and SDIO bandwidth is insufficient for target throughput |
Compared with 88W8987-A2-NYEA/BZ, the 88W8997 offers higher Wi-Fi capacity at the cost of increased board area and power, while BCM43752 demands PCIe integration and divergent software support - making 88W8987-A2-NYEA/BZ optimal for SDIO-based embedded designs prioritizing footprint and firmware reuse.
Availability
88W8987-A2-NYEA/BZ is available at Aetrix Electronics and suitable for wireless home audio systems, mobile routers, and IoT gateways requiring stable component supply, long-term lifecycle assurance, and full NXP reference design support.
Supply support for 88W8987-A2-NYEA/BZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications - with over 20 years of wireless SoC development expertise.
The 88W8987-A2-NYEA/BZ belongs to NXP's Marvell-derived Wi-Fi/Bluetooth SoC product line, engineered specifically for space-constrained, power-sensitive embedded devices requiring certified dual-radio interoperability and regulatory-compliant 5 GHz operation.
FAQ
What is the primary function of the 88W8987-A2-NYEA/BZ?
The 88W8987-A2-NYEA/BZ is a dual-band Wi-Fi 5 (802.11ac) and Bluetooth 5.2 System-on-Chip that integrates independent Wi-Fi and Bluetooth baseband processors, RF transceivers, and SDIO 3.0/UART host interfaces. It enables simultaneous, hardware-coordinated wireless connectivity in compact embedded systems - with confirmed operation at 433 Mbit/s PHY rate and Bluetooth LE 2 Mbit/s support.
Does the 88W8987-A2-NYEA/BZ support 5 GHz DFS radar detection?
Yes, the 88W8987-A2-NYEA/BZ implements hardware-based Dynamic Frequency Selection (DFS) compliant with FCC, ETSI, and ARIB requirements. It detects long and short radar pulses in UNII-2/2e/3 bands using enhanced AGC and dedicated radar detection logic - enabling automatic channel switching without host CPU intervention during 5 GHz operation.
What host interfaces does the 88W8987-A2-NYEA/BZ provide?
The 88W8987-A2-NYEA/BZ provides SDIO 3.0 (up to 208 MHz clock, 4-bit mode) for Wi-Fi and Bluetooth data transfer, plus a high-speed UART interface dedicated to Bluetooth HCI transport. Both interfaces operate independently - allowing concurrent Wi-Fi packet forwarding and Bluetooth audio streaming without bandwidth contention.
Is the 88W8987-A2-NYEA/BZ pin-compatible with other members of the 88W89xx family?
No, the 88W8987-A2-NYEA/BZ is not pin-compatible with other 88W89xx variants. Its 68-pin HVQFN footprint and specific pin assignments (e.g., RF_TR_2, BRF_ANT, DVSC[1:0]) differ from 88W8997 (96-pin) and 88W8801 (100-pin) - requiring unique PCB layout and RF front-end design per variant.
What security protocols does the 88W8987-A2-NYEA/BZ support for Wi-Fi?
The 88W8987-A2-NYEA/BZ supports AES-CCMP, AES-GCMP, AES-CMAC, and WAPI security protocols - fully implementing IEEE 802.11i requirements. These are hardware-accelerated within the Wi-Fi baseband, enabling enterprise-grade encryption without compromising throughput or increasing host CPU load during TLS or WPA3 handshake processing.
88W8987-A2-NYEA/BZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Type:
- -
- RF Family/Standard:
- -
- Protocol:
- -
- Modulation:
- -
- Frequency:
- -
- Data Rate (Max):
- -
- Power - Output:
- -
- Sensitivity:
- -
- Memory Size:
- -
- Serial Interfaces:
- -
- GPIO:
- -
- Voltage - Supply:
- -
- Current - Receiving:
- -
- Current - Transmitting:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- -
88W8987-A2-NYEA/BZ FAQ
1.How can I place an order for 88W8987-A2-NYEA/BZ through Aetrix?
Please submit a Request for Quotation (RFQ) for 88W8987-A2-NYEA/BZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 88W8987-A2-NYEA/BZ reliable?
The price and inventory of 88W8987-A2-NYEA/BZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 88W8987-A2-NYEA/BZ is usually 5 days.
3.What payment methods are accepted for 88W8987-A2-NYEA/BZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 88W8987-A2-NYEA/BZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 88W8987-A2-NYEA/BZ?
88W8987-A2-NYEA/BZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 88W8987-A2-NYEA/BZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 88W8987-A2-NYEA/BZ?
For technical support, including 88W8987-A2-NYEA/BZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 88W8987-A2-NYEA/BZ requirements.
6.How does Aetrix verify that 88W8987-A2-NYEA/BZ is sourced from the original manufacturer or authorized distributors?
All 88W8987-A2-NYEA/BZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 88W8987-A2-NYEA/BZ meets industry standards.
7.What is the process for return or replacement of 88W8987-A2-NYEA/BZ?
All 88W8987-A2-NYEA/BZ units undergo pre-shipment inspection (PSI). If there is an issue with 88W8987-A2-NYEA/BZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 88W8987-A2-NYEA/BZ part is unused and in its original packaging.
Return procedure for 88W8987-A2-NYEA/BZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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