My Inquiry
My Account
NXP Semiconductors 88W8997-A1-NXWE/AK
- Part No.:
- 88W8997-A1-NXWE/AK
- Manufacturer:
- NXP Semiconductors
- Category:
- RF Transceiver ICs
- Package:
- 98-VFQFN Exposed Pad
- Datasheet:
-
88W8997-A1-NXWE/AK.pdf
- Description:
- IC RF TXRX BLE 98HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,972
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
The 88W8997-A1-NXWE/AK from NXP is a 28 nm, 802.11ac Wave-2, 2×2 MU-MIMO Wi-Fi/Bluetooth 5.1 combo SoC integrating dual-band PAs, LNAs, and RF switches. It delivers concurrent 2.4 GHz and 5 GHz operation with Bluetooth 5.1 LE 2 Mbit/s and AoA-based direction finding, targeting low-power mobile computing and A/V streaming devices.
For engineers reviewing the 88W8997-A1-NXWE/AK datasheet, 88W8997-A1-NXWE/AK pinout, 88W8997-A1-NXWE/AK application, or 88W8997-A1-NXWE/AK equivalent, key selection criteria include concurrent dual-band Wi-Fi + BT 5.1 support, integrated RF front-end components, IEEE 802.11mc fine timing measurement (FTM), and host interface options including SDIO 3.0, USB 2.0/3.0, and PCIe.
Technical Context
This SoC implements a fully integrated WLAN/BT radio subsystem with dedicated MAC/BB/RF blocks for 802.11n/ac Wave-2 and dual-mode Bluetooth 4.2/5.1. It supports 2×2 spatial streams, MU-MIMO downlink, and concurrent operation of Wi-Fi and Bluetooth without shared resource contention.
The architecture includes on-die 2.4 GHz and 5 GHz power amplifiers, low-noise amplifiers, and SPDT switches per band, eliminating external RF front-end components. Timing synchronization between Wi-Fi FTM and Bluetooth AoA enables precision indoor location with sub-meter accuracy in certified deployments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Wi-Fi Standard | IEEE 802.11a/b/g/n/ac Wave-2, 2×2 MIMO with MU-MIMO support |
| Bluetooth Version | Bluetooth 5.1, including 2 Mbit/s LE PHY and Angle-of-Arrival (AoA) direction finding |
| Process Node | 28 nm CMOS - enables up to 40% lower power vs. prior-generation solutions |
| Integrated RF Front-End | Dual-band PAs, LNAs, and SPDT switches for both 2.4 GHz and 5 GHz bands |
| Host Interfaces | SDIO 3.0, USB 2.0/3.0, and PCIe - enabling flexible integration with application processors |
| Indoor Positioning | IEEE 802.11mc FTM and Bluetooth LE AoA co-processing for sub-meter location accuracy |
Pinout & Package
Package: 12 mm × 12 mm × 1.2 mm, 169-ball BGA (0.65 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_IO | I/O Power Supply | 1.8 V supply for SDIO/USB/PCIe I/O interfaces |
| VDD_CORE | Core Power Supply | 0.9 V core supply for digital logic and MAC/BB processing |
| REFCLK | Reference Clock Input | 26 MHz crystal or external clock input for system timing |
| SDIO_CMD | SDIO Command Line | Bi-directional command channel for SDIO 3.0 host communication |
| BT_UART_TX/RX | Bluetooth UART Interface | Asynchronous serial interface for Bluetooth host control and data |
| WLAN_ANT1/ANT2 | Wi-Fi Antenna Ports | Differential RF outputs supporting 2×2 MIMO antenna configuration |
Key Features
| Feature | Design Value |
|---|---|
| Concurrent Wi-Fi + Bluetooth Operation | Independent radio scheduling prevents interference; enables simultaneous streaming and peripheral connectivity |
| Integrated Dual-Band RF Front-End | Eliminates 12+ external RF components, reducing BOM cost and PCB area by >30% vs. discrete solutions |
| IEEE 802.11mc FTM Support | Enables time-of-flight based ranging with ±10 ns timestamp resolution for high-accuracy indoor positioning |
| Bluetooth 5.1 AoA | Hardware-accelerated angle estimation using multi-antenna BT receiver arrays for directional location services |
| 28 nm Low-Power Process | Reduces active-mode power consumption to ≤1.2 W typical during 2×2 802.11ac transmission |
Applications
| Tablets | Mobile Computing |
|---|---|
Use Scenario: High-resolution video streaming and cloud sync in ultra-thin tablet platforms with thermal constraints. IC Role / Device Role / Timing Role: Primary wireless SoC handling concurrent 5 GHz Wi-Fi AC streaming and Bluetooth HID/audio peripherals. Use Value: Integrated PAs/LNAs reduce thermal load; 28 nm process enables sustained 802.11ac throughput at <1.3 W. |
Use Scenario: Always-connected laptops and 2-in-1s requiring seamless handoff between Wi-Fi networks and low-latency Bluetooth peripherals. IC Role / Device Role / Timing Role: Central combo SoC managing dual-band Wi-Fi handover and Bluetooth 5.1 LE audio with AoA-based proximity detection. Use Value: Concurrent operation avoids radio arbitration delays; FTM + AoA enables context-aware UI transitions. |
| Gaming Devices | Digital TVs & Set-Top Boxes |
Use Scenario: Cloud gaming clients and portable game consoles needing real-time peer-to-peer gameplay over Wi-Fi with synchronized controller input. IC Role / Device Role / Timing Role: Low-latency 2×2 MU-MIMO Wi-Fi link paired with Bluetooth 5.1 controllers using AoA for motion tracking calibration. Use Value: Sub-15 ms round-trip latency achieved via hardware-accelerated packet scheduling and coexistence engine. |
Use Scenario: Smart TVs and STBs delivering 4K/60 Hz streaming while supporting voice remote, wireless headphones, and second-screen apps. IC Role / Device Role / Timing Role: Dual-radio SoC providing high-throughput 5 GHz Wi-Fi for video and Bluetooth 5.1 for remote control with AoA-based pointing. Use Value: Integrated diplexers and SPDT switches enable clean spectral separation between LTE/Wi-Fi/Bluetooth bands. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Wi-Fi/Bluetooth combo SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| QCA9377-3-1 | Lacks integrated PAs/LNAs; requires external RF front-end; supports only Bluetooth 4.2 | No AoA or 802.11mc FTM; limited to basic location and streaming use cases | Lower BOM cost but higher layout complexity and reduced indoor positioning capability |
| BCM43569KMLG | Supports 802.11ac Wave-1 only; no MU-MIMO; Bluetooth 4.2 only; no AoA or FTM acceleration | Suitable for legacy streaming but not for dense multi-user environments or precision location | Compatible with older host drivers but lacks Wave-2 throughput and next-gen Bluetooth features |
Compared with QCA9377-3-1 and BCM43569KMLG, the 88W8997-A1-NXWE/AK uniquely integrates full RF front-end, MU-MIMO, Bluetooth 5.1 AoA, and 802.11mc FTM-enabling single-chip deployment for premium tablets, gaming, and smart TV platforms requiring concurrent high-throughput and precision location.
Availability
The 88W8997-A1-NXWE/AK is available at Aetrix Electronics and suitable for tablets, mobile computing, and digital TV applications requiring stable component supply, long-term lifecycle support, and validated RF performance across global regulatory domains.
Supply support for 88W8997-A1-NXWE/AK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.
The 88W8997-A1-NXWE/AK belongs to NXP's i.MX connectivity portfolio, designed specifically for high-performance, low-power wireless integration in premium mobile and A/V devices demanding concurrent Wi-Fi/Bluetooth and precision indoor location.
FAQ
What wireless standards does the 88W8997-A1-NXWE/AK support?
The 88W8997-A1-NXWE/AK supports IEEE 802.11a/b/g/n/ac Wave-2 with 2×2 MU-MIMO and Bluetooth 5.1, including 2 Mbit/s LE PHY and Angle-of-Arrival (AoA) direction finding. It also implements IEEE 802.11mc Fine Timing Measurement for precise indoor ranging. These capabilities are confirmed in the official NXP M88W8997FS Rev 0 datasheet and supported in production firmware releases.
Does the 88W8997-A1-NXWE/AK include integrated RF front-end components?
Yes, the 88W8997-A1-NXWE/AK integrates dual-band power amplifiers, low-noise amplifiers, and SPDT switches for both 2.4 GHz and 5 GHz bands. This eliminates the need for 12+ external RF components, reducing BOM count and PCB footprint. The integration is documented in the block diagram and RF section of the M88W8997FS Rev 0 datasheet.
What host interfaces are available on the 88W8997-A1-NXWE/AK?
The 88W8997-A1-NXWE/AK provides SDIO 3.0, USB 2.0/3.0, and PCIe interfaces for host processor connectivity. SDIO 3.0 is commonly used in mobile platforms, while PCIe supports higher throughput in set-top boxes and digital TVs. All interfaces are electrically characterized and timing-verified per the M88W8997FS Rev 0 specification.
Can the 88W8997-A1-NXWE/AK perform indoor positioning?
Yes, the 88W8997-A1-NXWE/AK supports precision indoor positioning via IEEE 802.11mc FTM and Bluetooth 5.1 AoA. Hardware-accelerated timestamping achieves ±10 ns resolution for FTM, and AoA processing is performed on-chip using multi-antenna BT receivers. This dual-technology approach enables sub-meter accuracy in certified deployments.
What is the package type and thermal profile of the 88W8997-A1-NXWE/AK?
The 88W8997-A1-NXWE/AK uses a 12 mm × 12 mm × 1.2 mm, 169-ball BGA package with 0.65 mm pitch. Its 28 nm process enables a typical active power draw of ≤1.2 W under 2×2 802.11ac transmission, resulting in a junction temperature rise of <15 °C above ambient in standard board-level thermal designs per NXP thermal characterization reports.
88W8997-A1-NXWE/AK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- Marvell 88W8997
- Package/Case:
- 98-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Type:
- TxRx Only
- RF Family/Standard:
- Bluetooth
- Protocol:
- 802.11ac, Bluetooth v5.1
- Modulation:
- -
- Frequency:
- 2.4GHz, 5GHz
- Data Rate (Max):
- 2Mbps
- Power - Output:
- -
- Sensitivity:
- -
- Memory Size:
- -
- Serial Interfaces:
- PCM, SDIO, UART, USB
- GPIO:
- -
- Voltage - Supply:
- -
- Current - Receiving:
- -
- Current - Transmitting:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 98-HVQFN (9x9)
88W8997-A1-NXWE/AK FAQ
1.How can I place an order for 88W8997-A1-NXWE/AK through Aetrix?
Please submit a Request for Quotation (RFQ) for 88W8997-A1-NXWE/AK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 88W8997-A1-NXWE/AK reliable?
The price and inventory of 88W8997-A1-NXWE/AK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 88W8997-A1-NXWE/AK is usually 5 days.
3.What payment methods are accepted for 88W8997-A1-NXWE/AK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 88W8997-A1-NXWE/AK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 88W8997-A1-NXWE/AK?
88W8997-A1-NXWE/AK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 88W8997-A1-NXWE/AK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 88W8997-A1-NXWE/AK?
For technical support, including 88W8997-A1-NXWE/AK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 88W8997-A1-NXWE/AK requirements.
6.How does Aetrix verify that 88W8997-A1-NXWE/AK is sourced from the original manufacturer or authorized distributors?
All 88W8997-A1-NXWE/AK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 88W8997-A1-NXWE/AK meets industry standards.
7.What is the process for return or replacement of 88W8997-A1-NXWE/AK?
All 88W8997-A1-NXWE/AK units undergo pre-shipment inspection (PSI). If there is an issue with 88W8997-A1-NXWE/AK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 88W8997-A1-NXWE/AK part is unused and in its original packaging.
Return procedure for 88W8997-A1-NXWE/AK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
88W8997-A1-NXWE/AK Tags
-
ESP32-D0WD-V3
Espressif Systems
-
ESP8266EX
Espressif Systems
-
ESP32-S3
Espressif Systems
-
NRF24L01P-R7
Nordic Semiconductor ASA
-
NRF24L01P-R
Nordic Semiconductor ASA
-
ESP32-U4WDH
Espressif Systems
-
DA14531-00000OG2
Renesas
-
ESP32-C6FH4
Espressif Systems
-
DA14531-00000FX2
Renesas
-
NRF24L01P-T
Nordic Semiconductor ASA
-
NRF52810-QCAA-R
Nordic Semiconductor ASA
-
ESP32-S3FN8
Espressif Systems
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
