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Renesas 89H32H8G3YCHLG

Part No.:
89H32H8G3YCHLG
Manufacturer:
Renesas
Category:
Specialized
Package:
484-BBGA, FCBGA
Datasheet:
Aetrix89H32H8G3YCHLG.pdf
Description:
IC INTFACE SPECIALIZED 484FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,004

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Product details

Overview

The 89H32H8G3 from IDT is a 32-lane, 8-port PCI Express Gen3 system interconnect switch with non-blocking architecture, integrated SerDes supporting 8.0 GT/s, 64 GBps (512 Gbps) switching capacity, and full PCIe Base Specification 3.0 compliance - deployed in enterprise servers for multi-root I/O expansion and peer-to-peer storage interconnect.

For engineers reviewing the 89H32H8G3 datasheet, 89H32H8G3 pinout, 89H32H8G3 application, or 89H32H8G3 equivalent, key selection criteria include Gen3 lane aggregation (x8/x4/x2/x1 per port), SECDED ECC on internal RAMs, AER/ACS/ARI support, hot-plug capability on all downstream ports, and partitioned multi-root topology configuration.

Technical Context

The 89H32H8G3 implements a cut-through switching fabric with frame buffer, route table, scheduler, and port arbitration logic to enable concurrent peer-to-peer traffic across up to eight independent PCIe ports. Its DL/Transaction Layer supports TLP processing hints (TPH), atomic operations, and latency tolerance reporting (LTR).

Each of its 32 SerDes lanes operates at 2.5/5.0/8.0 GT/s with automatic link width negotiation, lane reversal, and per-lane configuration. It delivers end-to-end data path parity, ECRC, and IEEE 1149.1/1149.6 JTAG for RAS-critical server environments.

Key Specifications

ParameterValue and Actual Design Meaning
Lane Count32 total PCIe lanes - configurable as up to four x8 ports or eight x4 ports for flexible topology mapping.
Data Rate8.0 GT/s (Gen3), backward compatible to 5.0 GT/s (Gen2) and 2.5 GT/s (Gen1) - ensures interoperability across legacy and new endpoints.
Switching Capacity64 GBps full-duplex (512 Gbps) - enables line-rate forwarding for high-throughput storage and network I/O subsystems.
Max Payload Size2 KB - supports efficient large-packet transfers in SSD arrays and GPU-accelerated compute nodes.
Error HandlingSECDED ECC on all internal RAMs + ECRC + AER on all ports - meets enterprise RAS requirements for fault detection and correction.
Power StatesD0, D3hot, D3 - compliant with PCI Power Management Spec and supports ASPM L0s/L1 for dynamic power scaling.
Partition SupportUp to 8 independent switch partitions - allows secure, isolated I/O domains in virtualized or multi-tenant server platforms.

Pinout & Package

Packaged in a 23 mm × 23 mm 484-ball FCBGA (Fine-Pitch Chip Array Ball Grid Array) with 0.8 mm ball pitch and standard thermal pad layout for high-power PCIe switching applications.

Pin/TerminalCircuit RoleDesign Meaning
CLK_IN[1:0]Reference Clock InputAccepts global or local 100 MHz differential reference clock for SerDes PLL synchronization.
PERST#Reset ControlActive-low asynchronous reset signal controlling initialization sequence and hot-plug recovery.
SMBus_SCL/SDAConfiguration InterfaceTwo-wire SMBus interface for runtime register access, configuration updates, and status monitoring.
GPI[8:0]General Purpose I/ONine configurable digital I/O pins usable for board-level control, status indication, or firmware handshaking.
PRSNT#_D[7:0]Hot-Plug Presence DetectEight dedicated presence detect inputs - enables hot-plug detection and safe insertion/removal on downstream ports.
INTA#–INTD#Interrupt OutputFour open-drain interrupt outputs supporting MSI or INTx signaling for link state change and error reporting.

Key Features

FeatureDesign Value
Non-blocking Switch FabricEnables simultaneous full-bandwidth traffic between any port pair without contention - critical for multi-host storage clustering.
Multi-Root PartitioningSupports up to 8 isolated switch partitions with movable upstream port assignment - enables secure domain separation in hypervisor-managed systems.
PCIe 3.0 Optional FeaturesIncludes ACS, ARI, TPH, LTR, OBFF, and atomic operations - required for advanced virtualization, QoS, and power-aware system design.
On-Die Scope (ODS)Integrated real-time visibility into internal packet flow, latency distribution, and error injection - accelerates bring-up and debug in complex server topologies.
PRBS Generator/CheckerBuilt-in pseudo-random bit sequence test engine for SerDes link validation without external equipment - reduces test setup time and cost.

Applications

Enterprise Server I/O ExpansionSSD Storage Array Interconnect

Use Scenario: Adding PCIe slots and NVMe drives behind dual-socket CPUs while maintaining Gen3 bandwidth and low latency.

IC Role / Device Role / Timing Role: System interconnect switch managing peer-to-peer traffic between CPUs, memory controllers, and I/O modules.

Use Value: Enables 8-port fan-out with 64 GBps aggregate throughput and SECDED ECC protection - eliminating bottlenecks in scale-out storage architectures.

Use Scenario: Connecting 14 SSDs in a shared JBOD enclosure with direct CPU access via multiple upstream links.

IC Role / Device Role / Timing Role: PCIe Gen3 switch providing deterministic latency, multicast support, and hot-plug-safe device enumeration.

Use Value: Supports 2 KB payload size and request metering - optimizing sequential read/write performance across distributed flash media.

Multi-Host Communication PlatformIntelligent I/O Module

Use Scenario: Enabling inter-domain communication between two independent root complexes (e.g., CPU + FPGA) sharing peripherals and memory-mapped resources.

IC Role / Device Role / Timing Role: Multi-root-capable PCIe switch implementing partitioned address spaces and configurable device numbering.

Use Value: Allows dynamic reconfiguration of upstream port location across partitions - essential for field-upgradable I/O consolidation hardware.

Use Scenario: Integrating network, storage, and acceleration functions into a single PCIe add-in card with isolated functional blocks.

IC Role / Device Role / Timing Role: High-reliability PCIe switch with IEEE 1149.6 AC-JTAG and end-to-end parity for mission-critical embedded I/O.

Use Value: Delivers RAS features including ECRC, AER, and OBFF - meeting telecom-grade availability requirements for edge infrastructure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen3 switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Microchip MPF32G3-48432-lane, 8-port Gen3 switch with identical SerDes and partitioning capabilities but lacks built-in PRBS generator and ODS debug features.Targeted at cost-sensitive industrial systems where debug visibility is secondary to basic switching functionality.Preferred when evaluation tooling and on-die scope are not required, and SMBus-based configuration suffices.
AMD/PLX PEX874732-lane Gen3 switch with comparable lane flexibility and AER/ACS support, but uses 27 mm × 27 mm 676-ball BGA and requires external EEPROM for boot.Deployed in legacy server platforms with larger PCB real estate and established PLX software ecosystem integration.Chosen where existing PLX driver stack compatibility and long-term roadmap continuity outweigh footprint and debug advantages.

Compared with MPF32G3-484 and PEX8747, the 89H32H8G3 offers superior debug capability (ODS + PRBS), tighter thermal package (23 mm × 23 mm), and integrated configuration options - making it optimal for next-generation compact, high-RAS server and storage designs requiring rapid validation and field reliability.

Availability

The 89H32H8G3 is available at Aetrix Electronics and suitable for enterprise server I/O expansion, SSD storage array interconnect, and intelligent I/O module development requiring stable component supply and long-term lifecycle assurance.

Supply support for 89H32H8G3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology) is a fabless semiconductor company specializing in high-performance analog, digital, and mixed-signal solutions for communications, computing, and industrial markets before its acquisition by Renesas in 2019.

The 89H32H8G3 belongs to IDT's PCIe Gen3 switch product line, designed specifically for high-throughput, low-latency, multi-root system interconnect in datacenter and enterprise storage platforms.

FAQ

What PCIe generation and lane configurations does the 89H32H8G3 support?

The 89H32H8G3 supports PCIe Gen3 (8.0 GT/s) with full backward compatibility to Gen2 (5.0 GT/s) and Gen1 (2.5 GT/s). It provides 32 total lanes configurable as up to four x8 ports or eight x4 ports, with automatic per-port link width negotiation and lane reversal. The 89H32H8G3 also supports x2 and x1 configurations per port for mixed-topology designs.

Does the 89H32H8G3 support multi-root I/O virtualization (MR-IOV)?

Yes, the 89H32H8G3 supports up to eight fully independent switch partitions with configurable downstream device numbering and movable upstream port assignment - enabling MR-IOV deployment in virtualized environments. The 89H32H8G3 implements ACS, ARI, and TPH to meet hypervisor-level isolation and resource allocation requirements.

What RAS features are implemented in the 89H32H8G3?

The 89H32H8G3 includes SECDED ECC on all internal RAMs, end-to-end data path parity, ECRC, AER on all ports, hot-plug support on all downstream ports, and IEEE 1149.1/1149.6 JTAG. These features collectively satisfy enterprise-class reliability, availability, and serviceability requirements for server and storage applications where uptime and fault containment are critical.

How is the 89H32H8G3 initialized and configured?

The 89H32H8G3 supports multiple initialization methods: root complex (BIOS/OS/driver), serial EEPROM, pin strapping, or SMBus. It requires no power sequencing and enables autonomous link training. Configuration is accessible via PCIe config space, SMBus, or dedicated GPIOs - allowing flexible integration across boot environments and firmware stacks.

Is there an evaluation platform available for the 89H32H8G3?

Yes, the 89KTPES32H8G3 Evaluation Board is officially supported for the 89H32H8G3. It includes PCIe Browser Software, On-Die Scope (ODS) visibility, and built-in PRBS generator/checker for SerDes validation. Documentation and design resources are available at www.IDT.com, and Aetrix Electronics provides technical support for board deployment and firmware integration.

89H32H8G3YCHLG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
484-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Applications:
Switch Interfacing
Interface:
PCI Express
Voltage - Supply:
-
Supplier Device Package:
484-FCBGA (23x23)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

89H32H8G3YCHLG FAQ

1.How can I place an order for 89H32H8G3YCHLG through Aetrix?

Please submit a Request for Quotation (RFQ) for 89H32H8G3YCHLG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 89H32H8G3YCHLG reliable?

The price and inventory of 89H32H8G3YCHLG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H32H8G3YCHLG is usually 5 days.

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89H32H8G3YCHLG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 89H32H8G3YCHLG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 89H32H8G3YCHLG?

For technical support, including 89H32H8G3YCHLG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H32H8G3YCHLG requirements.

6.How does Aetrix verify that 89H32H8G3YCHLG is sourced from the original manufacturer or authorized distributors?

All 89H32H8G3YCHLG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H32H8G3YCHLG meets industry standards.

7.What is the process for return or replacement of 89H32H8G3YCHLG?

All 89H32H8G3YCHLG units undergo pre-shipment inspection (PSI). If there is an issue with 89H32H8G3YCHLG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 89H32H8G3YCHLG part is unused and in its original packaging.

Return procedure for 89H32H8G3YCHLG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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