Renesas 89H32NT24AG2ZAHL8
- Part No.:
- 89H32NT24AG2ZAHL8
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
89H32NT24AG2ZAHL8.pdf
- Description:
- IC INTFACE SPECIALIZED 484FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,673
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
89H32NT24AG2ZAHL8 from IDT is a 32-lane, 24-port PCI Express Gen2 system interconnect switch with non-transparent bridging (NTB), switch partitioning, and integrated DMA controllers. It delivers up to 32 GBps switching capacity, supports 5.0 GT/s link speed per lane, and operates in servers, storage systems, and intelligent I/O subsystems requiring multi-domain PCIe communication.
For engineers reviewing the 89H32NT24AG2ZAHL8 datasheet, 89H32NT24AG2ZAHL8 pinout, 89H32NT24AG2ZAHL8 application, or 89H32NT24AG2ZAHL8 equivalent, key selection criteria include NTB endpoint count (up to 8), partitioning flexibility (up to 8 independent switches), SerDes configurability per lane, hot-plug support across all 23 downstream ports, and compliance with PCI Express Base Specification 2.1.
Technical Context
The 89H32NT24AG2ZAHL8 implements a Combined Input Output Queued (CIOQ) switch core with large buffers and low-latency cut-through architecture. It integrates eight independent NTB endpoints, each with six BARs supporting 32/64-bit address translation and look-up table–based mapping for inter-domain memory access.
Its port configuration supports four x8 stacks-each configurable as x8, x4, x2, or x1-with automatic lane-width negotiation and reversal. Clocking supports 100 MHz or 125 MHz reference inputs in common, non-common, or local port clock modes with SSC capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Lanes / Ports | 32 lanes, 24 ports - enables high-bandwidth interconnection of multiple PCIe endpoints, CPUs, or domains in a single device. |
| PCIe Generation | Gen2 (5.0 GT/s) - ensures backward compatibility with Gen1 (2.5 GT/s) while delivering full Gen2 throughput per active lane. |
| Switching Capacity | 32 GBps (256 Gbps) - provides non-blocking bandwidth for concurrent peer-to-peer traffic flows in multi-host systems. |
| NTB Endpoints | Up to 8 - allows simultaneous communication between up to eight independent PCIe domains or CPUs via dedicated NTB logic. |
| Switch Partitions | Up to 8 fully independent partitions - enables logical isolation, dynamic port migration, and movable upstream ports without hardware changes. |
| DMA Channels | 2 upstream ports × 2 channels each - offloads memory-to-memory transfers across partitions or domains with fly-by translation for reduced latency. |
| Power Supplies | 1.0V core, 2.5V I/O, 3.3V auxiliary - requires three regulated rails; SerDes power savings disable unused lanes automatically. |
| Package | 484-ball Flip Chip BGA, 23 mm × 23 mm, 1 mm pitch - standard high-density package compatible with industrial PCB assembly processes. |
Pinout & Package
484-ball Flip Chip BGA (23 mm × 23 mm, 1 mm ball pitch) with thermal pad. Pin functions include 24 differential PCIe transmit/receive pairs (PE[0–23]TP/RP/TN/RN), global and per-port reference clocks (GCLKP/N, PxxCLKP/N), dual SMBus interfaces (MSMBCLK/DAT, SSMBCLK/DAT + address pins), 9 GPIOs with multiple alternate functions (e.g., PARTxPERSTN, PxxLINKUPN), JTAG test signals, and configuration strapping pins (STKxCfg, SWMODE, CLKMODE).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PE00RP/PE00RN through PE23TP/PE23TN | Differential PCIe SerDes I/O | 24 bidirectional ports supporting configurable lane widths (x1/x2/x4/x8); each pair handles full-duplex 5.0 GT/s Gen2 signaling. |
| GCLKP/GCLKN, P00CLKP/P00CLKN, etc. | Differential reference clock inputs | Global (100/125 MHz) and per-port clock sources enabling flexible clocking topologies including common/non-common and local port modes. |
| MSMBCLK/MSMBDAT, SSMBCLK/SSMBDAT | SMBus master and slave interfaces | Master interface configures external EEPROM/I/O expander; slave interface allows full register read/write by host controller or debug tool. |
| GPIO[0]–GPIO[8] | Configurable I/O with alternate functions | Supports partition reset assertion (PARTxPERSTN), link status reporting (PxxLINKUPN), failover signaling, and IO expander interrupt (IOEXPINTN). |
| STK0CFG–STK3CFG, SWMODE[3:0] | Hardware configuration strapping | Determines port stack layout, switch operating mode (single/multi-partition), initialization source (EEPROM/SMBus), and latency profile. |
Key Features
| Feature | Design Value |
|---|---|
| Non-Transparent Bridging (NTB) | Enables secure, isolated communication between up to 8 PCIe domains using 6 BARs per endpoint with address translation and doorbell/message registers. |
| Switch Partitioning | Creates up to 8 logically independent switches in one die, supporting dynamic port reconfiguration and inter-partition DMA transfers without firmware reload. |
| Integrated DMA Controllers | Two upstream DMA ports with fly-by translation reduce CPU overhead for memory-to-memory transfers across partitions or domains. |
| Hot-Plug Support | Full hot-plug control on all 23 downstream ports via external I²C I/O expander, with GPE output for SCI/SMI generation and presence-detect configurability. |
| RAS Capabilities | SECDED ECC on all internal RAMs, end-to-end data path parity, ECRC regeneration, AER on all ports, and temperature monitoring with programmable thresholds. |
| Flexible Clocking & Power | Supports 100/125 MHz reference clocks, per-lane SerDes tuning (de-emphasis, equalization), and ASPM L0s/L1 states with configurable timers for optimized power/performance trade-offs. |
Applications
| Multi-Host Server Interconnect | Intelligent Storage Controller |
|---|---|
|
Use Scenario: Two or more x86 or ARM-based CPUs require direct PCIe domain intercommunication without shared memory or OS coordination. IC Role / Device Role / Timing Role: Acts as a non-transparent bridge and partitioned switch, enabling CPU-to-CPU messaging, memory-mapped I/O translation, and DMA across isolated domains. Use Value: Eliminates need for external NTB chips or FPGA glue logic; reduces latency vs. software-based inter-process communication over Ethernet or PCIe tunneling. |
Use Scenario: High-availability storage array with redundant controllers, NVMe SSDs, and front-end host interfaces requiring failover and load balancing. IC Role / Device Role / Timing Role: Provides NTB-enabled controller-to-controller communication, partitioned I/O routing to SSDs, and hot-plug-aware port management for drive replacement. Use Value: Enables seamless controller failover with sub-100ms switchover using doorbell registers and BAR remapping, while maintaining full Gen2 bandwidth to all drives. |
| Communications Equipment Backplane | Embedded Multi-Processor System |
|
Use Scenario: Carrier-grade router or switch with line cards, fabric cards, and control processors needing deterministic, low-latency inter-domain data exchange. IC Role / Device Role / Timing Role: Functions as a partitioned PCIe fabric switch with multicast support, ECRC regeneration, and RAS features for carrier-class reliability. Use Value: Supports 64 multicast groups across NTB links and delivers SECDED ECC protection on all internal buffers-meeting Telcordia GR-1089-CORE requirements. |
Use Scenario: Industrial or aerospace embedded system integrating heterogeneous processors (e.g., PowerPC, ARM, FPGA) on a single board with isolated real-time domains. IC Role / Device Role / Timing Role: Serves as a secure, partitioned interconnect enabling time-critical peripherals to be assigned to dedicated switch partitions with independent configuration. Use Value: Guarantees deterministic latency and resource isolation between safety-critical and non-safety partitions-enabling DO-254/IEC 61508 certification paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen2 switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Microchip LAN9668 | 8-port, 2-lane-per-port Gen2 switch with integrated Ethernet MACs; lacks NTB, partitioning, and DMA; lower lane count (16 total). | Targeted at embedded networking edge devices-not multi-host or storage interconnect. | Choose when Ethernet bridging dominates PCIe switching needs and NTB is unnecessary. |
| AMD/Spansion PLX PEX8747 | 32-lane, 24-port Gen3 switch with NTB and partitioning; higher speed (8.0 GT/s), larger package (676-ball BGA), and different power rail requirements (0.9V core). | Designed for Gen3 infrastructure upgrades where backward Gen2 compatibility suffices but future bandwidth headroom is required. | Choose for new designs targeting Gen3 readiness and higher per-lane throughput; not drop-in compatible due to voltage and pinout differences. |
Compared with the 89H32NT24AG2ZAHL8, the LAN9668 offers integration with Ethernet but sacrifices NTB and scalability, while the PEX8747 delivers Gen3 performance at the cost of increased power, size, and design complexity-making the 89H32NT24AG2ZAHL8 optimal for cost-sensitive, Gen2-focused multi-domain systems requiring proven RAS and partitioning.
Availability
89H32NT24AG2ZAHL8 is available at Aetrix Electronics and suitable for servers, storage arrays, communications equipment, and embedded multi-processor systems requiring stable component supply, long-term lifecycle support, and validated PCIe Gen2 switching functionality.
Supply support for 89H32NT24AG2ZAHL8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology, Inc.) is a fabless semiconductor company specializing in timing, RF, memory interface, and PCIe interconnect solutions, acquired by Renesas Electronics in 2019.
The 89H32NT24AG2ZAHL8 belongs to IDT's PES (PCI Express Switch) family, designed specifically for high-reliability, multi-host PCIe Gen2 system interconnects in enterprise and telecom infrastructure.
FAQ
What is the primary function of the 89H32NT24AG2ZAHL8 in a PCIe system?
The 89H32NT24AG2ZAHL8 serves as a high-performance, non-blocking PCIe Gen2 system interconnect switch with integrated non-transparent bridging (NTB) and switch partitioning. Its core function is to enable secure, low-latency communication between multiple PCIe domains-such as CPUs, storage controllers, or accelerators-without requiring shared memory or OS-level coordination. The 89H32NT24AG2ZAHL8 achieves this through hardware-accelerated address translation, doorbell signaling, and up to eight independent switch partitions.
Does the 89H32NT24AG2ZAHL8 support PCIe Gen3 speeds?
No, the 89H32NT24AG2ZAHL8 is compliant only with PCI Express Base Specification 2.1 and operates at Gen2 speeds (5.0 GT/s) per lane. It does not support Gen3 (8.0 GT/s) signaling or associated electrical requirements. While it maintains backward compatibility with Gen1 (2.5 GT/s), any design requiring Gen3 bandwidth must use a different switch, such as the AMD/Spansion PEX8747, which is not pin-compatible with the 89H32NT24AG2ZAHL8.
How many non-transparent bridge (NTB) endpoints does the 89H32NT24AG2ZAHL8 support?
The 89H32NT24AG2ZAHL8 supports up to eight independent NTB endpoints. Each endpoint provides six BARs (Base Address Registers) for memory window mapping, 32-bit doorbell registers for event signaling, and four 32-bit message registers for mailbox-style inter-domain communication. This allows the 89H32NT24AG2ZAHL8 to connect up to eight separate PCIe root complexes or endpoints in isolated domains while maintaining full Gen2 bandwidth per link.
What package type and dimensions does the 89H32NT24AG2ZAHL8 use?
The 89H32NT24AG2ZAHL8 is packaged in a 484-ball Flip Chip Ball Grid Array (FC-BGA) with 23 mm × 23 mm body size and 1 mm ball pitch. It includes an exposed thermal pad on the underside for enhanced heat dissipation. This package is industry-standard for high-pin-count, high-power interconnect ICs and supports automated PCB assembly with standard reflow profiles.
Can the 89H32NT24AG2ZAHL8 be configured for different port topologies without changing hardware?
Yes, the 89H32NT24AG2ZAHL8 supports flexible port configuration via hardware strapping (STKxCfg pins) and runtime software control. It organizes its 24 ports into four x8 stacks, each configurable as x8, x4, x2, or x1-or combinations thereof-without modifying the PCB layout. Automatic lane-width negotiation and reversal further simplify interoperability with diverse endpoint configurations, making the 89H32NT24AG2ZAHL8 adaptable to evolving system requirements post-deployment.
89H32NT24AG2ZAHL8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Switch Interfacing
- Interface:
- PCI Express
- Voltage - Supply:
- 3.3V
- Supplier Device Package:
- 484-FCBGA (23x23)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89H32NT24AG2ZAHL8 FAQ
1.How can I place an order for 89H32NT24AG2ZAHL8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 89H32NT24AG2ZAHL8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 89H32NT24AG2ZAHL8 reliable?
The price and inventory of 89H32NT24AG2ZAHL8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H32NT24AG2ZAHL8 is usually 5 days.
3.What payment methods are accepted for 89H32NT24AG2ZAHL8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89H32NT24AG2ZAHL8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 89H32NT24AG2ZAHL8?
89H32NT24AG2ZAHL8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 89H32NT24AG2ZAHL8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 89H32NT24AG2ZAHL8?
For technical support, including 89H32NT24AG2ZAHL8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H32NT24AG2ZAHL8 requirements.
6.How does Aetrix verify that 89H32NT24AG2ZAHL8 is sourced from the original manufacturer or authorized distributors?
All 89H32NT24AG2ZAHL8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H32NT24AG2ZAHL8 meets industry standards.
7.What is the process for return or replacement of 89H32NT24AG2ZAHL8?
All 89H32NT24AG2ZAHL8 units undergo pre-shipment inspection (PSI). If there is an issue with 89H32NT24AG2ZAHL8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89H32NT24AG2ZAHL8 part is unused and in its original packaging.
Return procedure for 89H32NT24AG2ZAHL8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
89H32NT24AG2ZAHL8 Tags

-
NVT4857UKAZ
NXP Semiconductors
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments

-
MD0100N8-G
Microchip Technology

-
PCA9548APW,118
NXP Semiconductors

-
PCA9540BDP,118
NXP Semiconductors

-
PCA9548APWR
Texas Instruments

-
PCA9546APW,118
NXP Semiconductors

-
PTN3360DBS,518
NXP Semiconductors

-
PCA9546ABS,118
NXP Semiconductors

-
PCA9518PWR
Texas Instruments

-
PCA9545APW,118
NXP Semiconductors
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

