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Renesas 89H32NT24AG2ZAHLG8

Part No.:
89H32NT24AG2ZAHLG8
Manufacturer:
Renesas
Category:
Specialized
Package:
484-BBGA, FCBGA
Datasheet:
Aetrix89H32NT24AG2ZAHLG8.pdf
Description:
IC INTFACE SPECIALIZED 484FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,294

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Product details

Overview

89H32NT24AG2ZAHLG8 from IDT is a 32-lane, 24-port PCI Express Gen2 system interconnect switch with non-transparent bridging (NTB), switch partitioning, and integrated DMA controllers. It delivers up to 32 GBps switching capacity, supports 5.0 GT/s per lane, and operates in servers, storage systems, and intelligent I/O subsystems requiring multi-domain PCIe communication.

For engineers reviewing the 89H32NT24AG2ZAHLG8 datasheet, 89H32NT24AG2ZAHLG8 pinout, 89H32NT24AG2ZAHLG8 application, or 89H32NT24AG2ZAHLG8 equivalent, key selection considerations include NTB endpoint count (up to 8), switch partition support (up to 8 independent logical switches), SerDes configuration flexibility (de-emphasis, equalization, drive strength), hot-plug controller integration per downstream port, and compliance with PCI Express Base Specification 2.1 including AER, ECRC, ACS, and multicast.

Technical Context

The 89H32NT24AG2ZAHLG8 implements a Combined Input Output Queued (CIOQ) switch core with large buffers and low-latency cut-through architecture. It integrates eight non-transparent bridge endpoints, each with six BARs supporting 32/64-bit address translation and two lookup-table-based BARs for segmented aperture mapping.

It supports dynamic reconfiguration of switch partitions-including port migration and movable upstream ports-and provides two integrated DMA controllers, each with two channels supporting memory-to-memory transfers across partitions via NTB. Clocking supports 100 MHz or 125 MHz reference inputs with common, non-common, and local port clock modes.

Key Specifications

Parameter Value and Actual Design Meaning
Lanes / Ports 32 lanes, 24 ports - enables flexible topology scaling from x1 to x8 per port stack.
PCIe Generation Gen2 (5.0 GT/s) - backward compatible with Gen1 (2.5 GT/s); full compliance with PCIe Base Spec 2.1.
Switching Capacity 32 GBps (256 Gbps) - non-blocking throughput for concurrent peer-to-peer traffic flows.
NTB Endpoints Up to 8 - allows simultaneous inter-domain communication between CPUs, roots, or external PCIe domains.
Switch Partitions Up to 8 independent logical switches - enables hardware-isolated multi-tenant or multi-host system architectures.
DMA Channels 4 total (2 controllers × 2 channels) - offloads memory-to-memory transfers across partitions without CPU intervention.
Power Supplies 1.0V core, 2.5V I/O, 3.3V auxiliary - requires three regulated rails; SerDes power gating reduces idle consumption.
Package 484-ball Flip Chip BGA, 23 mm × 23 mm, 1 mm ball pitch - standard footprint for high-density server and storage PCBs.

Pinout & Package

Packaged in a 23 mm × 23 mm 484-ball Flip Chip BGA with 1 mm ball spacing. Pin functions include 24 differential PCIe SerDes lanes (ports 0–23), dual SMBus interfaces (master/slave), 9 GPIOs with multiple alternate functions (e.g., partition reset, link status, failover), reference clock inputs (global and per-port), JTAG test pins, and system control signals (PERSTN, RSTHALT, SWMODE).

Pin/Terminal Circuit Role Design Meaning
PE00RN[1:0]/PE00RP[1:0] PCIe Port 0 Receive Differential Pair Input for Gen2 5.0 GT/s serial data; supports automatic lane reversal and per-lane equalization.
PE00TN[1:0]/PE00TP[1:0] PCIe Port 0 Transmit Differential Pair Output for Gen2 5.0 GT/s serial data; configurable de-emphasis and drive strength per lane.
GCLKN[1:0]/GCLKP[1:0] Global Reference Clock Input Differential 100/125 MHz clock source for internal PLLs; both pairs must derive from same oscillator.
MSMBCLK/MSMBDAT SMBus Master Interface Controls external serial EEPROM and I/O expander for configuration and hot-plug management.
GPIO[0]–GPIO[8] Configurable General Purpose I/O Supports partition reset (PARTxPERSTN), link status reporting (P0LINKUPN), or failover signaling (FAILOVERx).

Key Features

Feature Design Value
Non-Transparent Bridging 8 NTB endpoints with 6 BARs each, 32 doorbell + 4 message registers - enables secure, isolated inter-domain memory access and event signaling.
Switch Partitioning 8 fully independent logical switches in one die - supports dynamic port reassignment and upstream port mobility across partitions.
Integrated DMA Controllers 2 controllers × 2 channels; fly-by translation for low-latency memory-to-memory transfers across partitions using NTB.
Hot-Plug Support Controller on all 23 downstream ports; uses external I²C I/O expander to minimize pin count while enabling card/cable presence detection.
RAS Capabilities SECDED ECC on all internal RAMs, end-to-end parity, ECRC regeneration, AER on all ports - meets enterprise-grade reliability requirements.
Flexible Clocking Modes Common clock, non-common clock, and local port clock with SSC - simplifies timing design across heterogeneous board layouts.

Applications

Enterprise Storage Arrays Multi-Host Server Backplanes

Use Scenario: High-availability storage controllers requiring redundant host access to shared NVMe/JBOD resources across independent PCIe domains.

IC Role / Device Role / Timing Role: Non-transparent bridge enabling peer-to-peer memory-mapped communication between dual Xeon processors and storage fabric.

Use Value: Eliminates software-based inter-processor messaging overhead; 8 NTB endpoints allow simultaneous access from up to 8 CPU roots with independent BAR windowing.

Use Scenario: Rack-scale modular servers where compute modules plug into a midplane with shared I/O and inter-module PCIe interconnect.

IC Role / Device Role / Timing Role: System interconnect switch providing partitioned, hot-pluggable PCIe connectivity between up to 8 independent compute nodes.

Use Value: 8 switch partitions isolate traffic between nodes; dynamic port reconfiguration supports runtime topology changes during module insertion/removal.

Intelligent I/O Acceleration Cards Communications Infrastructure Blades

Use Scenario: FPGA-based smart NICs or DPUs needing direct memory access to host DRAM while maintaining domain isolation from CPU.

IC Role / Device Role / Timing Role: NTB endpoint with DMA offload - enables zero-copy packet processing by mapping host memory into accelerator address space.

Use Value: 4 DMA channels support concurrent memory transfers across partitions; fly-by translation reduces latency vs. buffered DMA approaches.

Use Scenario: Carrier-grade blade servers with distributed control planes requiring deterministic inter-blade communication over PCIe.

IC Role / Device Role / Timing Role: Low-latency cut-through switch with multicast support - routes control messages and telemetry across 24 ports with QoS arbitration.

Use Value: Round-robin port arbitration and request metering balance bandwidth; 64 multicast groups enable efficient broadcast to selected blades.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen2 switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
89HPES32NT24AG2 Same die, identical functionality; ZAHLG8 suffix denotes specific tape-and-reel packaging and temperature grade (commercial, 0°C to 70°C). No functional difference; used interchangeably in designs where packaging and temp grade match requirements. Select 89H32NT24AG2ZAHLG8 when traceability to IDT's commercial-grade packaged variant is required for production release.
89HPES32NT24AG2ZAMLG8 Same silicon, but rated for industrial temperature range (−40°C to 85°C) and different moisture sensitivity level (MSL3 vs MSL4). Required for extended-temperature deployments such as outdoor telecom equipment or industrial control cabinets. Choose 89H32NT24AG2ZAHLG8 only for commercial environments; use ZAMLG8 for industrial thermal profiles.

Compared with 89H32NT24AG2ZAHLG8, the base part 89HPES32NT24AG2 lacks packaging and temp grade specification, while ZAMLG8 extends operational range at the cost of higher procurement cost and longer lead time - making ZAHLG8 optimal for volume commercial server/storage builds.

Availability

89H32NT24AG2ZAHLG8 is available at Aetrix Electronics and suitable for enterprise storage arrays, multi-host server backplanes, intelligent I/O acceleration cards, and communications infrastructure blades requiring stable component supply and long-term lifecycle support.

Supply support for 89H32NT24AG2ZAHLG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology, Inc.) is a fabless semiconductor company specializing in high-performance timing, memory interface, RF, and PCIe interconnect solutions, acquired by Renesas Electronics in 2019.

The 89H32NT24AG2ZAHLG8 belongs to IDT's PES (PCI Express Switch) family, designed specifically for high-throughput, multi-domain PCIe system interconnects in servers, storage, and communications infrastructure.

FAQ

What is the maximum PCIe link speed supported by the 89H32NT24AG2ZAHLG8?

The 89H32NT24AG2ZAHLG8 supports PCIe Gen2 operation at 5.0 GT/s per lane, with full backward compatibility to Gen1 at 2.5 GT/s. Its integrated SerDes complies with PCI Express Base Specification 2.1 and supports automatic per-port link width negotiation from x8 down to x1.

How many non-transparent bridge (NTB) endpoints does the 89H32NT24AG2ZAHLG8 support?

The 89H32NT24AG2ZAHLG8 supports up to 8 NTB endpoints, each with six BARs for address translation, 32 doorbell registers, and 4 message registers. This enables simultaneous inter-domain communication between up to 8 independent PCIe roots or CPUs.

Does the 89H32NT24AG2ZAHLG8 support hot-plug on all ports?

Yes, the 89H32NT24AG2ZAHLG8 integrates a hot-plug controller on all 23 downstream ports (ports 1–23). It uses an external I²C I/O expander connected via the SMBus master interface to manage presence detection, power sequencing, and event notification with minimal pin count.

What package type and dimensions does the 89H32NT24AG2ZAHLG8 use?

The 89H32NT24AG2ZAHLG8 is housed in a 484-ball Flip Chip BGA package measuring 23 mm × 23 mm with 1 mm ball pitch. This package supports high-density routing and thermal dissipation requirements typical of server and storage applications.

Can the 89H32NT24AG2ZAHLG8 be configured into multiple independent switch partitions?

Yes, the 89H32NT24AG2ZAHLG8 supports up to 8 fully independent switch partitions. Each partition operates as a logically isolated switch with configurable downstream port numbering and supports dynamic reconfiguration - including port migration and upstream port movement - without system reset.

89H32NT24AG2ZAHLG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
484-BBGA, FCBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Applications:
Switch Interfacing
Interface:
PCI Express
Voltage - Supply:
3.3V
Supplier Device Package:
484-FCBGA (23x23)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

89H32NT24AG2ZAHLG8 FAQ

1.How can I place an order for 89H32NT24AG2ZAHLG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 89H32NT24AG2ZAHLG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 89H32NT24AG2ZAHLG8 reliable?

The price and inventory of 89H32NT24AG2ZAHLG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H32NT24AG2ZAHLG8 is usually 5 days.

3.What payment methods are accepted for 89H32NT24AG2ZAHLG8?

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89H32NT24AG2ZAHLG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 89H32NT24AG2ZAHLG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 89H32NT24AG2ZAHLG8?

For technical support, including 89H32NT24AG2ZAHLG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H32NT24AG2ZAHLG8 requirements.

6.How does Aetrix verify that 89H32NT24AG2ZAHLG8 is sourced from the original manufacturer or authorized distributors?

All 89H32NT24AG2ZAHLG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H32NT24AG2ZAHLG8 meets industry standards.

7.What is the process for return or replacement of 89H32NT24AG2ZAHLG8?

All 89H32NT24AG2ZAHLG8 units undergo pre-shipment inspection (PSI). If there is an issue with 89H32NT24AG2ZAHLG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 89H32NT24AG2ZAHLG8 part is unused and in its original packaging.

Return procedure for 89H32NT24AG2ZAHLG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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