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Renesas 89H48H12G2ZDBLGI

Part No.:
89H48H12G2ZDBLGI
Manufacturer:
Renesas
Category:
Specialized
Package:
676-BBGA, FCBGA
Datasheet:
Aetrix89H48H12G2ZDBLGI.pdf
Description:
IC INTFACE SPECIALIZED 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,396

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Product details

Overview

The 89H48H12G2ZDBLGI from IDT is a 48-lane, 12-port PCI Express Gen2 system interconnect switch with x4/x8 port configurability, 5.0 GT/s per lane, full PCIe Base 2.0 compliance, and integrated SerDes supporting Gen1/Gen2 operation - deployed in high-throughput server and storage interconnects.

For engineers reviewing the 89H48H12G2ZDBLGI datasheet, 89H48H12G2ZDBLGI pinout, 89H48H12G2ZDBLGI application, or 89H48H12G2ZDBLGI equivalent, key selection criteria include non-blocking switching capacity (48 GBps), dynamic switch partitioning support (up to 12 partitions), QoS arbitration (WRR + request metering), hot-plug controller integration per port, and dual-power supply (1.0 V / 2.5 V) simplicity.

Technical Context

The 89H48H12G2ZDBLGI implements a Combined Input Output Queued (CIOQ) switch core with large frame buffers and cut-through latency architecture, enabling sub-100 ns forwarding for posted transactions. It supports up to 128-byte to 2-KB payload sizes and enforces end-to-end CRC (ECRC) regeneration across multicast paths.

Its port-level SerDes configuration includes per-lane de-emphasis, receive equalization, and drive strength control; clocking supports 100 MHz / 125 MHz reference inputs in common-clock or non-common-clock modes, with local port clock and SSC capability.

Key Specifications

ParameterValue and Actual Design Meaning
Lanes / Ports48 PCIe lanes, configurable as six x8 ports or twelve x4 ports - enables flexible topology mapping without external retimers.
Data Rate5.0 GT/s per lane (PCIe Gen2), backward-compatible to 2.5 GT/s (Gen1) - ensures interoperability with legacy endpoints.
Switch Capacity48 GBps (384 Gbps) non-blocking throughput - sustains full line-rate traffic across all ports simultaneously.
LatencyCut-through architecture with sub-100 ns forwarding delay for posted TLPs - reduces system-level transaction overhead.
Power SuppliesTwo rails: 1.0 V core, 2.5 V I/O - eliminates complex sequencing and reduces board-level DC-DC count.
Package676-ball Flip Chip BGA, 27 mm × 27 mm, 1.0 mm ball pitch - matches standard HDI PCB routing constraints.
Hot-PlugIntegrated controller on all 12 ports with GPE output and SCI/SMI generation - enables OS-transparent card insertion/removal.

Pinout & Package

676-ball Flip Chip BGA (FCBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free finish.

Pin/TerminalCircuit RoleDesign Meaning
CLK_IN[1:0]Reference clock input pairAccepts 100 MHz or 125 MHz differential reference; supports common/non-common clock topologies.
PERST#Global reset inputActive-low synchronous reset controlling initialization sequence and link training state machine.
GPE[7:0]General-purpose event outputDedicated open-drain outputs for hot-plug detection, link status, or custom signaling - configurable via register map.
SMBus_SCL/SDAConfiguration interfaceEnables in-system EEPROM programming and runtime configuration without JTAG debugger dependency.
PCIe_RX[47:0]/TX[47:0]High-speed serial I/O48 differential lane pairs with integrated SerDes; each supports automatic lane reversal and width negotiation (x8→x4→x2→x1).

Key Features

FeatureDesign Value
Dynamic switch partitioningUp to 12 logically independent switch partitions with movable upstream ports and dynamic port migration - isolates fault domains and enables multi-tenant resource allocation.
Request metering QoSIDT proprietary bandwidth-balancing algorithm that prevents starvation across ports - maintains predictable throughput under asymmetric traffic loads.
Autonomous link reliabilityAutomatic link degradation handling (e.g., lane failure) without host intervention - preserves active traffic flows during partial physical layer faults.
SECDED ECC on internal RAMsSingle-error correction / double-error detection applied to all on-chip SRAMs (route table, buffer descriptors) - meets RAS requirements for enterprise servers.
IEEE 1149.6 AC-JTAG supportAC-coupled boundary scan for high-speed SerDes interconnect testing - enables production-level validation of PCIe lane integrity.

Applications

Server Backplane InterconnectModular Storage Controller

Use Scenario: High-density rack-mounted servers requiring peer-to-peer GPU/NVMe communication across multiple chassis via midplane PCIe links.

IC Role / Device Role / Timing Role: System interconnect switch managing 48 lanes between CPU sockets, accelerators, and storage controllers with deterministic latency.

Use Value: Non-blocking 48 GBps capacity and cut-through latency enable real-time GPU-to-GPU synchronization without fabric bottlenecks.

Use Scenario: Enterprise JBOD enclosures where a single controller manages dozens of NVMe drives across redundant PCIe switch fabrics.

IC Role / Device Role / Timing Role: PCIe Gen2 switch providing bifurcated x8 upstream links to host controllers and twelve x4 downstream links to NVMe modules.

Use Value: Dynamic switch partitioning allows independent firmware update domains per drive bay group, improving serviceability and uptime.

Communications Packet ForwardingIntelligent I/O Expansion Chassis

Use Scenario: Carrier-grade routers using PCIe-based data plane acceleration cards connected via backplane to centralized control processors.

IC Role / Device Role / Timing Role: Low-latency interconnect switch aggregating traffic from multiple packet processing FPGAs to a central CPU complex.

Use Value: Sub-100 ns cut-through forwarding and ECRC regeneration preserve packet integrity across multi-hop PCIe hops.

Use Scenario: Industrial PC expansion chassis hosting heterogeneous I/O modules (vision, motion, fieldbus) with hot-swappable module slots.

IC Role / Device Role / Timing Role: Hot-plug–enabled PCIe switch providing isolated x4 links to each module slot, with GPE-driven event notification to host BIOS.

Use Value: Integrated hot-plug controllers eliminate need for external I²C I/O expanders - reducing BOM cost and layout area by 30%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen2 switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
89H48H12G2ZDBLGI8Same die, identical electrical specs, but shipped in tape-and-reel (TR) vs. tray (TL) packaging - no functional difference.Identical use cases; TR variant preferred for SMT line automation, TL for prototyping or low-volume assembly.Select based on assembly method, not performance or compatibility.
89H48H12G2ZDBLGITSame silicon, same package, but qualified for extended temperature range (–40°C to +105°C) vs. commercial (0°C to +70°C) grade.Required for industrial or outdoor communications equipment operating beyond commercial thermal limits.Choose only if ambient operating temperature exceeds 70°C or requires AEC-Q200 alignment.

Compared with the 89H48H12G2ZDBLGI, the TR-packaged 89H48H12G2ZDBLGI8 offers identical functionality with optimized logistics for high-volume manufacturing, while the extended-temp 89H48H12G2ZDBLGIT adds thermal robustness at no speed or feature trade-off - both retain full switch partitioning, QoS, and hot-plug capabilities.

Availability

The 89H48H12G2ZDBLGI is available at Aetrix Electronics and suitable for server backplanes, modular storage controllers, and intelligent I/O expansion chassis requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 89H48H12G2ZDBLGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT) is a fabless semiconductor company specializing in timing, memory interface, RF, and interconnect solutions, acquired by Renesas Electronics in 2019.

The 89H48H12G2ZDBLGI belongs to IDT's PRECISE™ PCIe switch family, engineered for high-reliability, high-throughput system interconnects in data center, telecom, and industrial infrastructure.

FAQ

What is the maximum payload size supported by the 89H48H12G2ZDBLGI?

The 89H48H12G2ZDBLGI supports a configurable maximum payload size ranging from 128 bytes to 2 KB, as defined by the PCIe Base Specification 2.0. This setting is controlled per-port via configuration space registers and directly impacts transaction efficiency and buffer utilization in high-bandwidth applications like GPU peer-to-peer transfers.

Does the 89H48H12G2ZDBLGI support PCIe Gen3 or higher data rates?

No, the 89H48H12G2ZDBLGI is strictly a PCIe Gen2 device, supporting 2.5 GT/s and 5.0 GT/s per lane only. It does not implement Gen3 (8.0 GT/s) or later PHY layers. Its SerDes architecture and compliance certification are limited to PCIe Base Specification 2.0, and no firmware or hardware upgrade path to Gen3 exists.

How many independent switch partitions can be configured on the 89H48H12G2ZDBLGI?

The 89H48H12G2ZDBLGI supports up to 12 fully independent switch partitions, each with dedicated route tables, arbitration logic, and configurable downstream device numbering. Partition boundaries are software-defined and can be reconfigured dynamically without resetting the device - enabling secure multi-tenant resource isolation in virtualized environments.

Is external EEPROM required for 89H48H12G2ZDBLGI initialization?

No, the 89H48H12G2ZDBLGI supports three initialization methods: Root Complex (BIOS/OS/driver), SMBus, or Serial EEPROM. Pin-strapped default configurations eliminate external EEPROM for basic topologies, while in-system EEPROM programming via SMBus allows field-updatable settings without hardware modification.

What power states does the 89H48H12G2ZDBLGI support for Active State Power Management (ASPM)?

The 89H48H12G2ZDBLGI supports L0s and L1 ASPM link states, with configurable entry timers for both. It also implements D0 (active), D3hot (soft off), and D3 (mechanical off) device states. SerDes power savings include lane-specific shutdown and half-swing mode - reducing idle power by up to 40% versus full-swing operation.

89H48H12G2ZDBLGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Applications:
Switch Interfacing
Interface:
PCI Express
Voltage - Supply:
3.3V
Supplier Device Package:
676-FCBGA (27x27)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

89H48H12G2ZDBLGI FAQ

1.How can I place an order for 89H48H12G2ZDBLGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 89H48H12G2ZDBLGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 89H48H12G2ZDBLGI reliable?

The price and inventory of 89H48H12G2ZDBLGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H48H12G2ZDBLGI is usually 5 days.

3.What payment methods are accepted for 89H48H12G2ZDBLGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89H48H12G2ZDBLGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 89H48H12G2ZDBLGI?

89H48H12G2ZDBLGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 89H48H12G2ZDBLGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 89H48H12G2ZDBLGI?

For technical support, including 89H48H12G2ZDBLGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H48H12G2ZDBLGI requirements.

6.How does Aetrix verify that 89H48H12G2ZDBLGI is sourced from the original manufacturer or authorized distributors?

All 89H48H12G2ZDBLGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H48H12G2ZDBLGI meets industry standards.

7.What is the process for return or replacement of 89H48H12G2ZDBLGI?

All 89H48H12G2ZDBLGI units undergo pre-shipment inspection (PSI). If there is an issue with 89H48H12G2ZDBLGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 89H48H12G2ZDBLGI part is unused and in its original packaging.

Return procedure for 89H48H12G2ZDBLGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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