Renesas 89H48H12G2ZDBLGI8
- Part No.:
- 89H48H12G2ZDBLGI8
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
89H48H12G2ZDBLGI8.pdf
- Description:
- IC INTFACE SPECIALIZED 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,365
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Product details
Overview
89H48H12G2ZDBLGI8 from IDT is a 48-lane, 12-port PCI Express Gen2 system interconnect switch with non-blocking architecture, 5.0 GT/s per lane, 384 Gbps total switching capacity, and support for up to 12 independent switch partitions. It serves as a high-throughput, low-latency PCIe fabric controller in server backplanes and intelligent I/O subsystems.
For engineers reviewing the 89H48H12G2ZDBLGI8 datasheet, 89H48H12G2ZDBLGI8 pinout, 89H48H12G2ZDBLGI8 application, or 89H48H12G2ZDBLGI8 equivalent, key selection considerations include Gen2 compliance, x4/x8 port bifurcation capability, autonomous link width negotiation, SECDED ECC on internal RAMs, and hot-plug controller integration across all 12 ports.
Technical Context
The 89H48H12G2ZDBLGI8 implements a Combined Input Output Queued (CIOQ) switch core with large frame buffers and cut-through forwarding to minimize latency. It supports full PCI Express Base Specification 2.0 compliance including Advanced Error Reporting (AER), End-to-End CRC (ECRC), and Access Control Services (ACS) on all ports.
Its SerDes layer operates at 2.5 GT/s (Gen1) and 5.0 GT/s (Gen2), with per-lane configurability for de-emphasis, receive equalization, and drive strength. Clocking supports 100 MHz and 125 MHz reference inputs in common-clock or non-common-clock modes, and local port clock with SSC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Lanes / Ports | 48 PCIe lanes, configurable as six x8 ports or twelve x4 ports via bifurcation |
| Data Rate | 5.0 GT/s per lane (PCIe Gen2), backward compatible with 2.5 GT/s (Gen1) |
| Switching Capacity | 384 Gbps (48 GBps) full non-blocking throughput |
| Max Payload Size | 128 Bytes to 2 KB - enables efficient large-packet transfers in storage and networking |
| Power Supplies | 1.0 V core + 2.5 V I/O - no power sequencing required |
| Package | 676-ball Flip Chip BGA, 27 mm × 27 mm, 1.0 mm ball pitch |
| Reliability Features | SECDED ECC on all internal RAMs; end-to-end data path parity; AER on all ports |
Pinout & Package
89H48H12G2ZDBLGI8 is housed in a 676-ball Flip Chip BGA (27 mm × 27 mm, 1.0 mm pitch). Pinout is defined by IDT's standard PCIe switch layout with dedicated SerDes lanes, configuration straps (STRAP[0:5]), SMBus interface (SCL/SDA), hot-plug control signals (HPx#, GPE), and 9 general-purpose I/Os.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| STRAP[0:5] | Configuration strapping inputs | Determines boot mode (EEPROM/SMBus/Root), default partitioning, and clock source without external components |
| SCL / SDA | SMBus interface | Enables in-system programming of Serial EEPROM and runtime configuration access |
| HP0#–HP11# | Hot-plug presence detect | Active-low input per port for card/cable detection; supports low-cost I²C I/O expanders |
| GPE | General Purpose Event output | Open-drain interrupt signal indicating hot-plug events to system controller or OS |
| REFCLK[0:11] | Reference clock inputs | 100/125 MHz differential inputs per port group; supports common/non-common clock topologies |
Key Features
| Feature | Design Value |
|---|---|
| Switch Partitioning | Up to 12 logically independent switch partitions with dynamic port migration and movable upstream port assignment |
| Request Metering | IDT proprietary bandwidth balancing algorithm that prevents port starvation and maximizes aggregate system throughput |
| Autonomous Link Control | Per-port automatic negotiation of link width (x8→x4→x2→x1) and speed, plus lane reversal and crosslink support |
| Hot-Plug Controller | Integrated hardware controller on all 12 ports enabling full hot-plug support without external ASICs or firmware overhead |
| Low-Power SerDes | Per-lane power gating: unused lanes enter low-power state; SerDes disabled in D3hot; half-swing operation reduces dynamic power |
Applications
| Server Backplane Interconnect | Intelligent I/O Expansion Hub |
|---|---|
Use Scenario: High-density rack servers requiring scalable PCIe connectivity between CPUs, accelerators, and NVMe drives. IC Role / Device Role / Timing Role: System interconnect switch providing non-blocking 48-lane fabric with sub-100 ns cut-through latency. Use Value: Enables concurrent peer-to-peer traffic among 12 endpoints while maintaining Gen2 5.0 GT/s per lane and ECRC integrity. | Use Scenario: Modular chassis with hot-swappable I/O modules (e.g., GPU, FPGA, NIC) communicating across domains. IC Role / Device Role / Timing Role: PCIe Gen2 switch with integrated hot-plug controller and GPE signaling for OS-level event handling. Use Value: Eliminates need for external hot-plug logic; supports dynamic reconfiguration of switch partitions during module insertion/removal. |
| Multi-Host Storage Fabric | Embedded Communications Platform |
Use Scenario: Dual-CPU storage controllers sharing JBOD enclosures with redundant paths and failover. IC Role / Device Role / Timing Role: 12-port switch with SECDED ECC on internal RAMs and autonomous link reliability for fault-tolerant operation. Use Value: Preserves system operation during intermittent link errors; supports AER reporting and MSI interrupts for rapid diagnostics. | Use Scenario: Ruggedized telecom edge platform integrating baseband processing, packet forwarding, and timing sync. IC Role / Device Role / Timing Role: PCIe Gen2 interconnect with 100/125 MHz reference clock flexibility and JTAG/IEEE 1149.6 test access. Use Value: Simplifies board layout with single 27 mm × 27 mm BGA; supports IEEE-compliant boundary scan and SerDes test modes for production validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen2 switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 89H48H12G2ZDBLGI | Same die, identical specs, but RoHS-compliant lead-free finish only (no halogen-free requirement) | No functional difference; suitable for same PCB designs where halogen-free certification is not mandated | Select 89H48H12G2ZDBLGI8 when halogen-free compliance (IEC 61249-2-21) is required for industrial or green procurement programs. |
| 89H48H12G2ZDBLGIT | Same silicon, extended temperature range (–40°C to +105°C) vs. commercial (0°C to +70°C) for 89H48H12G2ZDBLGI8 | Required for under-hood automotive, outdoor base stations, or industrial control cabinets with ambient thermal stress | Choose 89H48H12G2ZDBLGIT only if operating environment exceeds 70°C ambient or requires full industrial temp grade qualification. |
Compared with 89H48H12G2ZDBLGI and 89H48H12G2ZDBLGIT, the 89H48H12G2ZDBLGI8 provides identical switching performance and feature set but adds halogen-free packaging compliance-critical for EU WEEE/RoHS II and IPC-4101D-compliant PCB assembly without compromising thermal or electrical behavior.
Availability
89H48H12G2ZDBLGI8 is available at Aetrix Electronics and suitable for server backplane interconnect, intelligent I/O expansion hubs, and multi-host storage fabric applications requiring stable component supply, long-term lifecycle assurance, and halogen-free manufacturing compliance.
Supply support for 89H48H12G2ZDBLGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology, Inc. (IDT) is a fabless semiconductor company specializing in timing, memory interface, RF, and interconnect solutions, acquired by Renesas Electronics in 2019.
The 89H48H12G2ZDBLGI8 belongs to IDT's PRECISE™ PCIe switching product line, engineered for high-reliability, high-throughput system interconnect in datacenter, storage, and communications infrastructure where deterministic latency and RAS features are critical.
FAQ
What is the maximum PCIe Gen2 link width supported per port on the 89H48H12G2ZDBLGI8?
The 89H48H12G2ZDBLGI8 supports up to x8 link width per port. Six physical x8 ports can be configured, each optionally bifurcated into two x4 ports-yielding up to twelve x4 downstream ports. Automatic per-port link width negotiation allows dynamic down-training to x4, x2, or x1 based on endpoint capability.
Does the 89H48H12G2ZDBLGI8 support hot-plug functionality on all 12 ports?
Yes, the 89H48H12G2ZDBLGI8 integrates a hardware hot-plug controller on all 12 ports. Each port has dedicated HP# presence detect inputs and supports GPE interrupt generation. External low-cost I²C I/O expanders enable full hot-plug signaling-including card detect, power fault, and attention button-for legacy OS SCI/SMI compatibility.
What clocking options does the 89H48H12G2ZDBLGI8 support for PCIe Gen2 operation?
The 89H48H12G2ZDBLGI8 accepts 100 MHz or 125 MHz differential reference clocks per port group. It supports both common-clock and non-common-clock topologies, plus local port clock with spread-spectrum clocking (SSC) and port reference clock input-enabling flexible board-level clock distribution without requiring external clock buffers.
How many independent switch partitions can be configured on the 89H48H12G2ZDBLGI8?
The 89H48H12G2ZDBLGI8 supports up to 12 fully independent switch partitions using IDT's proprietary partitioning engine. Partitions are dynamically reconfigurable: downstream ports can migrate between partitions, upstream ports can be reassigned, and partition boundaries can be modified in-system without reset-enabling secure multi-tenant resource allocation.
What power management states and link states does the 89H48H12G2ZDBLGI8 implement?
The 89H48H12G2ZDBLGI8 supports D0, D3hot, and D3 power states, plus Active State Power Management (ASPM) with L0s, L1, L2/L3 Ready, and L3 link states. Configurable L0s and L1 entry timers allow tuning of latency vs. power trade-offs. Unused SerDes lanes are automatically placed in low-power states, and SerDes may be disabled entirely in D3hot.
89H48H12G2ZDBLGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Switch Interfacing
- Interface:
- PCI Express
- Voltage - Supply:
- 3.3V
- Supplier Device Package:
- 676-FCBGA (27x27)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89H48H12G2ZDBLGI8 FAQ
1.How can I place an order for 89H48H12G2ZDBLGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 89H48H12G2ZDBLGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 89H48H12G2ZDBLGI8 reliable?
The price and inventory of 89H48H12G2ZDBLGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H48H12G2ZDBLGI8 is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89H48H12G2ZDBLGI8 transactions.
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4.How is shipping managed for 89H48H12G2ZDBLGI8?
89H48H12G2ZDBLGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 89H48H12G2ZDBLGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 89H48H12G2ZDBLGI8?
For technical support, including 89H48H12G2ZDBLGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H48H12G2ZDBLGI8 requirements.
6.How does Aetrix verify that 89H48H12G2ZDBLGI8 is sourced from the original manufacturer or authorized distributors?
All 89H48H12G2ZDBLGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H48H12G2ZDBLGI8 meets industry standards.
7.What is the process for return or replacement of 89H48H12G2ZDBLGI8?
All 89H48H12G2ZDBLGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 89H48H12G2ZDBLGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89H48H12G2ZDBLGI8 part is unused and in its original packaging.
Return procedure for 89H48H12G2ZDBLGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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