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Renesas 89H48H12G3YCHL

Part No.:
89H48H12G3YCHL
Manufacturer:
Renesas
Category:
Specialized
Package:
676-BBGA, FCBGA
Datasheet:
Aetrix89H48H12G3YCHL.pdf
Description:
IC INTFACE SPECIALIZED 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,108

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Product details

Overview

89H48H12G3 from IDT is a 48-lane, 12-port PCI Express Gen3 system interconnect switch with non-blocking architecture, 8.0 GT/s SerDes, 96 GBps full-duplex switching capacity, SECDED ECC on internal RAMs, and support for up to 12 independent switch partitions - deployed in enterprise servers for SSD storage arrays and multi-root I/O expansion.

For engineers reviewing the 89H48H12G3 datasheet, 89H48H12G3 pinout, 89H48H12G3 application, or 89H48H12G3 equivalent, key selection criteria include Gen3 compliance, per-port AER/ACS/ARI support, autonomous link width negotiation, hot-plug capability on all downstream ports, and crosslink-enabled partition reconfiguration.

Technical Context

The 89H48H12G3 implements a cut-through, low-latency PCIe Gen3 switch core with 48 integrated SerDes lanes supporting x8/x4/x2/x1 configurations per port. It enforces end-to-end data path parity, ECRC, and SECDED ECC on all internal RAMs to meet enterprise RAS requirements.

It supports multi-root topology via 12 configurable switch partitions, dynamic upstream port relocation, and full compliance with PCIe Base Spec 3.0 including optional features: AER, ACS, ARI, TPH, LTR, OBFF, and IEEE 1149.1/1149.6 JTAG for debug and test.

Key Specifications

ParameterValue and Actual Design Meaning
Lane Count48 PCIe Gen3 lanes - enables flexible port mapping (e.g., six x8 or twelve x4 links)
Throughput96 GBps full-duplex aggregate bandwidth - sufficient for concurrent SSD array + network I/O traffic
LatencyCut-through architecture - sub-100 ns forwarding latency for time-critical peer-to-peer transfers
Error HandlingSECDED ECC on all internal RAMs + end-to-end parity - ensures data integrity across switching fabric
Power StatesD0/D3hot/D3 - compliant with PCIe Power Management Spec and ASPM L0s/L1
PartitioningUp to 12 independent switch partitions - isolates traffic domains in virtualized or multi-tenant server environments
Hot-PlugSupported on all downstream ports - enables live SSD or NIC insertion/removal without system reset

Pinout & Package

Packaged in a 27 mm × 27 mm 676-ball Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm ball pitch. Thermal and mechanical specifications align with JEDEC MO-271.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO_0–VDDIO_15I/O power supply15 dedicated 1.0 V I/O rails - enable independent voltage control per SerDes bank
REFCLK_P/N_0–REFCLK_P/N_3Reference clock input4 differential reference clock pairs - support global/local clocking for multi-root timing domains
PERST#PCIe reset inputAsynchronous active-low reset - initiates full switch initialization and configuration reload
GPIO[0:8]General-purpose I/O9 configurable pins - used for strap-based boot mode selection or status signaling
INTA#–INTD#Interrupt outputsFour legacy INTx signals - report link up/down, AER events, and partition errors
SMBus_CLK/SMBus_DATAConfiguration interfaceTwo-wire SMBus interface - allows runtime register access and firmware updates without PCIe enumeration

Key Features

FeatureDesign Value
Autonomous link negotiationPer-port auto-negotiation of width (x1/x2/x4/x8) and speed (Gen1/Gen2/Gen3) - eliminates manual strap or software tuning
Crosslink supportDirect inter-partition lane routing - enables zero-hop communication between isolated switch domains
Request meteringHardware-enforced bandwidth throttling per port - prevents starvation in mixed-traffic server workloads
On-Die Scope (ODS)Built-in real-time SerDes eye diagram and PRBS analysis - accelerates PCIe link bring-up and signal integrity validation
Multi-root partitioningRuntime-reconfigurable upstream port assignment - supports VM migration and workload rebalancing without hardware change

Applications

Enterprise Server I/O ExpansionSSD Storage Array Interconnect

Use Scenario: Adding PCIe-attached NVMe SSDs and SmartNICs to dual-socket Xeon platforms while maintaining isolation between tenants.

IC Role / Device Role / Timing Role: System interconnect switch managing peer-to-peer traffic between CPUs, memory, and I/O modules across 12 logical partitions.

Use Value: Enables simultaneous high-bandwidth SSD access and network offload without CPU intervention, leveraging 96 GBps fabric and SECDED ECC for data path reliability.

Use Scenario: Building scalable JBOD enclosures with 14+ NVMe drives connected via PCIe cables to host controllers.

IC Role / Device Role / Timing Role: Gen3 retimer-capable switch providing lane aggregation, fan-out, and link training stability over extended cable runs.

Use Value: Delivers deterministic 8.0 GT/s link performance across all 48 lanes, with automatic lane reversal and per-lane SerDes tuning for cable-induced skew compensation.

Multi-Host Communication FabricIntelligent I/O Module

Use Scenario: Connecting multiple ARM-based compute nodes in a disaggregated rack-scale architecture with shared storage and accelerator pools.

IC Role / Device Role / Timing Role: Multi-root-aware PCIe switch enabling transparent address translation and atomic operation forwarding between heterogeneous hosts.

Use Value: Supports ARI, ACS, and atomic operations ECN to maintain coherency and security boundaries across independently booted hosts.

Use Scenario: Integrating into an OCP-compliant IO module that aggregates GPU, FPGA, and NVMe resources for AI inference clusters.

IC Role / Device Role / Timing Role: High-density PCIe Gen3 switch providing flexible port allocation, hot-plug support, and RAS features for field-serviceable modules.

Use Value: Allows hot-swap replacement of entire I/O modules while preserving active traffic on other partitions - enabled by per-port hot-plug and interrupt-driven fault reporting.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen3 switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Microchip Switchtec® PFX 812412-port, 48-lane Gen3 switch with integrated DMA engine and SR-IOV support; lacks native crosslink and on-die scopeTargeted at hypervisor-managed virtualization where DMA offload and SR-IOV are required over partition mobilityChoose when hardware-accelerated VM-to-device DMA is critical; avoid if cross-partition lane routing or built-in SerDes diagnostics are needed
AMD/PLX PEX874748-lane Gen3 switch with 16 ports; supports Gen3.1 extensions and larger payload (4 KB), but no SECDED ECC on internal RAMsUsed in high-throughput HPC interconnects requiring >2 KB payloads and extended error detection beyond AERPrefer for compute-intensive workloads needing max payload size and Gen3.1 features; not suitable for RAS-critical enterprise storage control planes

Compared with Microchip PFX 8124 and AMD PEX8747, the 89H48H12G3 uniquely combines 12-partition mobility, crosslink routing, on-die SerDes diagnostics, and SECDED ECC - making it optimal for RAS-sensitive, dynamically reconfigurable server I/O fabrics rather than fixed-function virtualized or HPC interconnects.

Availability

89H48H12G3 is available at Aetrix Electronics and suitable for enterprise server I/O expansion, SSD storage array interconnect, multi-host communication fabric, and intelligent I/O module applications requiring stable component supply and long-term lifecycle support.

Supply support for 89H48H12G3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance analog, digital, and mixed-signal semiconductors for timing, memory, interface, and power management applications.

The 89H48H12G3 belongs to IDT's PCIe Switch family, engineered specifically for enterprise-class system interconnects demanding RAS, multi-root partitioning, and Gen3 link reliability in dense server and storage platforms.

FAQ

What is the maximum PCIe Gen3 link speed supported by the 89H48H12G3?

The 89H48H12G3 supports 8.0 GT/s per lane in PCIe Gen3 mode, with full backward compatibility to 5.0 GT/s (Gen2) and 2.5 GT/s (Gen1). All 48 lanes operate simultaneously at Gen3 speed when configured in x8/x4/x2/x1 topologies, delivering up to 96 GBps of full-duplex switching capacity. Link speed is negotiated autonomously per port during initialization.

Does the 89H48H12G3 support hot-plug functionality on all downstream ports?

Yes, the 89H48H12G3 supports hot-plug on all downstream switch ports per PCIe Base Specification 3.0. This enables safe insertion and removal of PCIe devices such as NVMe SSDs or network adapters without powering down the host system. Hot-plug status is reported via INTx or MSI interrupts, and link state changes are visible through on-chip status registers accessible via SMBus or PCIe configuration space.

How many independent switch partitions does the 89H48H12G3 support, and can they be reconfigured at runtime?

The 89H48H12G3 supports up to 12 fully independent switch partitions. Partition configuration - including upstream port assignment, device numbering, and traffic isolation - is dynamically reconfigurable without reset. The 89H48H12G3 allows movable upstream ports within and between partitions, enabling workload migration and resource reallocation in live server environments.

What error detection and correction mechanisms are implemented in the 89H48H12G3?

The 89H48H12G3 implements SECDED (Single Error Correction, Double Error Detection) ECC on all internal RAMs, end-to-end data path parity protection, ECRC generation/verification, and Advanced Error Reporting (AER) on every port. These features collectively ensure data integrity across the switching fabric, detect transient and permanent faults, and provide detailed error logging for RAS-critical enterprise deployments.

Is there evaluation hardware available for the 89H48H12G3, and what tools does it support?

Yes, the 89KTPES48H12G3 Evaluation Board is the official platform for the 89H48H12G3. It supports PCIe Browser Software, On-Die Scope (ODS) for real-time SerDes analysis, built-in PRBS generator/checker for link validation, and full register-level access via SMBus and PCIe. Documentation and firmware updates are available at www.IDT.com.

89H48H12G3YCHL Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Applications:
Switch Interfacing
Interface:
PCI Express
Voltage - Supply:
-
Supplier Device Package:
676-FCBGA (27x27)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

89H48H12G3YCHL FAQ

1.How can I place an order for 89H48H12G3YCHL through Aetrix?

Please submit a Request for Quotation (RFQ) for 89H48H12G3YCHL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 89H48H12G3YCHL reliable?

The price and inventory of 89H48H12G3YCHL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H48H12G3YCHL is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89H48H12G3YCHL transactions.

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4.How is shipping managed for 89H48H12G3YCHL?

89H48H12G3YCHL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 89H48H12G3YCHL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 89H48H12G3YCHL?

For technical support, including 89H48H12G3YCHL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H48H12G3YCHL requirements.

6.How does Aetrix verify that 89H48H12G3YCHL is sourced from the original manufacturer or authorized distributors?

All 89H48H12G3YCHL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H48H12G3YCHL meets industry standards.

7.What is the process for return or replacement of 89H48H12G3YCHL?

All 89H48H12G3YCHL units undergo pre-shipment inspection (PSI). If there is an issue with 89H48H12G3YCHL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 89H48H12G3YCHL part is unused and in its original packaging.

Return procedure for 89H48H12G3YCHL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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