Renesas 89H48H12G3YCHL
- Part No.:
- 89H48H12G3YCHL
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
89H48H12G3YCHL.pdf
- Description:
- IC INTFACE SPECIALIZED 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,108
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Product details
Overview
89H48H12G3 from IDT is a 48-lane, 12-port PCI Express Gen3 system interconnect switch with non-blocking architecture, 8.0 GT/s SerDes, 96 GBps full-duplex switching capacity, SECDED ECC on internal RAMs, and support for up to 12 independent switch partitions - deployed in enterprise servers for SSD storage arrays and multi-root I/O expansion.
For engineers reviewing the 89H48H12G3 datasheet, 89H48H12G3 pinout, 89H48H12G3 application, or 89H48H12G3 equivalent, key selection criteria include Gen3 compliance, per-port AER/ACS/ARI support, autonomous link width negotiation, hot-plug capability on all downstream ports, and crosslink-enabled partition reconfiguration.
Technical Context
The 89H48H12G3 implements a cut-through, low-latency PCIe Gen3 switch core with 48 integrated SerDes lanes supporting x8/x4/x2/x1 configurations per port. It enforces end-to-end data path parity, ECRC, and SECDED ECC on all internal RAMs to meet enterprise RAS requirements.
It supports multi-root topology via 12 configurable switch partitions, dynamic upstream port relocation, and full compliance with PCIe Base Spec 3.0 including optional features: AER, ACS, ARI, TPH, LTR, OBFF, and IEEE 1149.1/1149.6 JTAG for debug and test.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Lane Count | 48 PCIe Gen3 lanes - enables flexible port mapping (e.g., six x8 or twelve x4 links) |
| Throughput | 96 GBps full-duplex aggregate bandwidth - sufficient for concurrent SSD array + network I/O traffic |
| Latency | Cut-through architecture - sub-100 ns forwarding latency for time-critical peer-to-peer transfers |
| Error Handling | SECDED ECC on all internal RAMs + end-to-end parity - ensures data integrity across switching fabric |
| Power States | D0/D3hot/D3 - compliant with PCIe Power Management Spec and ASPM L0s/L1 |
| Partitioning | Up to 12 independent switch partitions - isolates traffic domains in virtualized or multi-tenant server environments |
| Hot-Plug | Supported on all downstream ports - enables live SSD or NIC insertion/removal without system reset |
Pinout & Package
Packaged in a 27 mm × 27 mm 676-ball Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm ball pitch. Thermal and mechanical specifications align with JEDEC MO-271.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_15 | I/O power supply | 15 dedicated 1.0 V I/O rails - enable independent voltage control per SerDes bank |
| REFCLK_P/N_0–REFCLK_P/N_3 | Reference clock input | 4 differential reference clock pairs - support global/local clocking for multi-root timing domains |
| PERST# | PCIe reset input | Asynchronous active-low reset - initiates full switch initialization and configuration reload |
| GPIO[0:8] | General-purpose I/O | 9 configurable pins - used for strap-based boot mode selection or status signaling |
| INTA#–INTD# | Interrupt outputs | Four legacy INTx signals - report link up/down, AER events, and partition errors |
| SMBus_CLK/SMBus_DATA | Configuration interface | Two-wire SMBus interface - allows runtime register access and firmware updates without PCIe enumeration |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous link negotiation | Per-port auto-negotiation of width (x1/x2/x4/x8) and speed (Gen1/Gen2/Gen3) - eliminates manual strap or software tuning |
| Crosslink support | Direct inter-partition lane routing - enables zero-hop communication between isolated switch domains |
| Request metering | Hardware-enforced bandwidth throttling per port - prevents starvation in mixed-traffic server workloads |
| On-Die Scope (ODS) | Built-in real-time SerDes eye diagram and PRBS analysis - accelerates PCIe link bring-up and signal integrity validation |
| Multi-root partitioning | Runtime-reconfigurable upstream port assignment - supports VM migration and workload rebalancing without hardware change |
Applications
| Enterprise Server I/O Expansion | SSD Storage Array Interconnect |
|---|---|
Use Scenario: Adding PCIe-attached NVMe SSDs and SmartNICs to dual-socket Xeon platforms while maintaining isolation between tenants. IC Role / Device Role / Timing Role: System interconnect switch managing peer-to-peer traffic between CPUs, memory, and I/O modules across 12 logical partitions. Use Value: Enables simultaneous high-bandwidth SSD access and network offload without CPU intervention, leveraging 96 GBps fabric and SECDED ECC for data path reliability. | Use Scenario: Building scalable JBOD enclosures with 14+ NVMe drives connected via PCIe cables to host controllers. IC Role / Device Role / Timing Role: Gen3 retimer-capable switch providing lane aggregation, fan-out, and link training stability over extended cable runs. Use Value: Delivers deterministic 8.0 GT/s link performance across all 48 lanes, with automatic lane reversal and per-lane SerDes tuning for cable-induced skew compensation. |
| Multi-Host Communication Fabric | Intelligent I/O Module |
Use Scenario: Connecting multiple ARM-based compute nodes in a disaggregated rack-scale architecture with shared storage and accelerator pools. IC Role / Device Role / Timing Role: Multi-root-aware PCIe switch enabling transparent address translation and atomic operation forwarding between heterogeneous hosts. Use Value: Supports ARI, ACS, and atomic operations ECN to maintain coherency and security boundaries across independently booted hosts. | Use Scenario: Integrating into an OCP-compliant IO module that aggregates GPU, FPGA, and NVMe resources for AI inference clusters. IC Role / Device Role / Timing Role: High-density PCIe Gen3 switch providing flexible port allocation, hot-plug support, and RAS features for field-serviceable modules. Use Value: Allows hot-swap replacement of entire I/O modules while preserving active traffic on other partitions - enabled by per-port hot-plug and interrupt-driven fault reporting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen3 switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Microchip Switchtec® PFX 8124 | 12-port, 48-lane Gen3 switch with integrated DMA engine and SR-IOV support; lacks native crosslink and on-die scope | Targeted at hypervisor-managed virtualization where DMA offload and SR-IOV are required over partition mobility | Choose when hardware-accelerated VM-to-device DMA is critical; avoid if cross-partition lane routing or built-in SerDes diagnostics are needed |
| AMD/PLX PEX8747 | 48-lane Gen3 switch with 16 ports; supports Gen3.1 extensions and larger payload (4 KB), but no SECDED ECC on internal RAMs | Used in high-throughput HPC interconnects requiring >2 KB payloads and extended error detection beyond AER | Prefer for compute-intensive workloads needing max payload size and Gen3.1 features; not suitable for RAS-critical enterprise storage control planes |
Compared with Microchip PFX 8124 and AMD PEX8747, the 89H48H12G3 uniquely combines 12-partition mobility, crosslink routing, on-die SerDes diagnostics, and SECDED ECC - making it optimal for RAS-sensitive, dynamically reconfigurable server I/O fabrics rather than fixed-function virtualized or HPC interconnects.
Availability
89H48H12G3 is available at Aetrix Electronics and suitable for enterprise server I/O expansion, SSD storage array interconnect, multi-host communication fabric, and intelligent I/O module applications requiring stable component supply and long-term lifecycle support.
Supply support for 89H48H12G3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance analog, digital, and mixed-signal semiconductors for timing, memory, interface, and power management applications.
The 89H48H12G3 belongs to IDT's PCIe Switch family, engineered specifically for enterprise-class system interconnects demanding RAS, multi-root partitioning, and Gen3 link reliability in dense server and storage platforms.
FAQ
What is the maximum PCIe Gen3 link speed supported by the 89H48H12G3?
The 89H48H12G3 supports 8.0 GT/s per lane in PCIe Gen3 mode, with full backward compatibility to 5.0 GT/s (Gen2) and 2.5 GT/s (Gen1). All 48 lanes operate simultaneously at Gen3 speed when configured in x8/x4/x2/x1 topologies, delivering up to 96 GBps of full-duplex switching capacity. Link speed is negotiated autonomously per port during initialization.
Does the 89H48H12G3 support hot-plug functionality on all downstream ports?
Yes, the 89H48H12G3 supports hot-plug on all downstream switch ports per PCIe Base Specification 3.0. This enables safe insertion and removal of PCIe devices such as NVMe SSDs or network adapters without powering down the host system. Hot-plug status is reported via INTx or MSI interrupts, and link state changes are visible through on-chip status registers accessible via SMBus or PCIe configuration space.
How many independent switch partitions does the 89H48H12G3 support, and can they be reconfigured at runtime?
The 89H48H12G3 supports up to 12 fully independent switch partitions. Partition configuration - including upstream port assignment, device numbering, and traffic isolation - is dynamically reconfigurable without reset. The 89H48H12G3 allows movable upstream ports within and between partitions, enabling workload migration and resource reallocation in live server environments.
What error detection and correction mechanisms are implemented in the 89H48H12G3?
The 89H48H12G3 implements SECDED (Single Error Correction, Double Error Detection) ECC on all internal RAMs, end-to-end data path parity protection, ECRC generation/verification, and Advanced Error Reporting (AER) on every port. These features collectively ensure data integrity across the switching fabric, detect transient and permanent faults, and provide detailed error logging for RAS-critical enterprise deployments.
Is there evaluation hardware available for the 89H48H12G3, and what tools does it support?
Yes, the 89KTPES48H12G3 Evaluation Board is the official platform for the 89H48H12G3. It supports PCIe Browser Software, On-Die Scope (ODS) for real-time SerDes analysis, built-in PRBS generator/checker for link validation, and full register-level access via SMBus and PCIe. Documentation and firmware updates are available at www.IDT.com.
89H48H12G3YCHL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Switch Interfacing
- Interface:
- PCI Express
- Voltage - Supply:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89H48H12G3YCHL FAQ
1.How can I place an order for 89H48H12G3YCHL through Aetrix?
Please submit a Request for Quotation (RFQ) for 89H48H12G3YCHL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 89H48H12G3YCHL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H48H12G3YCHL is usually 5 days.
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5.How can I obtain technical support or documentation for 89H48H12G3YCHL?
For technical support, including 89H48H12G3YCHL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H48H12G3YCHL requirements.
6.How does Aetrix verify that 89H48H12G3YCHL is sourced from the original manufacturer or authorized distributors?
All 89H48H12G3YCHL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H48H12G3YCHL meets industry standards.
7.What is the process for return or replacement of 89H48H12G3YCHL?
All 89H48H12G3YCHL units undergo pre-shipment inspection (PSI). If there is an issue with 89H48H12G3YCHL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89H48H12G3YCHL part is unused and in its original packaging.
Return procedure for 89H48H12G3YCHL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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