Renesas 89H48H12G3YCHL8
- Part No.:
- 89H48H12G3YCHL8
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
89H48H12G3YCHL8.pdf
- Description:
- IC INTFACE SPECIALIZED 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,674
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
89H48H12G3 from IDT is a 48-lane, 12-port PCI Express Gen3 system interconnect switch with non-blocking architecture, 8.0 GT/s SerDes per lane, 96 GBps full-duplex switching capacity, SECDED ECC on all internal RAMs, and support for up to 12 independent switch partitions in enterprise server I/O expansion.
For engineers reviewing the 89H48H12G3 datasheet, 89H48H12G3 pinout, 89H48H12G3 application, or 89H48H12G3 equivalent, key selection criteria include Gen3 compliance, partitioning flexibility, AER/ACS/ARI feature support, hot-plug capability on all downstream ports, and FCBGA-676 package compatibility with high-density server PCB layouts.
Technical Context
The 89H48H12G3 implements a cut-through, low-latency PCIe Gen3 switch core with 12 configurable ports supporting x8/x4/x2/x1 link widths and autonomous per-port negotiation. Its DL/Transaction Layer handles TLP processing with 2 KB max payload, LTR, TPH, and OBFF support.
It delivers multi-root capability via 12 independent switch partitions, each with movable upstream port assignment and dynamic reconfiguration. RAS features include ECRC, end-to-end parity, IEEE 1149.1/1149.6 JTAG, and interrupt generation on link state transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Lanes / Ports | 48 PCIe Gen3 lanes across 12 configurable ports (supports up to 6×x8 or 12×x4) |
| Throughput | 96 GBps full-duplex aggregate bandwidth (768 Gbps) with cut-through forwarding |
| Compliance | PCIe Base Specification 3.0; supports AER, ACS, ARI, LTR, TPH, OBFF, atomic ops |
| Power States | D0, D3hot, D3; Active State Power Management (ASPM) supported on all ports |
| RAS Features | SECDED ECC on all internal RAMs; end-to-end data path parity; ECRC per port |
| Configuration | Root/BIOS/OS/driver, SMBus, serial EEPROM, or pin strapping; no power sequencing required |
| Package | 27 mm × 27 mm FCBGA with 676 balls; RoHS-compliant, lead-free |
Pinout & Package
Package: 27 mm × 27 mm Fine-Pitch Chip Scale Ball Grid Array (FCBGA) with 676 I/O balls, designed for high-speed signal integrity in dense server backplanes and midplanes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_15 | I/O power supply banks | 16 independent 1.0V I/O rails enabling mixed-voltage signaling and bank-specific termination control |
| REFCLK_P/N_0–REFCLK_P/N_3 | Differential reference clock inputs | Four dedicated differential clock pairs supporting global/local reference sourcing for multi-domain timing |
| PERST# | PCIe reset input | Asynchronous active-low reset controlling switch initialization and error recovery sequence |
| CLKREQ#_0–CLKREQ#_11 | Downstream port clock request | Per-port clock gating control enabling ASPM L1 entry/exit coordination with endpoint devices |
| GPI[0:8] | General-purpose input/output | Nine configurable GPIOs usable for status monitoring, board-level control, or debug signaling |
Key Features
| Feature | Design Value |
|---|---|
| Non-blocking 12-port switch core | Enables simultaneous peer-to-peer traffic across all 12 ports without arbitration bottlenecks |
| Dynamic partition reconfiguration | Allows runtime reallocation of upstream port assignment and device numbering between 12 independent partitions |
| Hot-plug support on all downstream ports | Enables live insertion/removal of PCIe endpoints without system reboot or switch reset |
| Integrated PRBS generator/checker | On-die test capability for SerDes link margin validation without external equipment |
| IEEE 1149.6 AC-JTAG support | Enables high-speed boundary-scan testing of AC-coupled PCIe traces on production boards |
Applications
| Enterprise Server I/O Expansion | Multi-Host Storage Fabric |
|---|---|
Use Scenario: Adding PCIe slots and SSD connectivity to dual-CPU server motherboards with strict thermal and layer-count constraints. IC Role / Device Role / Timing Role: System interconnect switch managing traffic between CPUs, memory controllers, NICs, and NVMe SSDs across multiple root complexes. Use Value: Delivers 96 GBps non-blocking throughput while enabling 12 independent partitions for workload isolation and VM-aware I/O routing. | Use Scenario: Building scalable JBOD enclosures with 14+ NVMe SSDs connected via PCIe cables to host systems. IC Role / Device Role / Timing Role: PCIe Gen3 retimer-capable switch providing signal integrity compensation and lane bifurcation for long-reach cable interconnects. Use Value: Supports automatic lane reversal and per-lane SerDes configuration to maintain 8.0 GT/s link integrity over >30 cm FR4 traces or passive cables. |
| Intelligent I/O Module | Communications Equipment Backplane |
Use Scenario: Modular I/O mezzanine cards with FPGA accelerators, SmartNICs, and co-processor interfaces sharing PCIe resources. IC Role / Device Role / Timing Role: Configurable switch partitioning hub enabling dynamic allocation of PCIe lanes to different accelerator functions under OS control. Use Value: Allows runtime reassignment of upstream port and device enumeration to support heterogeneous workloads without hardware changes. | Use Scenario: High-availability telecom chassis with redundant control planes and distributed packet processing blades. IC Role / Device Role / Timing Role: Fault-tolerant interconnect switch providing hot-plug-capable downstream links and IEEE 1149.6 JTAG for field-serviceable backplane diagnostics. Use Value: Enables link-up/down interrupt generation and on-chip activity monitoring to support rapid fault localization in carrier-grade systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen3 switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Microchip Switchtec® PAX1212 | 12-port Gen3 switch with integrated DMA engine and SR-IOV support; lacks native ARI/ACS implementation | Better suited for virtualized NFV platforms requiring hardware-assisted I/O virtualization | Select when SR-IOV offload and DMA-based peer-to-peer transfers are required over advanced partitioning |
| AMD/Spansion PLX87XX series | Legacy Gen3 switch family with fixed 8-port topology; no dynamic partitioning or SECDED ECC on internal RAMs | Targeted at cost-sensitive embedded systems with static I/O topologies and lower RAS requirements | Select only for legacy design refresh where pinout compatibility and minimal firmware changes are critical |
Compared with PAX1212 and PLX87XX, the 89H48H12G3 uniquely combines 12-partition dynamic reconfiguration, SECDED ECC on all RAMs, and full PCIe 3.0 optional feature set-making it optimal for next-gen enterprise servers requiring workload isolation and hardware-level RAS.
Availability
89H48H12G3 is available at Aetrix Electronics and suitable for enterprise server I/O expansion, multi-host storage fabric, intelligent I/O modules, and communications equipment backplane applications requiring stable component supply and long-term lifecycle support.
Supply support for 89H48H12G3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance analog, digital, and mixed-signal semiconductors for timing, memory interface, RF, and connectivity markets.
The 89H48H12G3 belongs to IDT's PCIe Switch family, engineered specifically for scalable, RAS-enhanced system interconnect in multi-root enterprise and storage infrastructure.
FAQ
What PCIe generations and speeds does the 89H48H12G3 support?
The 89H48H12G3 supports PCIe Gen3 at 8.0 GT/s, Gen2 at 5.0 GT/s, and Gen1 at 2.5 GT/s across all 48 lanes. Each SerDes lane operates independently with automatic speed negotiation per port. It fully complies with the PCI Express Base Specification 3.0 and implements all mandatory and selected optional features including AER, ACS, and LTR. Backward compatibility ensures interoperability with legacy Gen1/Gen2 endpoints without firmware modification.
Does the 89H48H12G3 support hot-plug functionality?
Yes, the 89H48H12G3 supports hot-plug on all downstream switch ports per PCIe specification requirements. It generates MSI or INTx interrupts on link up/down transitions and maintains stable upstream link operation during endpoint insertion/removal. This capability is validated in enterprise server reference designs and enables maintenance of I/O resources without system downtime. The 89H48H12G3 also provides on-chip link status outputs for real-time monitoring of hot-plug events.
How many independent switch partitions does the 89H48H12G3 support?
The 89H48H12G3 supports up to 12 fully independent switch partitions, each with configurable downstream device numbering and movable upstream port assignment. Partition boundaries can be redefined dynamically via software without resetting the device. This architecture enables strict workload isolation in virtualized environments and allows OS-level control over PCIe resource allocation. The 89H48H12G3 implements this through dedicated route table and scheduler logic within its 12-port switch core.
What reliability features are implemented in the 89H48H12G3?
The 89H48H12G3 integrates SECDED ECC protection on all internal RAMs, end-to-end data path parity, ECRC on every port, and IEEE 1149.1/1149.6 JTAG for boundary-scan testing. It also supports Advanced Error Reporting (AER) across all ports and generates interrupts on link state changes. These features collectively meet enterprise-class RAS requirements for mission-critical infrastructure. The 89H48H12G3's reliability architecture is validated in server and storage qualification tests per JEDEC and PCIe CEM specifications.
Is an evaluation platform available for the 89H48H12G3?
Yes, the 89KTPES48H12G3 Evaluation Board is officially supported for the 89H48H12G3. It includes PCIe Browser Software, On-Die Scope (ODS) visibility into internal transaction flow, and built-in PRBS generator/checker for SerDes link margin analysis. The board supports full 48-lane operation and enables validation of partitioning, hot-plug, and RAS features in lab environments. Documentation, firmware, and schematics for the 89H48H12G3 evaluation platform are available at www.IDT.com.
89H48H12G3YCHL8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Switch Interfacing
- Interface:
- PCI Express
- Voltage - Supply:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89H48H12G3YCHL8 FAQ
1.How can I place an order for 89H48H12G3YCHL8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 89H48H12G3YCHL8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 89H48H12G3YCHL8 reliable?
The price and inventory of 89H48H12G3YCHL8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H48H12G3YCHL8 is usually 5 days.
3.What payment methods are accepted for 89H48H12G3YCHL8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89H48H12G3YCHL8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 89H48H12G3YCHL8?
89H48H12G3YCHL8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 89H48H12G3YCHL8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 89H48H12G3YCHL8?
For technical support, including 89H48H12G3YCHL8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H48H12G3YCHL8 requirements.
6.How does Aetrix verify that 89H48H12G3YCHL8 is sourced from the original manufacturer or authorized distributors?
All 89H48H12G3YCHL8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H48H12G3YCHL8 meets industry standards.
7.What is the process for return or replacement of 89H48H12G3YCHL8?
All 89H48H12G3YCHL8 units undergo pre-shipment inspection (PSI). If there is an issue with 89H48H12G3YCHL8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89H48H12G3YCHL8 part is unused and in its original packaging.
Return procedure for 89H48H12G3YCHL8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
89H48H12G3YCHL8 Tags

-
NVT4857UKAZ
NXP Semiconductors
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments

-
MD0100N8-G
Microchip Technology

-
PCA9548APW,118
NXP Semiconductors

-
PCA9540BDP,118
NXP Semiconductors

-
PCA9548APWR
Texas Instruments

-
PCA9546APW,118
NXP Semiconductors

-
PTN3360DBS,518
NXP Semiconductors

-
PCA9546ABS,118
NXP Semiconductors

-
PCA9518PWR
Texas Instruments

-
PCA9545APW,118
NXP Semiconductors
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

