Renesas 89H48H12G3YCHLG8
- Part No.:
- 89H48H12G3YCHLG8
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
89H48H12G3YCHLG8.pdf
- Description:
- IC INTFACE SPECIALIZED 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,771
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Product details
Overview
The 89H48H12G3 from IDT is a 48-lane, 12-port PCI Express Gen3 system interconnect switch with non-blocking architecture, 8.0 GT/s SerDes, 96 GBps full-duplex switching capacity, SECDED ECC on internal RAMs, and support for up to 12 independent switch partitions in enterprise server I/O expansion.
For engineers reviewing the 89H48H12G3 datasheet, 89H48H12G3 pinout, 89H48H12G3 application, or 89H48H12G3 equivalent, key selection criteria include Gen3-compliant lane aggregation (x8/x4/x2/x1), AER/ACS/ARI/TPH/LTR optional feature implementation, hot-plug support on all downstream ports, and multi-root partitioning capability for virtualized storage and compute domains.
Technical Context
The 89H48H12G3 implements a cut-through, low-latency PCIe Gen3 switch core with 48 integrated SerDes lanes supporting 8.0 GT/s, 5.0 GT/s, and 2.5 GT/s operation across 12 configurable ports. It enforces end-to-end data path parity, ECRC, and SECDED ECC on all internal RAMs for RAS-critical infrastructure.
It supports autonomous link width negotiation, per-lane SerDes configuration, global/local reference clock inputs, crosslink topology, and dynamic reconfiguration of up to 12 independent switch partitions - enabling flexible I/O virtualization in multi-host server and intelligent storage controller applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Lanes / Ports | 48 PCIe Gen3 lanes, configurable as 12 x4 or 6 x8 ports for flexible I/O expansion |
| Throughput | 96 GBps full-duplex aggregated bandwidth (768 Gbps) with cut-through latency |
| PCIe Compliance | Fully compliant with PCIe Base Spec 3.0; implements AER, ACS, ARI, TPH, LTR, OBFF, atomic ops |
| Power States | Supports D0, D3hot, D3 power states and Active State Power Management (ASPM) |
| RAS Features | SECDED ECC on all internal RAMs, end-to-end parity, ECRC, hot-plug on all downstream ports |
| Package | 27 mm × 27 mm 676-ball FCBGA with thermal lid for high-power server environments |
| Initialization | Supports BIOS/OS/driver, serial EEPROM, pin strapping, and SMBus; no power sequencing required |
Pinout & Package
Package: 27 mm × 27 mm 676-ball Fine-Pitch Chip Array Ball Grid Array (FCBGA) with thermal lid and standard JEDEC MO-271AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_0–VDDA_15 | Analog supply rails | 16 dedicated analog power pins for SerDes PLL and receiver bias stability |
| VDDIO_0–VDDIO_23 | I/O supply rails | 24 digital I/O supplies supporting 1.0 V ±5% for PCIe Gen3 signaling integrity |
| REFCLK_P/N_0–7 | Differential reference clocks | 8 pairs for independent port clocking; supports global/local clock source selection |
| PERST#_0–11 | Per-port reset signals | 12 active-low reset lines enabling independent downstream port initialization |
| GPI[0:8] | General-purpose inputs | 9 configurable GPIOs usable for strap control, status monitoring, or debug signaling |
Key Features
| Feature | Design Value |
|---|---|
| Multi-root partitioning | Up to 12 fully independent switch partitions with movable upstream port assignment for VM-aware I/O resource allocation |
| Request metering | Hardware-enforced traffic shaping per port to prevent starvation and maximize system throughput under mixed workloads |
| Autonomous lane reversal | Automatic SerDes lane polarity correction eliminates manual PCB trace swapping during layout |
| On-die scope (ODS) | Integrated real-time signal integrity analysis engine accessible via PCIe Browser for in-system SerDes tuning |
| PRBS generator/checker | Built-in pseudo-random bit sequence test capability for production validation and field diagnostics without external equipment |
Applications
| Enterprise Server I/O Expansion | Intelligent NVMe Storage Controller |
|---|---|
Use Scenario: Adding PCIe Gen3 connectivity to legacy servers lacking native 48-lane scalability while maintaining backward compatibility with Gen2/Gen1 endpoints. IC Role / Device Role / Timing Role: System interconnect switch managing peer-to-peer traffic between CPU sockets, memory controllers, and add-in cards. Use Value: Enables 12-port fan-out with full x4/x8 flexibility and hardware-based request metering to balance bandwidth across virtualized workloads. | Use Scenario: Building scalable NVMe over Fabrics (NVMe-oF) storage arrays with direct-attached SSDs and host-side fabric gateways. IC Role / Device Role / Timing Role: PCIe Gen3 packet switch aggregating up to 14 SSDs into a unified logical namespace with partitioned QoS domains. Use Value: Delivers 96 GBps full-duplex throughput with SECDED ECC and end-to-end parity to ensure data integrity in mission-critical storage tiers. |
| Communications Infrastructure | Multi-Host Embedded Systems |
Use Scenario: High-density packet processing blades requiring deterministic latency and concurrent traffic isolation across multiple network functions. IC Role / Device Role / Timing Role: Low-latency PCIe Gen3 switch routing traffic between FPGA accelerators, NICs, and host CPUs in telecom line cards. Use Value: Cut-through architecture and AER/ACS support enable real-time error containment and secure function isolation per tenant or service. | Use Scenario: Industrial control systems integrating heterogeneous compute modules (ARM + x86) with shared PCIe peripherals and time-sensitive I/O. IC Role / Device Role / Timing Role: Multi-root aware switch enabling independent boot and runtime management of co-located hosts sharing common storage and networking resources. Use Value: Dynamic partition reconfiguration allows runtime remapping of upstream links without firmware reload or system reset. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen3 switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Microchip Switchtec® PFX 8124 | 48-lane Gen3 switch with integrated DMA engine and SR-IOV support; lacks built-in PRBS generator and ODS | Targeted at hypervisor-managed cloud infrastructure with strong SR-IOV acceleration needs | Choose when hardware-accelerated virtualization offload outweighs on-die debug capability |
| AMD/PLX PEX8747 | 48-lane Gen3 switch with 12 ports; supports Gen2/Gen1 only; no SECDED ECC on RAM or end-to-end parity | Suitable for cost-sensitive embedded systems where RAS features are secondary to basic lane aggregation | Choose when Gen3-only operation and full RAS are not required, and legacy Gen2 compatibility suffices |
Compared with Microchip PFX 8124 and AMD/PLX PEX8747, the 89H48H12G3 uniquely combines on-die scope, PRBS testing, and SECDED ECC with multi-root partitioning - making it optimal for RAS-critical server and storage applications demanding in-system validation and fault containment.
Availability
The 89H48H12G3 is available at Aetrix Electronics and suitable for enterprise server I/O expansion, intelligent NVMe storage controller design, and communications infrastructure requiring stable component supply, long-term lifecycle assurance, and full technical documentation support.
Supply support for 89H48H12G3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology) is a U.S.-based semiconductor company specializing in high-performance timing, memory interface, RF, and PCIe interconnect solutions, now part of Renesas Electronics.
The 89H48H12G3 belongs to IDT's PCIe Gen3 switch family designed specifically for high-throughput, low-latency, RAS-enhanced system interconnect in enterprise servers, storage arrays, and communications platforms.
FAQ
What PCIe generations does the 89H48H12G3 support?
The 89H48H12G3 supports PCIe Gen3 (8.0 GT/s), Gen2 (5.0 GT/s), and Gen1 (2.5 GT/s) operation across all 48 lanes. Each SerDes lane auto-negotiates speed and width independently, ensuring backward compatibility with legacy endpoints while delivering full Gen3 bandwidth where supported. The 89H48H12G3 maintains full compliance with the PCI Express Base Specification 3.0 at all speeds.
Does the 89H48H12G3 support hot-plug functionality?
Yes, the 89H48H12G3 supports hot-plug on all downstream switch ports. It generates MSI or INTx interrupts on link up/down transitions and provides on-chip link activity and status outputs for upstream port monitoring. This enables seamless insertion and removal of PCIe devices without system reboot - a critical requirement for enterprise server and storage applications using the 89H48H12G3.
How many independent switch partitions does the 89H48H12G3 support?
The 89H48H12G3 supports up to 12 fully independent switch partitions. Each partition operates with isolated route tables, schedulers, and port arbitration logic. The 89H48H12G3 allows dynamic reconfiguration of partitions and movement of the upstream port within and between partitions - enabling flexible I/O virtualization in multi-tenant and containerized environments.
What reliability features are implemented in the 89H48H12G3?
The 89H48H12G3 implements SECDED ECC on all internal RAMs, end-to-end data path parity protection, ECRC, Advanced Error Reporting (AER) on all ports, and IEEE 1149.1/1149.6 JTAG support. These features collectively provide comprehensive fault detection, containment, and recovery - making the 89H48H12G3 suitable for mission-critical infrastructure where uptime and data integrity are mandatory.
Is an evaluation board available for the 89H48H12G3?
Yes, the 89KTPES48H12G3 Evaluation Board is officially supported for the 89H48H12G3. It includes PCIe Browser software, on-die scope (ODS) access, built-in PRBS generator and checker, and full documentation. This platform enables functional validation, SerDes tuning, and system-level integration testing of the 89H48H12G3 in real-world server and storage configurations.
89H48H12G3YCHLG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Switch Interfacing
- Interface:
- PCI Express
- Voltage - Supply:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89H48H12G3YCHLG8 FAQ
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5.How can I obtain technical support or documentation for 89H48H12G3YCHLG8?
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6.How does Aetrix verify that 89H48H12G3YCHLG8 is sourced from the original manufacturer or authorized distributors?
All 89H48H12G3YCHLG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H48H12G3YCHLG8 meets industry standards.
7.What is the process for return or replacement of 89H48H12G3YCHLG8?
All 89H48H12G3YCHLG8 units undergo pre-shipment inspection (PSI). If there is an issue with 89H48H12G3YCHLG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89H48H12G3YCHLG8 part is unused and in its original packaging.
Return procedure for 89H48H12G3YCHLG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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