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Renesas 89H48H12G3YCHLGI

Part No.:
89H48H12G3YCHLGI
Manufacturer:
Renesas
Category:
Specialized
Package:
676-BBGA, FCBGA
Datasheet:
Aetrix89H48H12G3YCHLGI.pdf
Description:
IC INTFACE SPECIALIZED 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,121

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Product details

Overview

The 89H48H12G3 from IDT is a 48-lane, 12-port PCI Express Gen3 system interconnect switch with non-blocking architecture, 8.0 GT/s SerDes, 96 GBps full-duplex switching capacity, SECDED ECC on internal RAMs, and support for up to 12 independent switch partitions - deployed in enterprise servers for PCIe lane aggregation between CPUs, storage I/O modules, and network adapters.

For engineers reviewing the 89H48H12G3 datasheet, 89H48H12G3 pinout, 89H48H12G3 application, or 89H48H12G3 equivalent, key selection considerations include Gen3 compliance, per-port AER/ACS/ARI support, autonomous link width negotiation, crosslink capability, and FCBGA-676 thermal/mechanical constraints for high-density server backplanes.

Technical Context

The 89H48H12G3 implements a cut-through switching core with DL/Transaction Layer processing across all 12 ports, supporting x8/x4/x2/x1 configurations and dynamic reconfiguration of upstream port assignment across 12 independent partitions. It integrates 48 Gen3 SerDes lanes with IEEE 1149.1/1149.6 JTAG test access and built-in PRBS generator/checker for physical layer validation.

It delivers end-to-end data path parity protection, ECRC, and Advanced Error Reporting on every port, while enabling multi-root I/O virtualization via configurable device numbering and movable upstream ports. Power management includes D0/D3hot/D3 states and ASPM with no power sequencing requirements.

Key Specifications

ParameterValue and Actual Design Meaning
PCIe GenerationGen3 compliant (8.0 GT/s), backward compatible with Gen2/Gen1
Total Lanes48 bidirectional lanes - enables flexible port mapping (e.g., six x8 or twelve x4)
Switching Capacity96 GBps full-duplex (768 Gbps) aggregate bandwidth
Port Count12 configurable ports with per-port AER, ACS, ARI, LTR, TPH, OBFF support
Partition SupportUp to 12 fully independent switch partitions with dynamic reconfiguration
Reliability FeaturesSECDED ECC on all internal RAMs; end-to-end parity; ECRC; hot-plug on all downstream ports
Package27 mm × 27 mm FCBGA with 676 balls

Pinout & Package

Packaged in a 27 mm × 27 mm fine-pitch flip-chip ball grid array (FCBGA) with 676 I/O balls. Thermal and mechanical design requires controlled PCB stack-up and thermal vias under the die area per IDT's layout guidelines.

Pin/TerminalCircuit RoleDesign Meaning
VDDA_0V9Analog 0.9 V supplySupplies analog SerDes PLL and receiver circuitry; requires low-noise filtering
VDDIO_1V8I/O 1.8 V supplyDrives PCIe-compatible differential signaling outputs and SMBus interface pins
REFCLK_P/NDifferential reference clock inputAccepts 100 MHz differential clock for SerDes synchronization; supports global/local sourcing
PERST#PCIe reset inputActive-low asynchronous reset controlling initialization sequence and configuration state machine
SMBCLK/SMBDATSMBus interfaceEnables software-based configuration and status readback without PCIe enumeration
GPI[8:0]General-purpose inputsUsed for pin-strapped configuration options (e.g., partition count, upstream port assignment)

Key Features

FeatureDesign Value
Autonomous link negotiationPer-port automatic speed/width training eliminates host firmware dependency during link bring-up
Crosslink supportEnables direct inter-switch connectivity without external PCIe switches or bridges
On-die scope (ODS)Real-time visibility into internal packet flow, credit status, and arbitration behavior for debug
Request meteringHardware-enforced traffic shaping per port to prevent starvation and ensure QoS fairness
Hot-plug on all downstream portsFull electrical and protocol-level hot-swap support per PCIe specification, including surprise removal detection

Applications

Enterprise Server I/O ExpansionMulti-Root I/O Virtualization (MR-IOV)

Use Scenario: Adding PCIe slots to dual-CPU servers via midplane cabling to SSD arrays and NICs.

IC Role / Device Role / Timing Role: System interconnect switch aggregating 48 lanes across 12 ports to route traffic between CPU root complexes and peripheral endpoints.

Use Value: Enables single-chip lane multiplication with deterministic latency (< 150 ns cut-through) and full Gen3 throughput per link.

Use Scenario: Partitioning PCIe fabric across VM domains in cloud infrastructure with isolated device assignment.

IC Role / Device Role / Timing Role: Configurable multi-root switch providing independent address spaces and upstream port mobility across 12 partitions.

Use Value: Supports live migration of PCIe devices between partitions without hardware reconfiguration or reboot.

Intelligent Storage ControllerCommunications Equipment Backplane

Use Scenario: Front-end PCIe switching in NVMe-oF storage controllers connecting host CPUs to 14 SSDs.

IC Role / Device Role / Timing Role: High-throughput packet switch with multicast and request metering to balance load across SSD lanes.

Use Value: Delivers 96 GBps aggregate bandwidth with SECDED ECC on internal buffers to prevent silent data corruption.

Use Scenario: Interconnecting line cards and control processors in carrier-grade routers using PCIe over backplane.

IC Role / Device Role / Timing Role: Robust Gen3 switch with IEEE 1149.6 AC-JTAG and lane reversal for signal integrity over long traces.

Use Value: Ensures reliable link training and diagnostics in electrically noisy environments with >30 dB insertion loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen3 switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Microchip Switchtec® PFX 812412-port Gen3 switch with integrated DMA engine and SR-IOV hypervisor support; larger 31 mm × 31 mm packageTargeted at SR-IOV-heavy workloads requiring hardware-assisted virtualization offloadChoose when DMA acceleration and SR-IOV extensions outweigh footprint and power trade-offs
AMD/PLX PEX874748-lane Gen3 switch with legacy BIOS compatibility focus; lacks crosslink and ODS featuresPreferred in legacy server platforms requiring minimal firmware changes and broad OS driver supportChoose for drop-in replacement where advanced debug and partition mobility are not required

Compared with Microchip PFX 8124 and AMD/PLX PEX8747, the 89H48H12G3 uniquely combines on-die scope visibility, crosslink topology flexibility, and 12-partition dynamic reconfiguration - making it optimal for next-gen composable infrastructure where runtime fabric adaptability is critical.

Availability

The 89H48H12G3 is available at Aetrix Electronics and suitable for enterprise server I/O expansion, intelligent storage controller designs, and communications equipment backplane interconnects requiring stable component supply and long-term lifecycle assurance.

Supply support for 89H48H12G3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, RF, and interconnect solutions for datacenter and communications infrastructure.

The 89H48H12G3 belongs to IDT's PCIe Gen3 switch family engineered for scalable, low-latency system interconnect in multi-root server and storage architectures - emphasizing configurability, RAS robustness, and debug visibility.

FAQ

What PCIe generations does the 89H48H12G3 support?

The 89H48H12G3 supports PCIe Gen3 at 8.0 GT/s natively and is fully backward compatible with Gen2 (5.0 GT/s) and Gen1 (2.5 GT/s) operation on all 12 ports. Each SerDes lane auto-negotiates speed and width independently, and the switch maintains full compliance with the PCI Express Base Specification 3.0 across all modes. The 89H48H12G3 does not support Gen4 or higher.

Does the 89H48H12G3 require external configuration EEPROM?

No, the 89H48H12G3 supports multiple initialization methods including pin strapping, SMBus, serial EEPROM, and host software (BIOS/OS/driver). External EEPROM is optional - configuration can be fully managed via the 9 GPIO pins or SMBus interface without additional components. This reduces BOM cost and simplifies bring-up for the 89H48H12G3 in space-constrained designs.

How many independent PCIe partitions does the 89H48H12G3 support?

The 89H48H12G3 supports up to 12 fully independent switch partitions, each with configurable downstream device numbering and movable upstream port assignment. Partitions can be dynamically reconfigured at runtime without resetting the entire device, enabling flexible resource allocation in composable infrastructure. This capability is intrinsic to the 89H48H12G3 architecture and documented in its partitioning register map.

What debug capabilities are built into the 89H48H12G3?

The 89H48H12G3 includes On-Die Scope (ODS) for real-time observation of internal packet routing, credit counters, and arbitration states, plus a built-in PRBS generator and checker for SerDes PHY validation. It also supports IEEE 1149.1 JTAG and 1149.6 AC-JTAG for boundary-scan testing. These features are accessible without external probes and are integral to the 89H48H12G3 silicon design.

Is hot-plug supported on all ports of the 89H48H12G3?

Yes, hot-plug is fully supported on all downstream switch ports of the 89H48H12G3 per the PCIe Base Specification 3.0, including electrical detection, link retraining, and surprise removal handling. Upstream ports do not support hot-plug. The 89H48H12G3 generates MSI or INTx interrupts on link up/down transitions and provides on-chip status outputs for monitoring.

89H48H12G3YCHLGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Applications:
Switch Interfacing
Interface:
PCI Express
Voltage - Supply:
-
Supplier Device Package:
676-FCBGA (27x27)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

89H48H12G3YCHLGI FAQ

1.How can I place an order for 89H48H12G3YCHLGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 89H48H12G3YCHLGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 89H48H12G3YCHLGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H48H12G3YCHLGI is usually 5 days.

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4.How is shipping managed for 89H48H12G3YCHLGI?

89H48H12G3YCHLGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 89H48H12G3YCHLGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 89H48H12G3YCHLGI?

For technical support, including 89H48H12G3YCHLGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H48H12G3YCHLGI requirements.

6.How does Aetrix verify that 89H48H12G3YCHLGI is sourced from the original manufacturer or authorized distributors?

All 89H48H12G3YCHLGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H48H12G3YCHLGI meets industry standards.

7.What is the process for return or replacement of 89H48H12G3YCHLGI?

All 89H48H12G3YCHLGI units undergo pre-shipment inspection (PSI). If there is an issue with 89H48H12G3YCHLGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 89H48H12G3YCHLGI part is unused and in its original packaging.

Return procedure for 89H48H12G3YCHLGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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