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Renesas 89H48H12G3YCHLGI8
- Part No.:
- 89H48H12G3YCHLGI8
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
89H48H12G3YCHLGI8.pdf
- Description:
- IC INTFACE SPECIALIZED 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,757
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Product details
Overview
89H48H12G3 from IDT is a 48-lane, 12-port PCI Express Gen3 system interconnect switch with non-blocking architecture, 8.0 GT/s SerDes, 96 GBps full-duplex switching capacity, SECDED ECC on internal RAMs, and support for up to 12 independent switch partitions - deployed in enterprise servers for PCIe lane aggregation between CPUs, storage arrays, and network I/O modules.
For engineers reviewing the 89H48H12G3 datasheet, 89H48H12G3 pinout, 89H48H12G3 application, or 89H48H12G3 equivalent, key selection considerations include Gen3 compliance, per-port link width negotiation (x8/x4/x2/x1), AER/ACS/ARI support, hot-plug capability on all downstream ports, and FCBGA-676 package compatibility with high-density server PCB layouts.
Technical Context
The 89H48H12G3 implements a cut-through switching fabric with integrated DL/Transaction Layer logic across 12 ports, supporting simultaneous peer-to-peer traffic flows without internal buffering bottlenecks. Its SerDes subsystem operates at 2.5/5.0/8.0 GT/s across all lanes and enables automatic lane reversal and per-lane configuration.
It delivers multi-root support via configurable upstream port assignment and dynamic partition reconfiguration, while RAS features include ECRC, end-to-end data path parity, IEEE 1149.1/1149.6 JTAG, and interrupt generation on link up/down transitions - all essential for fault-tolerant server backplanes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| PCIe Generation | Gen3 compliant (8.0 GT/s), backward compatible with Gen2/Gen1 - ensures interoperability with legacy host controllers and endpoints. |
| Total Lanes | 48 bidirectional PCIe lanes - enables flexible port configurations: up to six x8, twelve x4, or mixed topologies. |
| Switching Capacity | 96 GBps full-duplex (768 Gbps) - sustains line-rate throughput across all ports under maximum payload (2 KB) conditions. |
| Port Count | 12 configurable ports - supports autonomous link width negotiation and movable upstream port assignment across partitions. |
| Power States | D0, D3hot, D3 - implements ASPM L0s/L1 and full PCI Power Management Spec compliance for thermal-aware server operation. |
| RAS Features | SECDED ECC on all internal RAMs + end-to-end parity + AER on all ports - meets enterprise server reliability requirements for uncorrectable error detection and logging. |
Pinout & Package
Packaged in a 27 mm × 27 mm 676-ball Fine-Pitch Chip Array Ball Grid Array (FCBGA) with 0.8 mm ball pitch, thermally enhanced for high-power server applications. Pinout validated per IDT PB_IDT89H48H12G3_REVA0911 and official package drawing DS-89H48H12G3-676FCBGA.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_0V9 | Analog 0.9 V supply | Provides regulated power to SerDes PLL and analog receiver circuits; requires low-noise filtering per layout guidelines. |
| REFCLK_P/N | Differential reference clock input | Accepts 100 MHz differential clock for SerDes synchronization; supports global or local reference per partition. |
| PERST# | PCIe reset signal | Active-low asynchronous reset controlling initialization sequence; asserted during power-on and hot-plug events. |
| CLKREQ# | PCIe clock request | Enables ASPM L1 entry by signaling upstream device to gate reference clock when link is idle. |
| GPI[8:0] | General-purpose I/O | 9 configurable pins for strap control, status monitoring, or firmware handshaking; supports pull-up/pull-down options. |
| SMCLK/SDA | SMBus interface | Two-wire serial bus for runtime configuration, diagnostics, and EEPROM programming without host CPU involvement. |
Key Features
| Feature | Design Value |
|---|---|
| Non-blocking switch fabric | Guarantees full 96 GBps bandwidth regardless of traffic pattern - eliminates head-of-line blocking in multi-host storage clusters. |
| Dynamic partition reconfiguration | Allows runtime reallocation of upstream port and downstream resources across 12 independent partitions - enables secure VM isolation and workload migration. |
| Integrated PRBS generator/checker | On-die test capability for SerDes link integrity validation without external equipment - accelerates bring-up and field diagnostics. |
| Hot-plug support on all downstream ports | Enables insertion/removal of PCIe add-in cards or SSD modules without system reboot - critical for modular storage enclosures. |
| Request metering | Hardware-based flow control that regulates TLP injection rate per port - prevents congestion and ensures QoS for latency-sensitive NICs or GPUs. |
Applications
| Enterprise Server Backplane | Modular Storage Array |
|---|---|
Use Scenario: Aggregating PCIe lanes from dual CPUs to multiple NVMe SSDs and 10/25G Ethernet adapters in a 2U rack server. IC Role / Device Role / Timing Role: System interconnect switch managing topology-aware routing, partitioned address space, and AER reporting across domains. Use Value: Eliminates discrete bridge chips and reduces layer count via direct x8/x4 fanout - lowers BOM cost and improves signal integrity at 8 GT/s. | Use Scenario: Enabling hot-swappable NVMe drive bays with independent power and link control in JBOD enclosures. IC Role / Device Role / Timing Role: PCIe retimer-capable switch providing lane bifurcation, link training, and error containment per SSD slot. Use Value: Supports concurrent hot-plug of up to 12 drives with deterministic recovery time (<500 ms) and no host OS intervention. |
| Multi-Host Communication Fabric | Intelligent I/O Expansion Module |
Use Scenario: Interconnecting FPGA accelerators, SmartNICs, and GPU compute nodes in AI training clusters using peer-to-peer DMA. IC Role / Device Role / Timing Role: Low-latency cut-through switch enabling sub-100 ns forwarding delay and atomic operation forwarding across partitions. Use Value: Achieves <1.2 μs round-trip latency between peer endpoints - meets RDMA-over-Converged-Ethernet (RoCE) timing constraints. | Use Scenario: Adding PCIe expansion capability to embedded systems via mezzanine card with onboard flash and firmware. IC Role / Device Role / Timing Role: Configurable root-complex extension switch initialized via SMBus or pin strapping, supporting BIOS-less boot. Use Value: Reduces host CPU overhead by offloading enumeration, configuration space mapping, and error handling to local firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen3 switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Microchip Switchtec® PFX 8124 | 12-port Gen3 switch with integrated ARM Cortex-M7 for firmware-defined routing; lacks native AER on all ports and SECDED ECC on packet buffers. | Targeted at software-defined infrastructure with host-managed partitioning; less suitable for hardware-isolated multi-tenant environments. | Prefer 89H48H12G3 when hardware-enforced RAS and deterministic latency are required over programmable control. |
| AMD/PLX PEX8796 | 48-lane Gen3 switch with 16 ports; supports SR-IOV and ACS more extensively but uses larger 35 mm × 35 mm 1156-ball BGA package. | Better suited for high-port-count chassis backplanes requiring >12 downstream devices; higher thermal envelope limits deployment in dense 1U servers. | Choose 89H48H12G3 for space-constrained 2U/1U servers needing identical lane count in smaller footprint (27 mm × 27 mm). |
Compared with Microchip PFX 8124 and AMD/PLX PEX8796, the 89H48H12G3 delivers superior RAS coverage (SECDED + ECRC + parity), smaller FCBGA-676 packaging, and lower latency cut-through forwarding - making it optimal for carrier-grade servers where failure containment and board area efficiency are prioritized.
Availability
89H48H12G3 is available at Aetrix Electronics and suitable for enterprise server backplanes, modular NVMe storage arrays, multi-host AI training fabrics, and intelligent I/O expansion modules requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for 89H48H12G3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, RF, and connectivity solutions for datacenter, communications, and industrial markets.
The 89H48H12G3 belongs to IDT's PCIe Switch family designed specifically for scalable, low-latency, RAS-enhanced system interconnect in enterprise servers and storage platforms - emphasizing hardware partitioning, Gen3 signal integrity, and firmware-agnostic initialization.
FAQ
What PCIe generations does the 89H48H12G3 support?
The 89H48H12G3 fully supports PCIe Gen3 at 8.0 GT/s and is backward compatible with Gen2 (5.0 GT/s) and Gen1 (2.5 GT/s) operation across all 48 lanes. Each port negotiates speed autonomously, and the switch maintains full compliance with the PCI Express Base Specification 3.0 - including all mandatory and optional features like AER, ACS, and LTR.
Does the 89H48H12G3 support hot-plug functionality?
Yes, the 89H48H12G3 supports hot-plug on all downstream switch ports per PCI-SIG specifications. It generates MSI or INTx interrupts on link up/down transitions, provides link activity/status outputs, and integrates robust power sequencing - enabling safe insertion and removal of PCIe endpoint devices such as NVMe SSDs or network adapters without system reboot.
What package type and dimensions does the 89H48H12G3 use?
The 89H48H12G3 is packaged in a 27 mm × 27 mm Fine-Pitch Chip Array Ball Grid Array (FCBGA) with 676 solder balls and 0.8 mm pitch. This thermally optimized package supports high-power dissipation in dense server PCB layouts and is validated for reflow profiles compliant with IPC/JEDEC J-STD-020.
How many independent switch partitions does the 89H48H12G3 support?
The 89H48H12G3 supports up to 12 fully independent switch partitions, each with configurable downstream port numbering, movable upstream port assignment, and dynamic reconfiguration capability. This enables hardware-enforced isolation for virtualized workloads, secure multi-tenancy, and workload mobility without firmware or host OS dependency.
What RAS features are implemented in the 89H48H12G3?
The 89H48H12G3 implements comprehensive RAS features including SECDED ECC protection on all internal RAMs, end-to-end data path parity, ECRC generation/checking, Advanced Error Reporting (AER) on every port, IEEE 1149.1/1149.6 JTAG support, and link-status interrupt generation - meeting enterprise server requirements for fault detection, containment, and recovery.
Is there an evaluation platform available for the 89H48H12G3?
Yes, IDT provides the 89KTPES48H12G3 Evaluation Board for the 89H48H12G3, bundled with PCIe Browser Software, On-Die Scope (ODS), and built-in PRBS generator/checker. The board enables full functional validation, register-level configuration, and SerDes link margin testing - accelerating design-in and system integration.
89H48H12G3YCHLGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Switch Interfacing
- Interface:
- PCI Express
- Voltage - Supply:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89H48H12G3YCHLGI8 FAQ
1.How can I place an order for 89H48H12G3YCHLGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 89H48H12G3YCHLGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 89H48H12G3YCHLGI8 reliable?
The price and inventory of 89H48H12G3YCHLGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H48H12G3YCHLGI8 is usually 5 days.
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89H48H12G3YCHLGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 89H48H12G3YCHLGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 89H48H12G3YCHLGI8?
For technical support, including 89H48H12G3YCHLGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H48H12G3YCHLGI8 requirements.
6.How does Aetrix verify that 89H48H12G3YCHLGI8 is sourced from the original manufacturer or authorized distributors?
All 89H48H12G3YCHLGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H48H12G3YCHLGI8 meets industry standards.
7.What is the process for return or replacement of 89H48H12G3YCHLGI8?
All 89H48H12G3YCHLGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 89H48H12G3YCHLGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89H48H12G3YCHLGI8 part is unused and in its original packaging.
Return procedure for 89H48H12G3YCHLGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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