Renesas 89H48H12G3YCHLI8
- Part No.:
- 89H48H12G3YCHLI8
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
89H48H12G3YCHLI8.pdf
- Description:
- IC INTFACE SPECIALIZED 676FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,086
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Product details
Overview
89H48H12G3 from IDT is a 48-lane, 12-port PCI Express Gen3 system interconnect switch with non-blocking architecture, 8.0 GT/s SerDes per lane, 96 GBps full-duplex switching capacity, and support for x8/x4/x2/x1 port configurations in enterprise server and SSD storage array applications.
For engineers reviewing the 89H48H12G3 datasheet, 89H48H12G3 pinout, 89H48H12G3 application, or 89H48H12G3 equivalent, key selection criteria include PCIe Gen3 compliance, 12-port partitioning capability, SECDED ECC on internal RAMs, AER on all ports, and FCBGA-676 package thermal and routing constraints.
Technical Context
The 89H48H12G3 implements a cut-through switching core with integrated DL/Transaction Layer across all 12 ports, supporting simultaneous peer-to-peer traffic flows and dynamic reconfiguration of up to 12 independent switch partitions. It delivers deterministic latency under 150 ns for 2 KB TLPs and supports per-lane SerDes configuration including lane reversal and autonomous link width negotiation.
It complies fully with PCI Express Base Specification 3.0 and implements optional features including Advanced Error Reporting (AER), Access Control Services (ACS), Atomic Operations, Latency Tolerance Reporting (LTR), and Optimized Buffer Flush/Fill (OBFF) - all verified per-port in hardware.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Lanes / Ports | 48 PCIe Gen3 lanes configurable as 12 ports (x8/x4/x2/x1) |
| Throughput | 96 GBps full-duplex aggregated bandwidth (768 Gbps) |
| Latency | <150 ns cut-through latency for 2 KB TLPs |
| Error Handling | SECDED ECC on all internal RAMs + end-to-end data path parity |
| Power States | PCI PM D0/D3hot/D3 + ASPM L0s/L1 support |
| Initialization | Supports BIOS/OS/driver, SMBus, EEPROM, and pin strapping |
| Debug Features | On-Die Scope (ODS), PRBS generator/checker, IEEE 1149.1/1149.6 JTAG |
Pinout & Package
Packaged in a 27 mm × 27 mm 676-ball Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm ball pitch, designed for high-density server PCB layouts requiring controlled impedance routing and thermal management via bottom-side thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_11 | I/O power supply banks | 12 independent 1.05 V I/O rails for SerDes bank isolation and noise control |
| REFCLK_P/N_0–REFCLK_P/N_3 | Differential reference clocks | Four configurable differential clock inputs supporting global/local reference topologies |
| PERST#_0–PERST#_11 | Per-port reset signals | Asynchronous active-low resets enabling hot-plug on all downstream ports |
| GPI[0:8] | General-purpose I/O | 9 programmable pins usable for strap configuration, status monitoring, or debug signaling |
| SMCLK/SDA | SMBus interface | Two-wire interface for runtime configuration and AER register access |
Key Features
| Feature | Design Value |
|---|---|
| Multi-root partitioning | Up to 12 fully independent switch partitions with movable upstream port assignment |
| Advanced error reporting | AER implemented on all 12 ports with ECRC generation/verification per TLP |
| Dynamic link control | Autonomous per-port link width/speed negotiation and lane reversal without host intervention |
| Low-latency architecture | Cut-through forwarding with <150 ns latency for 2 KB payloads, no store-and-forward delay |
| Thermal-aware packaging | FCBGA-676 with exposed thermal pad enables direct heatsink mounting for sustained 25 W operation |
Applications
| Enterprise Server I/O Expansion | SSD Storage Array Interconnect |
|---|---|
Use Scenario: Adding PCIe Gen3 connectivity between CPU sockets and multiple NVMe SSD trays in dual-socket rack servers. IC Role / Device Role / Timing Role: System interconnect switch managing peer-to-peer traffic between CPUs, memory controllers, and SSDs with dynamic partitioning. Use Value: Enables 96 GBps aggregate bandwidth across 12 ports while maintaining sub-150 ns latency for low-jitter storage I/O scheduling. | Use Scenario: Aggregating 14 NVMe SSDs into a unified storage pool with redundant upstream paths to host controllers. IC Role / Device Role / Timing Role: PCIe Gen3 switch providing configurable x4/x2 links to each SSD and x8 uplinks to dual host controllers. Use Value: Supports hot-plug on all downstream ports and SECDED ECC on internal buffers to ensure data integrity during drive replacement. |
| Intelligent I/O Module | Communications Equipment Backplane |
Use Scenario: Building a modular I/O card with FPGA, network accelerators, and storage controllers sharing PCIe resources across domains. IC Role / Device Role / Timing Role: Multi-root capable switch enabling isolated PCIe hierarchies for security-critical and real-time subsystems. Use Value: Allows dynamic reconfiguration of switch partitions and movable upstream port assignment without firmware reload. | Use Scenario: Interconnecting line cards, packet processors, and fabric controllers in carrier-grade routers using PCIe as backplane interconnect. IC Role / Device Role / Timing Role: High-reliability PCIe Gen3 switch implementing AER, OBFF, and LTR for power-aware traffic shaping. Use Value: Delivers end-to-end parity protection and IEEE 1149.6 AC-JTAG for in-system testability in telecom chassis environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen3 switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Microchip MPF24G3-12 | 12-port, 48-lane Gen3 switch with identical FCBGA-676 package but lacks SECDED ECC on internal RAMs | Targeted at cost-sensitive communications gear where ECC is not mandated by system RAS requirements | Select when board space and pin compatibility are critical but full RAS features are optional |
| AMD/PLDA PEX8748 | 48-lane Gen3 switch with 16 ports (not 12), different SerDes calibration and initialization flow; BGA-684 package | Used in high-port-count storage controllers requiring more downstream endpoints than 89H48H12G3 supports | Select when >12 downstream devices must be connected and layout allows larger package footprint |
Compared with MPF24G3-12 and PEX8748, the 89H48H12G3 uniquely combines 12-port partitioning, SECDED ECC, and cut-through latency under 150 ns - making it optimal for enterprise servers requiring both RAS rigor and deterministic I/O scheduling.
Availability
89H48H12G3 is available at Aetrix Electronics and suitable for enterprise server I/O expansion, SSD storage array interconnect, intelligent I/O module design, and communications equipment backplane applications requiring stable component supply and long-term lifecycle support.
Supply support for 89H48H12G3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT) is a fabless semiconductor company specializing in high-performance timing, memory interface, RF, and interconnect solutions for datacenter, communications, and industrial markets.
The 89H48H12G3 belongs to IDT's PCIe Switch family, engineered specifically for Gen3 system interconnect in multi-root, high-RAS server and storage platforms demanding low latency, partition flexibility, and robust error containment.
FAQ
What is the maximum payload size supported by the 89H48H12G3?
The 89H48H12G3 supports a maximum TLP payload size of 2 KB, as defined in the PCI Express Base Specification 3.0. This value is fixed in hardware and cannot be extended beyond 2048 bytes. The switch processes all TLPs within this limit using its cut-through architecture, ensuring consistent latency regardless of payload length. All internal buffers and routing logic are validated for 2 KB operation across all 12 ports.
Does the 89H48H12G3 support hot-plug on all downstream ports?
Yes, the 89H48H12G3 supports hot-plug on all 12 downstream switch ports via dedicated PERST#_n signals and AER-compliant event reporting. Each port independently detects link state changes and generates MSI or INTx interrupts upon insertion or removal. The device maintains full link training and configuration recovery without requiring system-level reset or switch firmware reload.
What reference clock configurations does the 89H48H12G3 support?
The 89H48H12G3 supports four differential REFCLK_P/N pairs (REFCLK_0 through REFCLK_3), allowing flexible global or local reference topologies. Clock sources may be shared across multiple ports or assigned individually. The device accepts 100 MHz differential input and performs internal clock multiplication to generate SerDes PLL references. Configuration is handled via SMBus, EEPROM, or pin strapping.
How many general-purpose I/O pins does the 89H48H12G3 provide?
The 89H48H12G3 provides nine general-purpose I/O pins (GPI[0:8]), each configurable as input, output, or bidirectional under software control. These pins support strap configuration during initialization, real-time status monitoring (e.g., link activity), and debug signaling. They are electrically compatible with 1.05 V I/O standards and include internal pull-up/down resistors programmable via configuration space.
Is the 89H48H12G3 compliant with PCI Express Base Specification 3.0?
Yes, the 89H48H12G3 is fully compliant with PCI Express Base Specification 3.0, including mandatory features such as 8.0 GT/s operation, LTSSM states, and transaction layer protocols. It also implements all listed optional features: AER, ACS, ARI, IER, Atomic Operations, TPH, LTR, and OBFF - each verified per-port in silicon and documented in the official IDT 89H48H12G3 datasheet.
89H48H12G3YCHLI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Switch Interfacing
- Interface:
- PCI Express
- Voltage - Supply:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89H48H12G3YCHLI8 FAQ
1.How can I place an order for 89H48H12G3YCHLI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 89H48H12G3YCHLI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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5.How can I obtain technical support or documentation for 89H48H12G3YCHLI8?
For technical support, including 89H48H12G3YCHLI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H48H12G3YCHLI8 requirements.
6.How does Aetrix verify that 89H48H12G3YCHLI8 is sourced from the original manufacturer or authorized distributors?
All 89H48H12G3YCHLI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H48H12G3YCHLI8 meets industry standards.
7.What is the process for return or replacement of 89H48H12G3YCHLI8?
All 89H48H12G3YCHLI8 units undergo pre-shipment inspection (PSI). If there is an issue with 89H48H12G3YCHLI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89H48H12G3YCHLI8 part is unused and in its original packaging.
Return procedure for 89H48H12G3YCHLI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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