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Home > Products > Integrated Circuits (ICs) > Interface > Specialized

Renesas 89H48T12G2ZDBLGI

Name: 89H48T12G2ZDBLGI
Brand: Renesas
SKU: 89H48T12G2ZDBLGI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 89H48T12G2ZDBLGI

Manufacturer:: Renesas

Category:: Specialized

Package:: 676-BBGA, FCBGA

Datasheet:: 89H48T12G2ZDBLGI.pdf

Description:: IC INTFACE SPECIALIZED 676FCBGA

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Product details

Overview

89H48T12G2ZDBLGI from Renesas Electronics (formerly IDT) is a 48-lane, 12-port PCI Express Gen2 system interconnect switch IC designed for high-throughput, low-latency packet routing in server and storage backplanes. It delivers 384 Gbps full-duplex switching capacity, supports x4/x8 port bifurcation and merging, and implements PCIe Base Specification 2.0 compliance with Advanced Error Reporting and ECRC on all ports.

For engineers reviewing the 89H48T12G2ZDBLGI datasheet, 89H48T12G2ZDBLGI pinout, 89H48T12G2ZDBLGI application, or 89H48T12G2ZDBLGI equivalent, key selection criteria include Gen2 SerDes lane count (48), configurable port topology (6×x8 or 12×x4), cut-through latency, RAS features (SECDED ECC, end-to-end parity), and hot-plug controller integration with I²C expander support.

Technical Context

The 89H48T12G2ZDBLGI implements a layered PCIe architecture compliant with Revision 2.0, integrating SerDes, Physical, Data Link, and Transaction layers per port. Its Combined Input Output Queued (CIOQ) switch core supports eight traffic classes and one virtual channel with request metering for bandwidth balancing across ports.

It operates in store-and-forward or cut-through mode, supports autonomous link reliability for fault-tolerant operation, and uses dual SMBus interfaces-one master for EEPROM/I/O expander control and one slave for external configuration-enabling flexible initialization via pin strapping, serial EEPROM, or SMBus without external components.

Key Specifications

Parameter	Value and Actual Design Meaning
PCIe Generation	Gen2 (5.0 GT/s) with backward compatibility to Gen1 (2.5 GT/s); enables high-bandwidth I/O expansion in legacy and modern systems.
Switch Topology	48-lane, 12-port architecture supporting six x8 ports (each bifurcable to two x4) or twelve x4 ports; allows flexible fan-out for multi-host or intelligent I/O domains.
Switching Capacity	48 GBps (384 Gbps) full-duplex aggregate bandwidth; sufficient for concurrent peer-to-peer traffic in storage controllers and blade servers.
Latency Mode	Cut-through architecture with low latency; reduces end-to-end transaction delay critical for real-time storage and communications applications.
Power Supplies	Two primary rails: 1.0 V (VDDCORE, VDDPEA, VDDPETA) and 2.5 V (VDDI/O), with 3.3 V preferred for VDDI/O; eliminates power sequencing requirements.
Reference Clock	100 MHz or 125 MHz differential input (GCLKP/GCLKN); selected via GCLKFSEL pin; supports common-clock and non-common-clock modes.
RAS Features	SECDED ECC on all internal RAMs, end-to-end data path parity, AER on all ports, and autonomous link reliability; ensures system uptime in mission-critical infrastructure.

Pinout & Package

Packaged in a 27 mm × 27 mm 676-ball Flip Chip BGA with 1 mm ball pitch. Pin functions are validated per IDT 89HPES48T12G2 datasheet Rev. 1.0 (Nov 2011), including PCIe differential pairs (PE00RP/TN through PE13RP/TN), dual SMBus interfaces (MSMBCLK/DAT and SSMBCLK/DAT/ADDR), 9 GPIOs with alternate reset and interrupt functions, and dedicated SerDes reference resistor pins (REFRES[13,12,9:0], REFRESPLL).

Pin/Terminal	Circuit Role	Design Meaning
PE00RP[3:0] / PE00RN[3:0]	PCIe Port 0 Receive Differential Pair	Input lanes for upstream or downstream x4/x8 link; AC-coupled per PCIe spec; supports automatic lane reversal and width negotiation.
PE00TP[3:0] / PE00TN[3:0]	PCIe Port 0 Transmit Differential Pair	Output lanes driving PCIe-compliant 5.0 GT/s signals; configurable de-emphasis and equalization per lane via SerDes registers.
GCLKP[1:0] / GCLKN[1:0]	Differential Reference Clock Input	Provides timing reference for on-chip PLLs; frequency set to 100 MHz or 125 MHz by GCLKFSEL; supports both common- and non-common-clock topologies.
MSMBCLK / MSMBDAT	SMBus Master Interface	Controls external serial EEPROM (for configuration) and I²C I/O expander (for hot-plug signaling); requires exclusive bus master access.
GPIO[5]	General Purpose I/O (with alternate functions)	Configurable as GPEN (hot-plug event output) or P0ACTIVEN (Port 0 link active status); supports system-level presence detection and fault reporting.
PERSTN	Global Asynchronous Reset Input	Active-low signal that resets all logic blocks; assertion halts operation until deasserted, enabling controlled initialization sequence.

Key Features

Feature	Design Value
Port Configurability	Per-port link width negotiation (x8→x4→x2→x1), automatic lane reversal, and software-controlled merge of adjacent x4 ports into x8 (e.g., P01MERGEN), enabling dynamic topology adaptation.
Quality of Service	Weighted Round Robin arbitration and IDT proprietary request metering balance bandwidth across ports, preventing starvation in multi-tenant server environments.
Multicast Support	64 multicast groups with ECRC regeneration and overlay mechanism; enables efficient broadcast of posted transactions to multiple endpoints without replication overhead.
Hot-Plug Controller	Integrated controller on all downstream ports using external I²C I/O expanders; supports card/cable presence detection and GPE-driven SCI/SMI generation for OS compatibility.
Test & Debug	IEEE 1149.1 and 1149.6 JTAG support plus per-port link activity/status outputs (via I²C expander), enabling in-system validation and field diagnostics.

Applications

Enterprise Storage Backplane	Multi-Host Server Interconnect
Use Scenario: High-density JBOD or RAID controller connecting multiple SAS/SATA drives and NVMe SSDs via PCIe expansion. IC Role / Device Role / Timing Role: System interconnect switch providing non-blocking 48-lane fabric between CPU, accelerators, and storage controllers. Use Value: Enables simultaneous peer-to-peer transfers between storage devices and hosts at 384 Gbps, reducing I/O bottlenecks in scale-out architectures.	Use Scenario: Blade server chassis with multiple compute modules sharing I/O resources across a unified PCIe fabric. IC Role / Device Role / Timing Role: Centralized PCIe Gen2 switch managing cross-domain communication between host partitions and intelligent I/O modules. Use Value: Supports partitioned reset (via GPIO[0–3] as PARTxPERSTN) and autonomous link recovery, ensuring service continuity during module hot-swap events.
Communications Equipment Fabric	Embedded Intelligent I/O Hub
Use Scenario: Carrier-grade router or media gateway requiring deterministic latency and error resilience for packet forwarding engines. IC Role / Device Role / Timing Role: Low-latency cut-through switch handling PCIe-based data plane interconnect between network processors and FPGA accelerators. Use Value: Delivers sub-100 ns cut-through latency and SECDED ECC on internal buffers, meeting telecom RAS requirements for 99.999% uptime.	Use Scenario: Industrial PC or edge AI gateway aggregating PCIe peripherals (GPUs, vision cards, FPGAs) behind a single CPU root complex. IC Role / Device Role / Timing Role: Fan-out switch expanding limited CPU PCIe lanes into 12 configurable ports with hot-plug support for modular I/O. Use Value: Reduces PCB layer count via compact 27 mm BGA and eliminates need for discrete hot-plug controllers, lowering BOM cost and layout complexity.

Enterprise Storage Backplane

Multi-Host Server Interconnect

Use Scenario: High-density JBOD or RAID controller connecting multiple SAS/SATA drives and NVMe SSDs via PCIe expansion.

IC Role / Device Role / Timing Role: System interconnect switch providing non-blocking 48-lane fabric between CPU, accelerators, and storage controllers.

Use Value: Enables simultaneous peer-to-peer transfers between storage devices and hosts at 384 Gbps, reducing I/O bottlenecks in scale-out architectures.

Use Scenario: Blade server chassis with multiple compute modules sharing I/O resources across a unified PCIe fabric.

IC Role / Device Role / Timing Role: Centralized PCIe Gen2 switch managing cross-domain communication between host partitions and intelligent I/O modules.

Use Value: Supports partitioned reset (via GPIO[0–3] as PARTxPERSTN) and autonomous link recovery, ensuring service continuity during module hot-swap events.

Communications Equipment Fabric

Embedded Intelligent I/O Hub

Use Scenario: Carrier-grade router or media gateway requiring deterministic latency and error resilience for packet forwarding engines.

IC Role / Device Role / Timing Role: Low-latency cut-through switch handling PCIe-based data plane interconnect between network processors and FPGA accelerators.

Use Value: Delivers sub-100 ns cut-through latency and SECDED ECC on internal buffers, meeting telecom RAS requirements for 99.999% uptime.

Use Scenario: Industrial PC or edge AI gateway aggregating PCIe peripherals (GPUs, vision cards, FPGAs) behind a single CPU root complex.

IC Role / Device Role / Timing Role: Fan-out switch expanding limited CPU PCIe lanes into 12 configurable ports with hot-plug support for modular I/O.

Use Value: Reduces PCB layer count via compact 27 mm BGA and eliminates need for discrete hot-plug controllers, lowering BOM cost and layout complexity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PCIe Gen2 switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
89H48T12G2ZDBLGI8	Same die, identical electrical specs and pinout; differs only in tape-and-reel packaging (tray vs. reel) and RoHS compliance level (lead-free vs. lead-free with exemption).	No functional difference; suitable for identical use cases including enterprise servers and storage systems.	Select based on manufacturing line requirements-89H48T12G2ZDBLGI for tray-based SMT assembly, 89H48T12G2ZDBLGI8 for automated pick-and-place feeders.
89H48T12G2ZQBLGI	Same core functionality but packaged in 27 mm × 27 mm 676-ball FC-BGA with enhanced thermal performance (lower θJA) and extended industrial temperature range (–40°C to +85°C).	Better suited for ruggedized embedded systems operating outside commercial temperature limits, such as base station equipment or transportation gateways.	Choose 89H48T12G2ZQBLGI when ambient temperature exceeds 70°C or long-term reliability under thermal cycling is required.

Compared with 89H48T12G2ZDBLGI, the 89H48T12G2ZDBLGI8 offers identical performance in reel packaging for high-volume production, while the 89H48T12G2ZQBLGI adds industrial-grade thermal robustness-neither is pin-compatible with PCIe Gen3+ switches like the 89H100T12G2, which require different SerDes tuning and power delivery.

Availability

89H48T12G2ZDBLGI is available at Aetrix Electronics and suitable for enterprise storage backplanes, multi-host server interconnects, and communications equipment fabrics requiring stable component supply, long lifecycle support, and traceable sourcing.

Supply support for 89H48T12G2ZDBLGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics acquired Integrated Device Technology (IDT) in 2019 and now owns the PRECISE™ PCIe switch portfolio. IDT was a leader in high-performance timing, memory interface, and interconnect solutions for datacenter and communications infrastructure.

The 89H48T12G2ZDBLGI belongs to IDT's PRECISE™ family of PCIe Gen2 switching solutions, engineered specifically for high-throughput, low-latency system interconnect in servers, storage arrays, and intelligent I/O hubs where reliability and configurability are critical.

FAQ

What is the PCIe generation and lane count supported by the 89H48T12G2ZDBLGI?

The 89H48T12G2ZDBLGI is a PCI Express Gen2 switch supporting 48 serial lanes, configurable as six x8 ports or twelve x4 ports. It operates at 5.0 GT/s with full backward compatibility to Gen1 (2.5 GT/s). Each lane complies with PCIe Base Specification 2.0, and the device delivers 384 Gbps aggregate full-duplex bandwidth. Lane count and port width are dynamically negotiable per link.

Does the 89H48T12G2ZDBLGI support hot-plug functionality, and how is it implemented?

Yes, the 89H48T12G2ZDBLGI supports PCIe hot-plug on all downstream ports using an integrated controller that communicates with external I²C I/O expanders via its SMBus master interface (MSMBCLK/MSMBDAT). It provides presence detect, GPE output for SCI/SMI generation, and configurable interrupt handling via GPIO[8] (IOEXPINTN). No discrete hot-plug ASIC is required, reducing system BOM cost and complexity.

What power supply voltages does the 89H48T12G2ZDBLGI require, and are sequencing constraints applicable?

The 89H48T12G2ZDBLGI requires two main supplies: 1.0 V for VDDCORE, VDDPEA, and VDDPETA; and 2.5 V for VDDI/O (with 3.3 V preferred). It also uses VDDPEHA (2.5 V) for high-power SerDes analog circuits. Critically, the device has no power sequencing requirements-supplies may be ramped in any order-simplifying power design and improving system robustness during startup and brownout conditions.

How is configuration and initialization handled for the 89H48T12G2ZDBLGI?

The 89H48T12G2ZDBLGI supports three initialization methods: Root Complex (BIOS/OS/driver), serial EEPROM (via SMBus master), or SMBus slave interface. Common configurations are enabled via static SWMODE[3:0] pin strapping, eliminating external components. In-system programming of the serial EEPROM is supported, allowing field-upgradable configuration without hardware modification.

What RAS (Reliability, Availability, Serviceability) features are integrated into the 89H48T12G2ZDBLGI?

The 89H48T12G2ZDBLGI includes SECDED ECC protection on all internal RAMs, end-to-end data path parity, Advanced Error Reporting (AER) on every port, ECRC regeneration for multicast, and autonomous link reliability that maintains system operation despite faulty links. These features collectively meet carrier-grade and enterprise storage requirements for fault containment, error detection, and graceful degradation.

89H48T12G2ZDBLGI Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 676-BBGA, FCBGA

Packaging:: Tray

Product Status:: Obsolete

Applications:: Switch Interfacing

Interface:: PCI Express

Voltage - Supply:: 3.3V

Supplier Device Package:: 676-FCBGA (27x27)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

89H48T12G2ZDBLGI FAQ

1.How can I place an order for 89H48T12G2ZDBLGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 89H48T12G2ZDBLGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 89H48T12G2ZDBLGI reliable?

The price and inventory of 89H48T12G2ZDBLGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H48T12G2ZDBLGI is usually 5 days.

3.What payment methods are accepted for 89H48T12G2ZDBLGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 89H48T12G2ZDBLGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 89H48T12G2ZDBLGI?

89H48T12G2ZDBLGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 89H48T12G2ZDBLGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 89H48T12G2ZDBLGI?

For technical support, including 89H48T12G2ZDBLGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H48T12G2ZDBLGI requirements.

6.How does Aetrix verify that 89H48T12G2ZDBLGI is sourced from the original manufacturer or authorized distributors?

All 89H48T12G2ZDBLGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H48T12G2ZDBLGI meets industry standards.

7.What is the process for return or replacement of 89H48T12G2ZDBLGI?

All 89H48T12G2ZDBLGI units undergo pre-shipment inspection (PSI). If there is an issue with 89H48T12G2ZDBLGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 89H48T12G2ZDBLGI part is unused and in its original packaging.

Return procedure for 89H48T12G2ZDBLGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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