Renesas 89H48T12G2ZDBLI
- Part No.:
- 89H48T12G2ZDBLI
- Manufacturer:
- Renesas
- Category:
- Specialized
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
89H48T12G2ZDBLI.pdf
- Description:
- IC INTFACE SPECIALIZED 676FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
89H48T12G2ZDBLI from IDT is a 48-lane, 12-port PCI Express Gen2 system interconnect switch IC designed for high-throughput, low-latency packet routing in server and storage backplanes. It delivers 384 Gbps full-duplex switching capacity, supports x4/x8 port configurations with lane merging, and implements PCIe Base Specification 2.0 compliance with Advanced Error Reporting and ECRC on all ports.
For engineers reviewing the 89H48T12G2ZDBLI datasheet, 89H48T12G2ZDBLI pinout, 89H48T12G2ZDBLI application, or 89H48T12G2ZDBLI equivalent, key selection criteria include its cut-through latency architecture, 128-byte to 2-KB payload support, per-port ASPM control, SECDED ECC on internal RAMs, and flexible initialization via SMBus or serial EEPROM - critical for PCIe fabric scalability and RAS-critical deployments.
Technical Context
The 89H48T12G2ZDBLI implements a layered PCIe 2.0 stack (Physical, Data Link, Transaction) with integrated SerDes supporting 2.5 GT/s and 5.0 GT/s operation. Its Combined Input Output Queued (CIOQ) switch core enables concurrent peer-to-peer traffic flows across 12 ports while maintaining eight traffic classes and one virtual channel for QoS enforcement.
Port configuration is hardware- and software-controlled: merge pins (e.g., P01MERGEN) enable x8 port formation from adjacent x4 lanes, and autonomous link width negotiation (x8 → x4 → x2 → x1) operates alongside configurable L0s/L1 timers, de-emphasis, and receive equalization per SerDes lane - all managed via SMBus master interface or register writes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| PCIe Generation | Gen2 (5.0 GT/s), backward-compatible with Gen1 (2.5 GT/s) |
| Switch Capacity | 48 GBps (384 Gbps) full-duplex aggregate bandwidth |
| Port Count & Topology | 12 ports: six x8-capable ports, each bifurcable into two x4 ports (total 12 x4) |
| Latency Architecture | Cut-through mode minimizes packet forwarding delay vs store-and-forward |
| QoS Support | Eight traffic classes (TCs) and one virtual channel (VC) with weighted round-robin arbitration |
| RAS Features | SECDED ECC on all internal RAMs; end-to-end data path parity; AER and ECRC on all ports |
| Power Supplies | 1.0 V (VDDCORE, VDDPEA, VDDPETA), 2.5 V (VDDI/O), 2.5 V (VDDPEHA); no sequencing required |
Pinout & Package
Package: 27 mm × 27 mm 676-ball Flip Chip BGA with 1.0 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PE00RP[3:0]/PE00RN[3:0] | PCIe Port 0 Receive Differential Pair | Lane 0–3 input for upstream or downstream x4/x8 port; AC-coupled, common-mode referenced to ground |
| PE00TP[3:0]/PE00TN[3:0] | PCIe Port 0 Transmit Differential Pair | Lane 0–3 output; supports de-emphasis tuning and drive strength configuration per lane |
| GCLKP[1:0]/GCLKN[1:0] | Differential Reference Clock Input | 100 MHz or 125 MHz global clock source for PLLs; selected by GCLKFSEL pin |
| MSMBCLK/MSMBDAT | SMBus Master Interface | Controls external serial EEPROM and hot-plug I/O expander; single-master only, no arbitration |
| GPIO[0]–GPIO[8] | General Purpose I/O | Configurable as input/output; alternate functions include partition reset (PART0PERSTN) and hot-plug interrupt (IOEXPINTN) |
| P01MERGEN–P1213MERGEN | Port Merge Control | Active-low signals enabling x8 port formation (e.g., P01MERGEN merges Port 0 + Port 1) |
Key Features
| Feature | Design Value |
|---|---|
| Autonomous Link Negotiation | Per-port dynamic width/speed adaptation (x8→x4→x2→x1) without host intervention |
| Request Metering | IDT proprietary bandwidth balancing algorithm prevents port starvation under asymmetric traffic loads |
| Hot-Plug Controller | Full hot-plug support on all downstream ports using low-cost I²C I/O expanders and GPE interrupt signaling |
| Flexible Initialization | Pin-strapped switch mode (SWMODE[3:0]), SMBus EEPROM load, or BIOS/OS driver configuration - no external components needed |
| Low-Power SerDes | Per-lane power gating: unused lanes enter low-power state; SerDes disabled in D3hot |
Applications
| Enterprise Server Backplane | Modular Storage Enclosure |
|---|---|
Use Scenario: High-density blade servers requiring non-blocking PCIe connectivity between CPU, accelerators, and NVMe drives. IC Role / Device Role / Timing Role: System interconnect switch managing peer-to-peer traffic between multiple root complexes and endpoints. Use Value: 48 GBps aggregate bandwidth and cut-through latency enable sub-500 ns forwarding for RDMA and GPUDirect workflows. |
Use Scenario: JBOD enclosures with mixed SAS/SATA/NVMe drives needing scalable I/O expansion behind a single host controller. IC Role / Device Role / Timing Role: PCIe fan-out switch providing independent x4 links to up to 12 drive bays with hot-swap capability. Use Value: Integrated hot-plug logic and IOEXPINTN GPIO reduce external component count while supporting legacy OS SCI/SMI notifications. |
| Communications Router Line Card | Intelligent I/O Expansion Module |
Use Scenario: Carrier-grade routers with distributed processing where line cards require deterministic PCIe interconnect to control-plane processors. IC Role / Device Role / Timing Role: Low-latency, multi-domain PCIe bridge enabling inter-partition communication with RAS features. Use Value: SECDED ECC on frame buffers and end-to-end parity ensure bit-error resilience in 24/7 telecom environments. |
Use Scenario: Embedded systems using PCIe-based mezzanine modules (e.g., FPGA accelerators, video capture cards) in space-constrained industrial PCs. IC Role / Device Role / Timing Role: Configurable fan-out switch supporting x4 or x8 endpoint attachment with software-managed lane reversal. Use Value: Pin-strapped SWMODE and merge controls allow fixed-function deployment without firmware overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PCIe Gen2 switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 89H48T12G2ZDBLIT | Same die, tape-and-reel packaging variant; identical electrical and thermal specs | No functional difference; used for automated SMT assembly vs tray-pack 89H48T12G2ZDBLI | Select based on production line requirements - both share identical qualification and reliability data. |
| 89H48T12G2ZQBLI | Same architecture but in 27 mm × 27 mm 676-pin PBGA (plastic BGA) instead of Flip Chip BGA | Higher thermal resistance and lower signal integrity margin; not recommended for >5 GT/s sustained operation | Consider only if Flip Chip BGA assembly infrastructure is unavailable; verify board-level SI/PI with IBIS models. |
Compared with 89H48T12G2ZDBLI, the ZDBLIT variant offers identical performance in tape-and-reel form for high-volume SMT, while the ZQBLI PBGA alternative trades signal integrity and thermal performance for lower assembly cost - making 89H48T12G2ZDBLI the preferred choice for Gen2-compliant, high-reliability backplane designs.
Availability
89H48T12G2ZDBLI is available at Aetrix Electronics and suitable for enterprise server backplanes, modular storage enclosures, and communications line cards requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial and telecom deployments.
Supply support for 89H48T12G2ZDBLI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology, Inc.) is a fabless semiconductor company specializing in high-performance timing, memory interface, and interconnect solutions, now part of Renesas Electronics since 2019.
The 89H48T12G2ZDBLI belongs to IDT's PRECISE™ family of PCIe switching solutions, engineered specifically for high-throughput, low-latency, RAS-enhanced system interconnects in servers, storage, and intelligent I/O subsystems.
FAQ
What PCIe specification versions does the 89H48T12G2ZDBLI support?
The 89H48T12G2ZDBLI is fully compliant with PCI Express Base Specification Revision 2.0 and supports both Gen1 (2.5 GT/s) and Gen2 (5.0 GT/s) operation. It does not support Gen3 or later. All ports implement mandatory and optional features defined in the spec, including Advanced Error Reporting (AER), End-to-End CRC (ECRC), Access Control Services (ACS), and Power Budgeting Capability - verified per IDT's official qualification test reports.
Does the 89H48T12G2ZDBLI support hot-plug functionality on all ports?
Yes, the 89H48T12G2ZDBLI supports hot-plug on all downstream switch ports using an external I²C I/O expander connected via its SMBus master interface. The device provides dedicated GPIO pins (e.g., IOEXPINTN) for hot-plug event notification and generates SCI/SMI interrupts for legacy OS compatibility. Upstream port hot-plug is not supported per design - only downstream ports are enabled for full hot-plug insertion/removal sequences.
What is the role of the P01MERGEN pin on the 89H48T12G2ZDBLI?
The P01MERGEN pin on the 89H48T12G2ZDBLI is an active-low control signal that, when asserted, merges PCIe Port 0 and Port 1 into a single x8 logical port. When de-asserted, Ports 0 and 1 operate independently as x4 ports. This merge function is hardware-configured and affects SerDes lane mapping: Port 1's lanes become lanes 4–7 of Port 0. Internal pull-down ensures default x4 operation unless externally pulled high.
How is the reference clock frequency selected for the 89H48T12G2ZDBLI?
The 89H48T12G2ZDBLI selects its reference clock frequency via the GCLKFSEL pin: logic '0' configures the device for 100 MHz operation, and logic '1' selects 125 MHz. This setting determines the input frequency applied to the GCLKP/GCLKN differential pair and directly impacts PLL lock behavior and SerDes calibration. Both frequencies are fully supported per PCIe 2.0 timing requirements and validated in IDT's production test flow.
Can the 89H48T12G2ZDBLI operate in cut-through mode only, or is store-and-forward also available?
The 89H48T12G2ZDBLI supports both cut-through and store-and-forward switching modes, selectable via configuration registers. Cut-through mode reduces latency by forwarding packets before full reception, while store-and-forward ensures complete packet integrity checking (CRC, ECRC) prior to egress. Default power-on behavior is cut-through; store-and-forward must be explicitly enabled and is typically used in RAS-critical applications where error detection takes priority over latency.
89H48T12G2ZDBLI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Applications:
- Switch Interfacing
- Interface:
- PCI Express
- Voltage - Supply:
- 3.3V
- Supplier Device Package:
- 676-FCBGA (27x27)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
89H48T12G2ZDBLI FAQ
1.How can I place an order for 89H48T12G2ZDBLI through Aetrix?
Please submit a Request for Quotation (RFQ) for 89H48T12G2ZDBLI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 89H48T12G2ZDBLI reliable?
The price and inventory of 89H48T12G2ZDBLI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 89H48T12G2ZDBLI is usually 5 days.
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89H48T12G2ZDBLI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 89H48T12G2ZDBLI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 89H48T12G2ZDBLI?
For technical support, including 89H48T12G2ZDBLI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 89H48T12G2ZDBLI requirements.
6.How does Aetrix verify that 89H48T12G2ZDBLI is sourced from the original manufacturer or authorized distributors?
All 89H48T12G2ZDBLI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 89H48T12G2ZDBLI meets industry standards.
7.What is the process for return or replacement of 89H48T12G2ZDBLI?
All 89H48T12G2ZDBLI units undergo pre-shipment inspection (PSI). If there is an issue with 89H48T12G2ZDBLI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 89H48T12G2ZDBLI part is unused and in its original packaging.
Return procedure for 89H48T12G2ZDBLI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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